Patents by Inventor Chang Sup Ryu
Chang Sup Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9235129Abstract: The present invention provides a composition for developing a photoresist containing a carboxyl group (—COOH) and a method of developing a photoresist using the composition. The composition includes: a first solution including a salt containing a monovalent cationic component; and a second solution including a salt containing a bivalent cationic component. The composition for photoresist development is advantageous in that the developing depth of a photoresist can be controlled, and the developed surface of a photoresist is flat, thereby enabling the photoresist to be developed to realize precise three-dimensional packaging.Type: GrantFiled: February 4, 2014Date of Patent: January 12, 2016Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Chang Bo Lee, Chang Sup Ryu, Dae Jo Hong, Hyo Seung Nam
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Publication number: 20150373856Abstract: A method for forming bumps and a substrate including the bumps. The method includes: coating a solder resist on a substrate and electrodes formed on the substrate: performing laser etching treatment on the solder resist to form openings for forming bumps; printing a composition for forming bumps in the openings for forming bumps; and performing a reflowing process. Accordingly, the method can decrease the number of processes and realize a fine bump pitch of 90 ?m or less at the time of forming bumps. Further, the method can also decrease the number of times that alignment is performed, due to the decrease in the number of processes.Type: ApplicationFiled: September 1, 2015Publication date: December 24, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Cheol Ho CHOI, Chang Bo LEE, Chang Sup RYU
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Patent number: 9040838Abstract: The present invention relates to a method for forming solder resist and a substrate for a package. The method for forming solder resist including: forming a first solder resist inner region by primarily coating, exposing, and developing a solder resist on a substrate on which an outer PoP pad and an inner chip pad are formed, and removing the solder resist's outer portion on the substrate's outer region and curing the solder resist's inner portion on the substrate's inner region; forming a plugged SR region which does not expose the substrate; changing a surface roughness by performing a desmear process on a surface of the first solder resist inner region in which the plugged SR region is formed; and forming a second solder resist SMD region which covers an edge of the PoP pad, exposing, and developing the solder resist on the substrate after the desmear process is provided.Type: GrantFiled: August 27, 2013Date of Patent: May 26, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Bo Lee, Chang Sup Ryu, Hyo Bin Park, Cheol Ho Choi
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Patent number: 8981549Abstract: The preferred embodiment of the present invention can prevent signal distortions such as stress, or the like, occurring at the time of power delivery due to the difference in the lengths of the metal wires for electrically connecting each of the plurality of semiconductor chips formed on the dual die package substrate.Type: GrantFiled: December 29, 2011Date of Patent: March 17, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hye Jin Kim, Going Sik Kim, Chang Sup Ryu
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Patent number: 8966746Abstract: A method of fabricating a cavity capacitor embedded in a printed circuit board including two conductive layers to be used as a power layer and a ground layer, respectively, and a first dielectric layer, placed between the two conductive layers, the method including: removing an upper conductive layer and the first dielectric layer excluding a lower conductive layer of the two conductive layers to allow a cavity to be formed between the two conductive layers, the lower conductive layer being supposed to be used as any one of electrodes of the cavity capacitor; stacking a dielectric material on the cavity to allow a second dielectric layer having a lower stepped portion than the first dielectric layer to be formed in the cavity; and stacking a conductive material on an upper part of the second dielectric layer and side parts of the cavity to allow the upper conductive layer to be used as the other electrode of the cavity capacitor.Type: GrantFiled: April 20, 2011Date of Patent: March 3, 2015Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Je-Gwang Yoo, Chang-Sup Ryu
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Publication number: 20140370446Abstract: The present invention provides a composition for developing a photoresist containing a carboxyl group (—COOH) and a method of developing a photoresist using the composition. The composition includes: a first solution including a salt containing a monovalent cationic component; and a second solution including a salt containing a bivalent cationic component. The composition for photoresist development is advantageous in that the developing depth of a photoresist can be controlled, and the developed surface of a photoresist is flat, thereby enabling the photoresist to be developed to realize precise three-dimensional packaging.Type: ApplicationFiled: February 4, 2014Publication date: December 18, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Bo Lee, Chang Sup Ryu, Dae Jo Hong, Hyo Seung Nam
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Patent number: 8865393Abstract: Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film.Type: GrantFiled: August 19, 2011Date of Patent: October 21, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Dae Jo Hong, Chang Sup Ryu, Cheol Ho Choi
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Patent number: 8780584Abstract: An electronic product includes a case; a first board placed inside the case; and a second board having an Electromagnetic Band Gap (EBG) structure inserted therein. The second board is coupled to an inside of the case facing the first board so as to shield a noise radiated from the first board.Type: GrantFiled: April 3, 2013Date of Patent: July 15, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Chang-Sup Ryu
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Publication number: 20140183726Abstract: The present invention relates to a package substrate, a method for manufacturing the same, and a package on package substrate. In accordance with an embodiment of the present invention, a package substrate including: an inner insulating layer; a circuit pattern layer formed on the inner insulating layer; an outer insulating layer formed on the inner insulating layer to protect the circuit pattern layer and expose portions of external and internal patterns of the circuit pattern layer; a mixed pattern layer consisting of post bumps and outermost layer patterns formed on the portions of the internal and external patterns exposed by the outer insulating layer; and a resist layer formed on the outer insulating layer to protect the outermost layer patterns of the mixed pattern layer and expose the outermost layer patterns by an open region.Type: ApplicationFiled: November 6, 2013Publication date: July 3, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Bo LEE, Cheol ho CHOI, Chang Sup RYU
