Abstract: A light emitting chip including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, a first bonding layer interposed between the first and second LED sub-units, a second bonding layer interposed between second and third LED sub-units, and a first connection electrode electrically connected to and overlapping at least one of the first, second, and third LED sub-units, the first connection electrode having first and second opposing side surfaces, the first side surface having a first length and the second side surface having a second length, in which the difference in length between the first side surface and the second side surface of the first connection electrode is greater than a thickness of at least one of the LED sub-units.

Abstract: Provided are a package structure and a method of forming the same. The method includes providing a first package having a plurality of first dies and a plurality of second dies therein; performing a first sawing process to cut the first package into a plurality of second packages, wherein one of the plurality of second packages comprises three first dies and one second die; and performing a second sawing process to remove the second die of the one of the plurality of second packages, so that a cut second package is formed into a polygonal structure with the number of nodes greater than or equal to 5.

Abstract: The present invention relates to a refrigerator, and particularly, to a refrigerator characterized by comprising: a main body which includes an outer casing and an inner casing, wherein the outer casing has an opening formed in a back panel thereof, and the inner casing is provided within the outer casing and provides, in an upper part thereof, an ice-making compartment and a refrigerator compartment, and a freezer compartment in a lower part thereof; an evaporator casing which is provided between the outer casing and the inner casing and forms an installation space in communication with the ice-making compartment and the opening; an evaporator which is installed in the installation space via the opening and provides cold air to the ice-making compartment; and an insulating cover which opens and closes the opening. Accordingly, the evaporator can be installed from the outside of the back panel of the main body, thus allowing the installation space of the evaporator casing to remain securely sealed.

Abstract: A printed circuit board includes a first substrate portion including a plurality of first insulating layers, a plurality of first wiring layers respectively disposed on the plurality of first insulating layers, and a plurality of first adhesive layers respectively disposed between the plurality of first insulating layers to respectively cover the plurality of first wiring layers; and a second substrate portion disposed on the first substrate portion, and including a plurality of second insulating layers, a plurality of second wiring layers respectively disposed on the plurality of second insulating layers, and a plurality of second adhesive layers respectively disposed between the plurality of second insulating layers to respectively cover the plurality of second wiring layers.

Abstract: A method of reinforcement learning of a neural network device for generating a verification vector for verifying a circuit design comprising a circuit block includes inputting a test vector to the circuit block, generating one or more rewards based on a coverage corresponding to the test vector, the coverage being determined based on a state transition of the circuit block based on the test vector, and applying the one or more rewards to a reinforcement learning.

Abstract: An integrated circuit device includes a lower electrode, an upper electrode, and a dielectric layer structure between the lower electrode and the upper electrode, the dielectric layer structure including a first surface facing the lower electrode and a second surface facing the upper electrode. The dielectric layer structure includes a first dielectric layer including a first dielectric material and a plurality of grains extending from the first surface to the second surface and a second dielectric layer including a second dielectric material and surrounding a portion of a sidewall of each of the plurality of grains of the first dielectric layer in a level lower than the second surface. The second dielectric material includes a material having bandgap energy which is higher than bandgap energy of the first dielectric material.

Abstract: An airbag maintains deployment performance of an airbag cushion installed in a structure for dividing an occupant compartment space. The airbag includes an airbag cushion that includes a plurality of deployment areas and a spacing part that is disposed at a position adjacent to the plurality of deployment areas and separates the plurality of deployment area from one another.

Abstract: An embodiment roof assembly for a vehicle includes a roof panel including a core, an upper skin attached to a top surface of the core, and a lower skin attached to a bottom surface of the core, a face sheet disposed above the roof panel, and a foam layer interposed between the roof panel and the face sheet.

Abstract: It is demonstrated herein that inhibitors of immune checkpoints and CHI3L1 are synergistic. Accordingly, described herein are methods and compositions relating to combinatorial therapies for cancer, e.g., comprising an inhibitor of CHI3L1; and an inhibitor of an immune checkpoint protein. In some embodiments, the CHI3L1 inhibitor can be an antibody or antibody reagent as described herein.

Abstract: Disclosed in the present document is an apparatus for aligning a semiconductor chip for packaging according to an embodiment, the apparatus may include a radiation source configured to irradiate a plurality of semiconductor chips with radiation; the plurality of semiconductor chips vertically disposed with respect to the ground; a radiation sensor configured to detect the radiation that has penetrated the plurality of semiconductor chips; and an alignment unit configured to align and bond the plurality of semiconductor chips based on detection information acquired by the radiation sensor.

Abstract: A light module including a base substrate having a front surface, first and second electrodes disposed on the front surface, first and second emitters disposed on the front surface, a first molding covering the first emitter, and a second molding layer covering the second emitter, in which the first and second electrodes include a first region and a second region exposed from the base substrate, and an embedded region between the first region and the second region and not exposed to the outside, and a distance between the second region of the first electrode is connected to the first emitter and the second region of the second electrode connected to the second emitter is shorter than a distance between the first region of the first electrode connected to the first emitter and the first region of the second electrode connected the second emitter.

