Patents by Inventor Chang-Lin Yeh
Chang-Lin Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11437415Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.Type: GrantFiled: August 30, 2019Date of Patent: September 6, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I. Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Patent number: 11410899Abstract: A semiconductor package device includes a first substrate, a second substrate and a first spacer. The first substrate includes a first divided pad. The second substrate includes a second divided pad disposed above the first divided pad. The first spacer is disposed between the first divided pad and the second divided pad. The first spacer is in contact with the first divided pad and the second divided pad.Type: GrantFiled: January 23, 2020Date of Patent: August 9, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi Chen, Chang-Lin Yeh, Jen-Chieh Kao
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Publication number: 20220223489Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: ApplicationFiled: March 29, 2022Publication date: July 14, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Sheng-Yu CHEN, Chang-Lin YEH, Ming-Hung CHEN
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Publication number: 20220141971Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: ApplicationFiled: January 11, 2022Publication date: May 5, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Publication number: 20220102453Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: ApplicationFiled: December 13, 2021Publication date: March 31, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Sheng-Yu CHEN, Chang-Lin YEH, Yung-I YEH
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Patent number: 11289394Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: GrantFiled: December 23, 2019Date of Patent: March 29, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Sheng-Yu Chen, Chang-Lin Yeh, Ming-Hung Chen
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Publication number: 20220013443Abstract: A semiconductor device package includes a first substrate, a second substrate, a conductive structure, a first solder and a second solder. The second substrate is disposed over the first substrate. The conductive structure is disposed between the first substrate and the second substrate. The conductive structure includes a first wetting portion, a second wetting portion, and a non-wetting portion disposed between the first wetting portion and the second wetting portion. The first solder covers the first wetting portion and connects the conductive structure to the first substrate. The second solder covers the second wetting portion and connects the conductive structure to the second substrate. The first solder is spaced apart from the second solder by the non-wetting portion.Type: ApplicationFiled: September 27, 2021Publication date: January 13, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Chang-Lin YEH
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Patent number: 11222792Abstract: In one or more embodiments, a semiconductor package device includes a substrate, a trace, a structure, a barrier element and an underfill. The substrate has a first surface including a filling region surrounded by the trace. The structure is disposed over the filling region and electrically connected to the substrate. The barrier element is disposed on the trace. The underfill is disposed on the filling region.Type: GrantFiled: April 2, 2020Date of Patent: January 11, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Chang-Lin Yeh
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Patent number: 11224132Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: GrantFiled: September 6, 2019Date of Patent: January 11, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I. Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Patent number: 11211302Abstract: A semiconductor device package comprises a carrier, a stop layer, a barrier layer and an encapsulant. The carrier has a first surface and a second surface recessed with respect to the first surface. The stop layer is disposed on the second surface of the carrier. The barrier layer is disposed on the stop layer and protruded from the first surface of the carrier. The encapsulant is disposed on the first surface of the carrier. Further, the encapsulant has a side surface disposed on the barrier layer.Type: GrantFiled: October 17, 2019Date of Patent: December 28, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Chang-Lin Yeh
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Patent number: 11201200Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: GrantFiled: August 23, 2019Date of Patent: December 14, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh, Yung-I Yeh
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Patent number: 11133244Abstract: A semiconductor device package includes a first substrate, a second substrate, a conductive structure, a first solder and a second solder. The second substrate is disposed over the first substrate. The conductive structure is disposed between the first substrate and the second substrate. The conductive structure includes a first wetting portion, a second wetting portion, and a non-wetting portion disposed between the first wetting portion and the second wetting portion. The first solder covers the first wetting portion and connects the conductive structure to the first substrate. The second solder covers the second wetting portion and connects the conductive structure to the second substrate. The first solder is spaced apart from the second solder by the non-wetting portion.Type: GrantFiled: June 19, 2019Date of Patent: September 28, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Chang-Lin Yeh
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Patent number: 11081473Abstract: A semiconductor device package includes a first substrate, a dielectric layer, a thin film transistor (TFT) and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The dielectric layer is disposed on the first surface of the first substrate. The dielectric layer has a first surface facing away from the first substrate and a second surface opposite to the first surface. The TFT layer is disposed on the dielectric layer. The electronic component is disposed on the second surface of the first substrate. A roughness of the first surface of the dielectric layer is less than a roughness of the first surface of the first substrate.Type: GrantFiled: August 23, 2019Date of Patent: August 3, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh, Yung-I Yeh
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Publication number: 20210193545Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: ApplicationFiled: December 23, 2019Publication date: June 24, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Sheng-Yu CHEN, Chang-Lin YEH, Ming-Hung CHEN
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Patent number: 10991656Abstract: A semiconductor device package includes a first substrate, a second substrate disposed over the first substrate, and a surface mount device (SMD) component disposed between the first substrate and the second substrate. The SMD component includes a plurality of connection electrodes electrically connecting the first substrate to the second substrate, and the plurality of connection electrodes are electrically disconnected from each other.Type: GrantFiled: June 19, 2019Date of Patent: April 27, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chang-Lin Yeh, Jen-Chieh Kao
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Publication number: 20210118760Abstract: A semiconductor device package comprises a carrier, a stop layer, a barrier layer and an encapsulant. The carrier has a first surface and a second surface recessed with respect to the first surface. The stop layer is disposed on the second surface of the carrier. The barrier layer is disposed on the stop layer and protruded from the first surface of the carrier. The encapsulant is disposed on the first surface of the carrier. Further, the encapsulant has a side surface disposed on the barrier layer.Type: ApplicationFiled: October 17, 2019Publication date: April 22, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Chang-Lin YEH
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Publication number: 20210090982Abstract: A semiconductor device package includes a substrate, a first solder paste, an electrical contact and a first encapsulant. The substrate includes a conductive pad. The first solder paste is disposed on the pad. The electrical contact is disposed on the first solder paste. The first encapsulant encapsulates a portion of the electrical contact and exposes the surface of the electrical contact. The electrical contact has a surface facing away from the substrate. A melting point of the electrical contact is greater than that of the first solder paste. The first encapsulant includes a first surface facing toward the substrate and a second surface opposite to the first surface. The second surface of the first encapsulant is exposed to air.Type: ApplicationFiled: December 8, 2020Publication date: March 25, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang-Lin YEH, Yu-Chang CHEN
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Publication number: 20210076510Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: ApplicationFiled: September 6, 2019Publication date: March 11, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Publication number: 20210066354Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.Type: ApplicationFiled: August 30, 2019Publication date: March 4, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Publication number: 20210057398Abstract: A semiconductor device package includes a first substrate, a dielectric layer, a thin film transistor (TFT) and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The dielectric layer is disposed on the first surface of the first substrate. The dielectric layer has a first surface facing away from the first substrate and a second surface opposite to the first surface. The TFT layer is disposed on the dielectric layer. The electronic component is disposed on the second surface of the first substrate. A roughness of the first surface of the dielectric layer is less than a roughness of the first surface of the first substrate.Type: ApplicationFiled: August 23, 2019Publication date: February 25, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Sheng-Yu CHEN, Chang-Lin YEH, Yung-I YEH