Abstract: An energy dissipation device includes an inner tube, a core tube, an outer tube and a fixing member. The inner tube includes a first protruding structure. The core tube includes a second protruding structure, and the core tube is sleeved outside the inner tube. The outer tube is sleeved outside the core tube. The fixing member is connected to the inner tube, the core tube and the outer tube.

Abstract: A method of bioimpedance technology to evaluate local or whole body bone mineral density includes the steps of (a) measuring the resistance and reactance of a subject by a bioimpedance measuring instrument and obtaining the height of the subject, and (b) calculating the bone mineral density of the local or whole body of the subject by the formula: BMD=a+b R/H+d Xc/H, where a, b, and d are weighting coefficients, R is the resistance of the subject; Xc is the reactance of the subject; H is the height of the subject. This can achieve the advantages of reducing measurement costs and rapid measurement.

Abstract: Devices, methods, and systems for translating building automation events into mobile notifications are described herein. One device includes a memory, and a processor configured to execute executable instructions stored in the memory to receive a notification of an event from a building automation system, translate the event into a mobile notification of the event, and transmit the mobile notification of the event to a mobile device.

Abstract: The present disclosure provides a lithography system. The lithography system includes an exposing module configured to perform a lithography exposing process using a mask secured on a mask stage; and a cleaning module integrated in the exposing module and designed to clean at least one of the mask and the mask stage using an attraction mechanism.

Abstract: A solar control film with improved moisture resistance function is provided. The solar control film includes a flexible substrate, at least one infrared-reflective composite layer and an outer dielectric layer. The infrared-reflective composite layer includes a dielectric sublayer and a metal sublayer. The dielectric sublayer is disposed on the flexible substrate, and the material of the dielectric sublayer includes TiO2. The metal sublayer is disposed on the dielectric sublayer, and includes 8.3-16.4 atomic % Ag, 0.5-1.0 atomic % Ti, 81.0-90.9 atomic % N, and 0.3-0.6 atomic % noble metal, and the noble metal is Au, Pd or any combinations thereof. The outer dielectric layer is disposed on the infrared-reflective composite layer, and the material of the outer dielectric layer includes TiO2. In this way, the provided solar control film can effectively suppress of forming white spots without significantly sacrificing its original function and characteristics.

Abstract: An exhaust structure includes an intake section which includes an inlet, an output section which includes an outlet, and a piping section coupled to the intake section and the output section at a section interface. The piping section includes a first inner diameter from the intake section to the output section, wherein one of the intake section or the output section has a second inner diameter at the section interface. The second inner diameter includes a same value as a value of the first inner diameter. A plurality of smoothing layers are configured to resist turbulence and condensation produced by a flow of one or more gasses in the intake section, the output section, and the piping section.

Abstract: A light-emitting diode is provided. The light-emitting diode includes a P-type semiconductor layer, a N-type semiconductor layer, and a light-emitting stack located therebetween. The light-emitting stack includes a plurality of well layers and a plurality of barrier layers that are alternately stacked, the well layers includes at least one first well layer, at least one second well layer, and third well layers that have different indium concentrations. The first well layer has the largest indium concentration, and the third well layers have the smallest indium concentration. Three of well layers that are closest to the P-type semiconductor layer are the third well layers, and the first well layer is closer to the N-type semiconductor layer than the P-type semiconductor layer.

Abstract: A solar control film with improved moisture resistance function is provided. The solar control film includes a flexible substrate, at least one infrared-reflective composite layer and an outer dielectric layer. The infrared-reflective composite layer includes a dielectric sublayer and a metal sublayer. The dielectric sublayer is disposed on the flexible substrate, and the material of the dielectric sublayer includes TiO2. The metal sublayer is disposed on the dielectric sublayer, and includes 8.3-16.4 atomic % Ag, 0.5-1.0 atomic % Ti, 81.0-90.9 atomic % N, and 0.3-0.6 atomic % noble metal, and the noble metal is Au, Pd or any combinations thereof. The outer dielectric layer is disposed on the infrared-reflective composite layer, and the material of the outer dielectric layer includes TiO2. In this way, the provided solar control film can effectively suppress of forming white spots without significantly sacrificing its original function and characteristics.

Abstract: A light emitting apparatus includes a housing, a connector, a light source, a control module board, and an antenna. The housing includes an inner space. The light source is located in the inner space. The control module board is located in the connector, wherein an accommodation space is formed by the housing and the control module board. The antenna is located in the accommodation space.

Abstract: Devices, methods, and systems for hands free facility status alerts are described herein. One system includes a computing device for hands free building automation notifications, comprising a memory and a processor to execute executable instructions stored in the memory to: receive a notification of an event from a building automation system, modify the notification to include only pre-defined attributes of the notification that are displayable on a user interface of a wearable device, and transmit the modified notification to the wearable device.

