Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.

Abstract: A small-sized base station employed in a mobile communication system is disclosed. To this end, the small-sized base station in a mobile communication system, according to one embodiment of the present invention, is a base station device in a mobile communication system comprising: a case which has the shape of a polyhedron and is hollow inside; a housing accommodated inside the case and having the same polyhedron shape as the case; and at least one board which is positioned between the case and the housing.

Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.

Abstract: A multi-band antenna apparatus according to one of various embodiments of the present invention may comprise: an antenna housing in which an antenna module having two or more frequency bands is mounted; a plurality of repeaters detachably coupled to the antenna housing according to slide movement thereof; connector parts which protrude from the antenna housing and are connected to the plurality of repeaters, respectively; and a bracket which fixes the antenna housing to an outer wall and couples the plurality of repeaters to the antenna housing in an individually detachable manner.

Abstract: The present invention discloses a base station, the size of which is reduced and which is to be adopted in a mobile communication system. The disclosed small base station includes: a polyhedral housing; an antenna unit disposed on the widest surface of the outer surface of the housing; a first board arranged on any outer surface of the housing; and two or more boards which are arranged in an upright state with the first board and which are arranged to face three or more outer side surfaces of the housing, respectively.

Abstract: Various embodiments of the present invention comprise: an antenna module; and at least one RRH which is arranged to face the outer surface of the antenna module, is coupled by being directly connected to the antenna module and arranged along the longitudinal direction of the antenna module, wherein a plurality of cooling air gaps are provided between the outer surface of the antenna module and the RRH.

Abstract: Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns are also uniformly formed, a difference in plating can be reduced. Also, since the dummy patterns are uniformly formed in the dummy area, a difference in grinding between the dummy area and the active area can be reduced, thereby enabling the circuit patterns to be formed in the active area without the occurrence of over-grinding.

Abstract: A method for forming a fine pattern using isotropic etching, includes the steps of forming an etching layer on a semiconductor substrate, and coating a photoresist layer on the etching layer, performing a lithography process with respect to the etching layer coated with the photoresist layer, and performing a first isotropic etching process with respect to the etching layer including a photoresist pattern formed through the lithography process, depositing a passivation layer on the etching layer including the photoresist pattern, and performing a second isotropic etching process with respect to the passivation layer. The second isotropic etching process is directly performed without removing the predetermined portion of the passivation layer.

Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.

Abstract: A small-sized base station employed in a mobile communication system is disclosed. To this end, the small-sized base station in a mobile communication system, according to one embodiment of the present invention, is a base station device in a mobile communication system comprising: a case which has the shape of a polyhedron and is hollow inside; a housing accommodated inside the case and having the same polyhedron shape as the case; and at least one board which is positioned between the case and the housing.

Abstract: The present invention discloses a base station, the size of which is reduced and which is to be adopted in a mobile communication system. The disclosed small base station includes: a polyhedral housing; an antenna unit disposed on the widest surface of the outer surface of the housing; a first board arranged on any outer surface of the housing; and two or more boards which are arranged in an upright state with the first board and which are arranged to face three or more outer side surfaces of the housing, respectively.

Abstract: The present invention is a closure apparatus of a wireless communication device having a heat-dissipating structure. The closure apparatus comprises: a first housing; and a second housing manufactured to be mechanically separated from the first housing and coupled to the first housing with preset spacing. The second housing includes equipment pre-selected based on the degree of heat dissipation from among multiple pieces of equipment of the communication device. The first housing includes equipment other than the equipment of the second housing.

Abstract: The present invention is an apparatus for dissipating heat through a heat sink, the apparatus comprising: a heat transfer member having one end with a contact surface contacting a heating element arranged on a substrate and the other end with a contact surface contacting the heat sink, the heat transfer member transferring the heat generated from the heating element to the heat sink; an elastic member for providing elastic force for pushing the heat transfer member toward the heating element; a guide member arranged in the heat sink to form a contact surface contacting the heat transfer member, the guide member mechanically guiding the heat transfer member such that the heat transfer member may slide and move toward the heating element; and a spacing member inserted between the substrate and the heat sink so as to maintain a preset spacing when the substrate and the heat sink are fixed and attached with each other.

Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.

Abstract: Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns are also uniformly formed, a difference in plating can be reduced. Also, since the dummy patterns are uniformly formed in the dummy area, a difference in grinding between the dummy area and the active area can be reduced, thereby enabling the circuit patterns to be formed in the active area without the occurrence of over-grinding.

Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.

Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.

Abstract: The invention relates to a base station antenna, that includes two or more reflector plates, each provided with a radiating element. The base station antenna also includes a reflector plate connecting member connected to each reflector plate for enabling the rotation of the reflector plates. The base station antenna also includes a reflector plate controller providing control signals for controlling the rotation and stoppage of the reflector plates.

Abstract: A method for forming a fine pattern using isotropic etching, includes the steps of forming an etching layer on a semiconductor substrate, and coating a photoresist layer on the etching layer, performing a lithography process with respect to the etching layer coated with the photoresist layer, and performing a first isotropic etching process with respect to the etching layer including a photoresist pattern formed through the lithography process, depositing a passivation layer on the etching layer including the photoresist pattern, and performing a second isotropic etching process with respect to the passivation layer. The second isotropic etching process is directly performed without removing the predetermined portion of the passivation layer.

Abstract: A method for forming a fine pattern using isotropic etching, includes the steps of forming an etching layer on a semiconductor substrate, and coating a photoresist layer on the etching layer, performing a lithography process with respect to the etching layer coated with the photoresist layer, and performing a first isotropic etching process with respect to the etching layer including a photoresist pattern formed through the lithography process, depositing a passivation layer on the etching layer including the photoresist pattern, and performing a second isotropic etching process with respect to the passivation layer. The second isotropic etching process is directly performed without removing the predetermined portion of the passivation layer.