Abstract: A server according to an embodiment includes a processor configured to receive a friend add request for a target account from a user terminal accessed with a user account; based on one of the user account and the target account being a protected account, transmit an approval request for the friend add request to a protector account connected to the protected account; and based on receiving a reply to the approval request from the protector terminal, add the target account to a friend list of the user account.

Abstract: A cassette for ultra-thin glass includes a pair of plates spaced apart from and facing each other, and a plurality of supports mounted between the pair of plates and including a plurality of mounting grooves that support sides of sheets of ultra-thin glass. Each of the plurality of mounting grooves includes an inclined portion inclined toward a middle of each of the plurality of mounting grooves, and a straight portion extending from the inclined portion and having a constant width in an axial direction of the plurality of supports. A height of the straight portion in a radial direction of the plurality of supports is equal to or greater than a height of the inclined portion in the radial direction.

Abstract: An electronic device including a memory device with improved reliability is provided. The semiconductor device comprises a data pin configured to transmit a data signal, a command/address pin configured to transmit a command and an address, a command/address receiver connected to the command/address pin, and a computing unit connected to the command/address receiver, wherein the command/address receiver receives a first command and a first address from the outside through the command/address pin and generates a first instruction on the basis of the first command and the first address, and the computing unit receives the first instruction and performs computation based on the first instruction.

Abstract: An air conditioner for a vehicle including an air-conditioning case divided into a plurality of air passageways by a separation wall. A heating heat exchanger is disposed inside the air-conditioning case and exchanges heat with air to heat the interior of the vehicle. A perforated member is disposed at a downstream side of the heating heat exchanger and has a plurality of perforated holes through which the air passing the heating heat exchanger passes, and a partition wall is disposed between the heating heat exchanger and the perforated member to divide the air passageway of the air-conditioning case into a plurality of air passageways, wherein the partition wall is formed integrally with the perforated member.

Abstract: A display device includes a display panel; a metal plate and a filling member disposed on a same layer on a bottom surface of the display panel and that include different materials; a fingerprint sensor disposed on a bottom surface of the filling member and that overlaps the filling member; and a member-sensor bonding member disposed between the fingerprint sensor and the filling member and that bonds the fingerprint sensor to the filling member. At least a part of a side surface of the filling member and a side surface of the metal plate are spaced apart from each other with an air gap therebetween.

Abstract: A capacitor component includes a body including a dielectric layer and first and second internal electrode layers, and external electrodes disposed on the body and connected to the first and second internal electrode layers, respectively. The body includes an active portion in which the first and second internal electrode layers are alternately disposed with the dielectric layer interposed therebetween, a cover portion disposed on an upper portion and a lower portion of the active portion, and a side margin portion disposed on both sides of the active portion opposing each other. When a content of magnesium (Mg) included in the active portion is A1, a content of magnesium (Mg) included in the cover portion is C1, and a content of magnesium (Mg) included in the margin portion is M1, 0<A1<M1?C1 and A1/C1?0.60 are satisfied.

Abstract: The display device includes a display panel and a backlight module on the display panel. The backlight module includes light guide plate having a light incident surface, a light emitting surface facing the display panel and a reflection surface. Two sides of the light incident surface connect the light emitting surface and the reflection surface respectively. The reflection surface includes a first periphery light guide region, a second periphery light guide region, and a middle light guide region between the first periphery light guide region and the second periphery light guide region. The first periphery light guide region includes first microstructures. The second periphery light guide region includes second microstructures. The first microstructures have first light guide inclined surfaces inclined towards the second periphery light guide region. The second microstructures have second light guide inclined surfaces inclined towards the first periphery light guide region.

Abstract: A method for preventing corrosion of a spent nuclear fuel canister by using electrolytic corrosion protection, according to the present invention, has an effect of enabling a semi-permanent operation and, particularly, has effects of preventing oxidation and corrosion problems of a canister made of a metal material, in consideration of various environmental variables that may cause corrosion, and ensuring the structural stability of the canister so as to enable a semi-permanent operation.

Abstract: A power detection circuit is provided. The protection circuit is coupled to a pad and includes a trigger circuit and a discharge circuit. The trigger circuit includes a first transistor of a first conductivity type and a second transistor, also of the first conductivity type, which are coupled in series between the pad and a ground terminal. The trigger circuit detects whether a transient even occurs on the pad. The discharge circuit is coupled between the bonding pad and the ground terminal and controlled by the trigger circuit. In response to the transient event occurring on the bonding pad, the trigger circuit generates a trigger voltage to trigger the discharge circuit to provide a discharge path between the pad and the ground terminal.