Patents by Inventor Chang-Woo Yoo

Chang-Woo Yoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190268046
    Abstract: Provided is a multiple-input multiple-output (MIMO) antenna having a lightweight stacked structure. According to one aspect of the present invention, there is provided a MIMO antenna assembly having a lightweight stacked structure, in which a calibration network, which was provided between antenna elements and filters in the related art, is provided on one printed circuit board (PCB), together with a power amplifier and a digital circuit, and filters are closely coupled to the bottom of the PCB on which the feeding network is provided. The present invention employs a strategy in which an antenna assembly is reduced to a compact size while managing phase deviation caused due to filters at an acceptable level.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Inventors: Duk Yong KIM, Bae Mook JEONG, Chang Woo YOO, Young Chan MOON, Nam Shin PARK, Bum Sik PARK, Min Seon YUN, Min Sik PARK, Sung Ho JANG
  • Publication number: 20190267701
    Abstract: Provided is an antenna device including a first antenna body, and a power supply module detachably attached to the first antenna body. The power supply module is provided on a fastening region of a first radiation fin of the first antenna body.
    Type: Application
    Filed: May 14, 2019
    Publication date: August 29, 2019
    Inventors: Duk Yong KIM, Young Chan MOON, Min Sik PARK, Chang Woo YOO, Bae Mook JEONG, Nam Shin PARK, Min Seon YUN
  • Publication number: 20190227545
    Abstract: Provided are a method and a device for assisting with driving of a vehicle, the method including sensing an ambient environment of location of a vehicle by using one or more sensors mounted on or in the vehicle; obtaining sensing information about the ambient environment based on the sensing of the ambient environment; comparing map information stored in the vehicle with the obtained sensing information; determining a map reliability of the map information based on a result of the comparing; and controlling the driving of the vehicle based on the determined map reliability.
    Type: Application
    Filed: December 31, 2018
    Publication date: July 25, 2019
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Woo Yoo, Mid Eum Choi, Chang Soo Park, A Ron Baik, Je Woong Ryu, In Hak Na
  • Patent number: 9888569
    Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.
    Type: Grant
    Filed: October 4, 2013
    Date of Patent: February 6, 2018
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang Myung Lee, Byeong Ho Kim, Jae Seok Park, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Kyu Won Lee
  • Publication number: 20170252800
    Abstract: An aluminum alloy includes 6 to 8.5 wt % of magnesium (Mg), 4 to 6 wt % of silicon (Si), 0.4 to 0.8 wt % of iron (Fe), 0.2 to 0.5 wt % of manganese (Mn), 0.01 to 0.1 wt % of copper (Cu), 0.05 to 0.15 wt % of titanium (Ti), and the remainder being aluminum (Al), and may be in use for die-casting electronic components or communication components which require weight reduction and high corrosion resistance.
    Type: Application
    Filed: April 28, 2017
    Publication date: September 7, 2017
    Inventors: Yoon-Yong KIM, Chang-Woo YOO
  • Patent number: 9642246
    Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: May 2, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Myoung Hwa Nam, Byeong Ho Kim, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Sang Myung Lee
  • Publication number: 20170097196
    Abstract: Heat radiation devices according to various embodiments of the present invention may comprise: a heating plate; and a heat radiating area portion which is provided in the heating plate and has heat radiation pins having angles different from each other. Also, other various embodiments are possible.
    Type: Application
    Filed: December 19, 2016
    Publication date: April 6, 2017
    Inventors: Chang-Woo Yoo, Min-Sik Park, So-Hyeon Mun, Hye-Yeon Kim
  • Patent number: 9585258
    Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: February 28, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yeong Uk Seo, Ki Do Chun, Chang Woo Yoo, Hyun Seok Seo, Byeong Ho Kim, Sang Myung Lee
  • Patent number: 9572196
    Abstract: A small-sized base station employed in a mobile communication system is disclosed. To this end, the small-sized base station in a mobile communication system, according to one embodiment of the present invention, is a base station device in a mobile communication system comprising: a case which has the shape of a polyhedron and is hollow inside; a housing accommodated inside the case and having the same polyhedron shape as the case; and at least one board which is positioned between the case and the housing.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: February 14, 2017
    Assignee: KMW INC.
    Inventors: Duk-Yong Kim, Young-Chan Moon, Myong-Sik Lee, Chang-Woo Yoo, Chi-Back Ryu
  • Patent number: 9549465
    Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: January 17, 2017
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Woo Yoo, Yeong Uk Seo, Byeong Ho Kim, Hyun Seok Seo, Sang Myung Lee, Ki Do Chun
  • Publication number: 20160365618
    Abstract: A multi-band antenna apparatus according to one of various embodiments of the present invention may comprise: an antenna housing in which an antenna module having two or more frequency bands is mounted; a plurality of repeaters detachably coupled to the antenna housing according to slide movement thereof; connector parts which protrude from the antenna housing and are connected to the plurality of repeaters, respectively; and a bracket which fixes the antenna housing to an outer wall and couples the plurality of repeaters to the antenna housing in an individually detachable manner.