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Publication number: 20140099433Abstract: The present invention relates to a basket jig for an electroless plating apparatus and an electroless plating method. A basket jig for an electroless plating apparatus in accordance with the present invention includes a basket loaded thereon a plurality of printed circuit boards, a rotating structure coupled to top portions of both sides of the basket and a tube in a shape of a rectangular plate coupled to bottom portions of the basket.Type: ApplicationFiled: March 14, 2013Publication date: April 10, 2014Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Hyo Seung NAM, Chang Sup Ryu
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Publication number: 20140076618Abstract: There is provided a method of forming a gold thin film, the method including: forming a nickel plating layer on a surface of an object through electroless nickel (Ni) plating; forming a palladium-copper mixture plating layer on the nickel plating layer through electroless plating using a palladium-copper (Pd—Cu) mixture; and forming a first gold thin film by immersing the palladium-copper mixture plating layer in a gold (Au) galvanic electrolytic liquid to replace a portion of copper (Cu) particles in the palladium-copper mixture plating layer with gold particles through a replacement reaction.Type: ApplicationFiled: December 3, 2012Publication date: March 20, 2014Applicants: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY, Samsung Electro-Mechanics Co., Ltd.Inventors: Seong Min CHO, Chan Hwa CHUNG, Chang Yong AN, Chang Sup RYU, Hyo Seung NAM
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Publication number: 20140054073Abstract: The present invention relates to a method for forming solder resist and a substrate for a package. The method for forming solder resist including: forming a first solder resist inner region by primarily coating, exposing, and developing a solder resist on a substrate on which an outer PoP pad and an inner chip pad are formed, and removing the solder resist's outer portion on the substrate's outer region and curing the solder resist's inner portion on the substrate's inner region; forming a plugged SR region which does not expose the substrate; changing a surface roughness by performing a desmear process on a surface of the first solder resist inner region in which the plugged SR region is formed; and forming a second solder resist SMD region which covers an edge of the PoP pad, exposing, and developing the solder resist on the substrate after the desmear process is provided.Type: ApplicationFiled: August 27, 2013Publication date: February 27, 2014Applicant: Samsung Electro-Mechannics Co., LtdInventors: Chang Bo LEE, Chang Sup RYU, Hyo Bin PARK, Cheol Ho CHOI
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Publication number: 20140041911Abstract: Disclosed herein is a flat dam formed in a package region of an insulation layer provided on a board to limit movement of an underfill and made of the hydrophobic material including any one of or at least two of perfluorooctyl acrylate (PFAC), polypropylene, polytetrafluoroethylene (PTFE), and fluorine compound.Type: ApplicationFiled: March 18, 2013Publication date: February 13, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Bo Lee, Chang Sup Ryu, Young Gwan Ko, Cheol Ho Choi
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Publication number: 20140037862Abstract: Disclosed herein is a method for manufacturing a printed circuit board for forming a solder resist of an outermost layer having a step structure by performing laser machining or exposing and developing processes.Type: ApplicationFiled: November 7, 2012Publication date: February 6, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Chang Bo Lee, Do Wan Kim, Cheol Ho Choi, Chang Sup Ryu
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Publication number: 20130313004Abstract: A package substrate includes a solder resist layer having a level surface, a circuit pattern buried in the solder resist layer, and a bump protruding from the solder resist layer.Type: ApplicationFiled: July 30, 2013Publication date: November 28, 2013Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin-Yong AN, Chang-Sup Ryu, Jong-Kuk Hong
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Patent number: 8592135Abstract: A method of manufacturing a printed circuit board, including: applying a conductive paste including carbon nanotubes and a photosensitive binder on a bump-forming area of a circuit substrate having a circuit layer for transferring electrical signals; and patterning the conductive paste, thus forming bumps.Type: GrantFiled: February 23, 2012Date of Patent: November 26, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jee Soo Mok, Je Gwang Yoo, Eung Suek Lee, Chang Sup Ryu
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Publication number: 20130229779Abstract: An electronic product includes a case; a first board placed inside the case; and a second board having an Electromagnetic Band Gap (EBG) structure inserted therein. The second board is coupled to an inside of the case facing the first board so as to shield a noise radiated from the first board.Type: ApplicationFiled: April 3, 2013Publication date: September 5, 2013Applicant: SANSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han KIM, Chang-Sup Ryu
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Patent number: 8499444Abstract: A package substrate and a method of manufacturing the package substrate are disclosed. The method of manufacturing the package substrate may include stacking a second metal layer in which at least one hole is formed over a first metal layer, stacking a barrier layer over the first metal layer exposed in the hole and over the second metal layer, forming at least one bump by filling the hole with a conductive metal, stacking an insulation layer over the bump and forming a circuit pattern over the insulation layer, and removing the first metal layer, the second metal layer, and the barrier layer.Type: GrantFiled: June 30, 2008Date of Patent: August 6, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jin-Yong An, Chang-Sup Ryu, Jong-Kuk Hong
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Publication number: 20130175238Abstract: This invention relates to an etching solution including hydrogen peroxide, sulfuric acid, chlorine ions, benzotriazole and pyrazole, and to a method of manufacturing a printed wiring substrate wherein the surface of the metal wiring of the printed wiring substrate is treated with an alkali solution, roughened using the etching solution and then subjected to anti-rust treatment, thus forming porous surface irregularities and micro anchors even with a small etching amount of the metal (Cu) to thereby obtain a high force of adhesion between the metal and an insulating material.Type: ApplicationFiled: May 17, 2012Publication date: July 11, 2013Applicants: Samyoung Pure Chemicals Co., Ltd., SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Jo HONG, Chang Bo LEE, Cheol Ho CHOI, Chang Sup RYU, Sung Pyo HONG, Jong Hoon JEON, Akira HOSOMI, Hiroshi TAKAMIYA
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Patent number: 8432706Abstract: A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.Type: GrantFiled: December 22, 2009Date of Patent: April 30, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Han Kim, Chang-Sup Ryu