Abstract: A solar panel includes a wireless device attached to or embedded in the solar panel where the wireless device includes a wireless transceiver circuit and a memory. In one embodiment, the solar panel includes an antenna formed on the metal frame of the solar panel where the antenna is electrically connected to the wireless device to extend a communication range of the wireless device. In another embodiment, the solar panel includes an antenna formed attached to a junction box of the solar panel. The antenna can be a slot antenna or a patch antenna.

Abstract: An electronic device with an embedded wireless tag may be authenticated by a linking partner, which may be another electronic device or a data network, before network connection can be established. In some embodiments, the electronic device includes an embedded wireless communicator for communicating with the wireless tag through a wireless link to retrieve identification data for authentication. In other embodiments, the electronic device cooperates with an external wireless communicator to retrieve stored identification data from the embedded wireless tag. In alternate embodiments, an electronic device may authenticate a peripheral device with an embedded wireless tag before connection can be established with the peripheral device. The electronic device may further erase the data stored on the peripheral device when authentication fails.

Abstract: A wireless device includes a controller and a wireless transceiver where the controller is operative to place the wireless transceiver in a low power consumption mode based on predefined energy saving control policy. In one embodiment, the wireless device includes an accelerometer generating an output signal indicative of motion or vibration of the wireless device where the output signal of the accelerometer is applied to cause the wireless transceiver to exit from the low power consumption mode. In another embodiment, the wireless device includes a photovoltaic module generating an output voltage signal indicative of incident light impinging on the photovoltaic module where the output voltage signal of the photovoltaic module is applied to cause the wireless transceiver to exit from the low power consumption mode.

Abstract: A method for providing identity authentication and tracking for a multi-chip package (MCP) module or a designated semiconductor chip formed inside a MCP module where the MCP module is provided with a first communication function includes providing a communication element formed on the MCP base where the communication element includes a memory unit for storing identification information; providing an electrical connection between the communication element and the designated semiconductor chip; accessing by the designated semiconductor chip the information stored in the memory unit of the communication element through the electrical connection; and providing the information stored in the communication element to a system outside of the MCP module through the first communication function where the information is used at least to track or authenticate the MCP module or the designated semiconductor chip of the MCP module.

Abstract: In one embodiment, a wireless device is embedded in a solar panel for providing remote tracking and/or performance monitoring of the solar panel. The wireless device may be a wireless tracking device including a memory for storing the identification or identity information of the solar panel or of the individual solar cells forming the panel. The wireless device may be a wireless tracking and monitoring device to provide both tracking and performance monitoring functions. In another embodiment, the wireless device is affixed to the exposed side of the back sheet of the solar panel but within the junction box interface so that the wireless device is enclosed in the junction box housing. In other embodiments, some of the elements of the wireless device may be embedded in the solar panel while other elements are affixed to the exposed back sheet inside the junction box housing.

Abstract: In one embodiment, a wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate where the substrate includes one or more openings formed thereon. The opening in the substrate enables the flow of encapsulation material when the wireless tag is embedded into a semiconductor package. In another embodiment, a wireless tag is attached to the package substrate of a semiconductor package where the thin film substrate of the wireless tag has an opening sufficient to accommodate the integrated circuit die of the semiconductor package. In another embodiment, a wireless tag is formed using a metal film as the antenna and a wireless element attached to the metal film. The wireless tag is attached to the package substrate of a semiconductor package using a non-conductive adhesive. The metal film includes an opening sufficient to accommodate the die of the semiconductor package.

Abstract: A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be embedded in the encapsulation materials of the microelectronic device. The wireless tag may also be embedded in the package filler material of the microelectronic device. In this manner, the wireless communication device can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.

Abstract: A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a flexible thin film substrate. The wireless tag is inserted into the packaging of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. In one embodiment, the wireless tag is affixed to a top surface of an integrated circuit chip before encapsulation or lid sealing operation of the packaging process. In this manner, the wireless communication device is embedded in the packaging of the microelectronic device and can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.