Abstract: A wireless access point device includes a main frame, a transmission assembly, an antenna module and a fixing assembly. The main frame includes a casing and a first connection portion connected to the casing. The transmission assembly is disposed in an internal space of the casing and provided with a signal transceiving element. The antenna module includes a waveguide, a second connection portion and a positioning recess. The second connection portion is disposed on the waveguide and detachably connected to the first connection portion to be coupled to the signal transceiving element. The positioning recess is formed on the second connection portion. The fixing assembly is movably disposed on the first connection portion. The antenna module is thereby fixed on the casing, when the second connection portion and the first connection portion are fixed through the fixing assembly removably inserting into the positioning recess.

Abstract: Devices, methods, and systems for hands free facility status alerts are described herein. One system includes a computing device for hands free building automation notifications, comprising a memory and a processor to execute executable instructions stored in the memory to: receive a notification of an event from a building automation system, modify the notification to include only pre-defined attributes of the notification that are displayable on a user interface of a wearable device, and transmit the modified notification to the wearable device.

Abstract: A light-emitting diode is provided. The light-emitting diode includes a multiple quantum well structure to generate a light beam with a broadband blue spectrum. The light beam contains a first sub-light beam with a first wavelength and a second sub-light beam with a second wavelength. A difference between the first wavelength and the second wavelength ranges from 1 nm to 50 nm, and the light-emitting diode has a Wall-Plug-Efficiency (WPE) of greater than 0.45 under an operating current density of 120 mA/mm2.

Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

Abstract: A wireless access point device includes a main frame, a transmission assembly, an antenna module and a fixing assembly. The main frame includes a casing and a first connection portion connected to the casing. The transmission assembly is disposed in an internal space of the casing and provided with a signal transceiving element. The antenna module includes a waveguide, a second connection portion and a positioning recess. The second connection portion is disposed on the waveguide and detachably connected to the first connection portion to be coupled to the signal transceiving element. The positioning recess is formed on the second connection portion. The fixing assembly is movably disposed on the first connection portion. The antenna module is thereby fixed on the casing, when the second connection portion and the first connection portion are fixed through the fixing assembly removably inserting into the positioning recess.

Abstract: A method of fabricating a fin-like field-effect transistor device is disclosed. The method includes forming mandrel features over a substrate and performing a first cut to remove mandrel features to form a first space. The method also includes performing a second cut to remove a portion of mandrel features to form a line-end and an end-to-end space. After the first and the second cuts, the substrate is etched using the mandrel features, with the first space and the end-to-end space as an etch mask, to form fins. Depositing a space layer to fully fill in a space between adjacent fins and cover sidewalls of the fins adjacent to the first space and the end-to-end space. The spacer layer is etched to form sidewall spacers on the fins adjacent to the first space and the end-to-end space and an isolation trench is formed in the first space and the end-to-end space.

Abstract: In some embodiments, a method for forming an integrated circuit is provided. The method includes forming a first layer over a semiconductor wafer, the first layer having a first portion and a second portion. The first portion is patterned by projecting a first image field over the first portion of the first layer, where the first portion of the first layer corresponds to the first image field. The second portion is patterned by projecting a second image field over the second portion of the first layer, where the second portion of the first layer corresponds to the second image field. A second layer is formed over the first layer. The second layer is patterned by projecting a third image field over the second layer, where the third image field covers a majority of the first portion and a majority of the second portion of the first layer.

Abstract: A light-emitting diode is provided. The light-emitting diode includes a multiple quantum well structure to generate a light beam with a broadband blue spectrum. The light beam contains a first sub-light beam with a first wavelength and a second sub-light beam with a second wavelength. A difference between the first wavelength and the second wavelength ranges from 1 nm to 50 nm, and the light-emitting diode has a Wall-Plug-Efficiency (WPE) of greater than 0.45 under an operating current density of 120 mA/mm2.

Abstract: A wireless access point device includes a main frame, an antenna module, a signal transceiving element, an unlocking assembly and a fastener. The main frame includes a casing and a first connection portion formed with a fastening recess, connected to the casing and communicates with the internal space. The signal transceiving element is located in the casing. The antenna module includes a waveguide and a second connection portion disposed on one end of the waveguide. The second connection portion is detachably connected to the first connection portion to couple to the signal transceiving element. The unlocking assembly is movably located in the fastening recess. The fastener includes a buckle, and an elastic member that is connected to the second connection portion and the buckle. The antenna module is fixed on the main frame when the buckle is inserted into the fastening recess.

Abstract: A light-emitting device and a manufacturing method thereof are provided. The light-emitting device includes a substrate, an epitaxial blocking layer, and a light-emitting epitaxial structure. The substrate has a surface, in which the surface includes a plurality of protruding parts and a plurality of recess parts relative to the protruding parts. The epitaxial blocking layer disposed on the substrate covers the recess parts and exposes the protruding parts. The light-emitting epitaxial structure disposed on the substrate is connected to the protruding parts and is disposed above the recess parts. The light-emitting epitaxial structure is formed by using the protruding parts as a growth surface thereof so as to have a better crystalline quality.