    Type: Application
    Filed: August 24, 2016
    Publication date: December 15, 2016
    Inventors: In-Ho Kim, Hyoung-Seok Yang, Chang-Woo Yoo, Young-Chan Moon, Seong-Man Kang
  • Patent number: 9491799
    Abstract: The present invention discloses a base station, the size of which is reduced and which is to be adopted in a mobile communication system. The disclosed small base station includes: a polyhedral housing; an antenna unit disposed on the widest surface of the outer surface of the housing; a first board arranged on any outer surface of the housing; and two or more boards which are arranged in an upright state with the first board and which are arranged to face three or more outer side surfaces of the housing, respectively.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: November 8, 2016
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Young-Chan Moon, Myong-Sik Lee, Chang-Woo Yoo, Min-Sik Park
  • Publication number: 20160261030
    Abstract: Various embodiments of the present invention comprise: an antenna module; and at least one RRH which is arranged to face the outer surface of the antenna module, is coupled by being directly connected to the antenna module and arranged along the longitudinal direction of the antenna module, wherein a plurality of cooling air gaps are provided between the outer surface of the antenna module and the RRH.
    Type: Application
    Filed: May 17, 2016
    Publication date: September 8, 2016
    Inventors: Duk-Yong Kim, Young-Chan Moon, Chang-Woo Yoo, Min-Sik Park, Jeong-Min Kim, Hyoung-Seok Yang, In-Ho Kim
  • Patent number: 9433107
    Abstract: Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns are also uniformly formed, a difference in plating can be reduced. Also, since the dummy patterns are uniformly formed in the dummy area, a difference in grinding between the dummy area and the active area can be reduced, thereby enabling the circuit patterns to be formed in the active area without the occurrence of over-grinding.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: August 30, 2016
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Hyun Seok Seo, Ki Do Chun, Sang Myung Lee, Yeong Uk Seo, Chang Woo Yoo, Byeong Ho Kim
  • Patent number: 9209108
    Abstract: A method for forming a fine pattern using isotropic etching, includes the steps of forming an etching layer on a semiconductor substrate, and coating a photoresist layer on the etching layer, performing a lithography process with respect to the etching layer coated with the photoresist layer, and performing a first isotropic etching process with respect to the etching layer including a photoresist pattern formed through the lithography process, depositing a passivation layer on the etching layer including the photoresist pattern, and performing a second isotropic etching process with respect to the passivation layer. The second isotropic etching process is directly performed without removing the predetermined portion of the passivation layer.
    Type: Grant
    Filed: June 13, 2013
    Date of Patent: December 8, 2015
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sang-Yu Lee, Jee-Heum Paik, Soo-Hong Kim, Chang-Woo Yoo, Sung-Woon Yoon
  • Publication number: 20150257262
    Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.
    Type: Application
    Filed: October 4, 2013
    Publication date: September 10, 2015
    Inventors: Sang Myung Lee, Byeong Ho Kim, Jae Seok Park, Yeong Uk Seo, Hyun Seok Seo, Chang Woo Yoo, Kyu Won Lee
  • Publication number: 20150250022
    Abstract: A small-sized base station employed in a mobile communication system is disclosed. To this end, the small-sized base station in a mobile communication system, according to one embodiment of the present invention, is a base station device in a mobile communication system comprising: a case which has the shape of a polyhedron and is hollow inside; a housing accommodated inside the case and having the same polyhedron shape as the case; and at least one board which is positioned between the case and the housing.
    Type: Application
    Filed: May 15, 2015
    Publication date: September 3, 2015
    Inventors: Duk-Yong Kim, Young-Chan Moon, Myong-Sik Lee, Chang-Woo Yoo, Chi-Back Ryu
  • Publication number: 20150156818
    Abstract: The present invention discloses a base station, the size of which is reduced and which is to be adopted in a mobile communication system. The disclosed small base station includes: a polyhedral housing; an antenna unit disposed on the widest surface of the outer surface of the housing; a first board arranged on any outer surface of the housing; and two or more boards which are arranged in an upright state with the first board and which are arranged to face three or more outer side surfaces of the housing, respectively.
    Type: Application
    Filed: February 5, 2015
    Publication date: June 4, 2015
    Inventors: Duk Yong Kim, Young-Chan Moon, Myong-Sik Lee, Chang-Woo Yoo, Min-Sik Park
  • Publication number: 20150144321
    Abstract: The present invention is an apparatus for dissipating heat through a heat sink, the apparatus comprising: a heat transfer member having one end with a contact surface contacting a heating element arranged on a substrate and the other end with a contact surface contacting the heat sink, the heat transfer member transferring the heat generated from the heating element to the heat sink; an elastic member for providing elastic force for pushing the heat transfer member toward the heating element; a guide member arranged in the heat sink to form a contact surface contacting the heat transfer member, the guide member mechanically guiding the heat transfer member such that the heat transfer member may slide and move toward the heating element; and a spacing member inserted between the substrate and the heat sink so as to maintain a preset spacing when the substrate and the heat sink are fixed and attached with each other.
    Type: Application
    Filed: February 5, 2015
    Publication date: May 28, 2015
    Inventors: Duk Yong Kim, Chang-Woo Yoo, Chi-Back Ryu, Min-Sik Park
  • Publication number: 20150148111
    Abstract: The present invention is a closure apparatus of a wireless communication device having a heat-dissipating structure. The closure apparatus comprises: a first housing; and a second housing manufactured to be mechanically separated from the first housing and coupled to the first housing with preset spacing. The second housing includes equipment pre-selected based on the degree of heat dissipation from among multiple pieces of equipment of the communication device. The first housing includes equipment other than the equipment of the second housing.
    Type: Application
    Filed: February 5, 2015
    Publication date: May 28, 2015
    Inventors: Duk Yong Kim, Chang-Woo Yoo, Chi-Back Ryu, Min-Sik Park