Abstract: A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a flexible thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be embedded in the packaging of the microelectronic device. In one embodiment, the wireless tag is embedded in the packaging of a multi-chip package module housing one or more integrated circuits. In this manner, the wireless communication device can be used to track and authenticate the integrated circuits as well as the derivative system products incorporating the integrated circuits.

Abstract: A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be affixed to a package lid of the microelectronic device. The wireless tag may further be affixed to a chip scale package or a three dimensional semiconductor package. In this manner, the wireless communication device can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.

Abstract: A semiconductor package includes a package body with a cavity housing a first integrated circuit die. A wireless tag including a wireless element and an antenna is embedded in the semiconductor package. In one embodiment, the antenna is embedded in the package body of the semiconductor package. In another embodiment, the antenna is formed on or in the first integrated circuit die housed in the semiconductor package. According to another aspect of the present invention, the semiconductor package may be mounted on a printed circuit board and a second antenna is formed on the printed circuit board in electrical connection to the antenna embedded in the semiconductor package.

Abstract: In general, in one aspect, the disclosure describes accessing multiple memory access commands from a one of multiple memory access command queues associated with, respective, banks of a Random Access Memory (RAM) and selecting one of the commands based, at least in part, on the memory access operations identified by the commands and the memory access operation of a previously selected memory access commands.

Abstract: A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in aligned and stacked positions.

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

Abstract: This invention provides a solution to increase the yield strength and fatigue strength of miniaturized springs, which can be fabricated in arrays with ultra-small pitches. It also discloses a solution to minimize adhesion of the contact pad materials to the spring tips upon repeated contacts without affecting the reliability of the miniaturized springs. In addition, the invention also presents a method to fabricate the springs that allow passage of relatively higher current without significantly degrading their lifetime.

Abstract: A method of making a microelectronic device comprising: making a device B comprising providing a structure having a first bond pad, depositing a first electrically conductive material having a first reflow temperature over the first bond pad, and depositing a second electrically conductive material having a second reflow temperature over the first electrically conductive material, and wherein the second reflow temperature is less than the first reflow temperature, and heating the device to a temperature sufficient to reflow the second electrically conductive material but not the first electrically conductive material so that the second electrically conductive material encapsulates the first electrically conductive material to provide a first bump for making electrical connection to device B.

Abstract: The present invention discloses a process for collecting and concentrating trace organics in a liquid sample, which includes steps of adsorption, dehydration, and thermal desorption. The process can be automatically operated by associating with analysis instruments for detecting gaseous materials, such as GC (Gas Chromatography), GC-MS (Gas Chromatography-Mass spectroscopy) and FTIR (Fourier Transfer Infrared spectroscopy) to monitor the organics in the liquid sample. The process can collect and concentrate semi-volatile organic contaminants in a liquid sample which are unable to be collected and concentrated by purge & trap process or head-space process. The process of the present invention can be used to detect trace organics in a detecting limit at a ppt level.

Abstract: A method of making a microelectronic device comprising: making a device B comprising providing a structure having a first bond pad, depositing a first electrically conductive material having a first reflow temperature over the first bond pad, and depositing a second electrically conductive material having a second reflow temperature over the first electrically conductive material, and wherein the second reflow temperature is less than the first reflow temperature, and heating the device to a temperature sufficient to reflow the second electrically conductive material but not the first electrically conductive material so that the second electrically conductive material encapsulates the first electrically conductive material to provide a first bump for making electrical connection to device B.

Abstract: Provided is an engine for comparing a key with rules having defined ranges. A key is received and a rule is accessed including a high and low values defining a range. The key is concurrently compared with the high and low values to determine whether the key falls within a range defined by the high and low values an indication is made in status information the rule in response to the key falling within the defined range of the rule. An additional iteration of accessing a next rule is performed to concurrently compare the key with the high and low values of the next rule, and indication is made in the status information of the next rule in response to the key falling within a range defined by the next rule.

Abstract: A mounting frame substrate having a cavity formed therein and a semiconductor chip in the cavity of the substrate. The semiconductor chip includes bond pads along the periphery thereof and forming a redistribution trace connected to a bond pad of the chip.