Abstract: Provided is a multiple-input multiple-output (MIMO) antenna having a lightweight stacked structure. According to one aspect of the present invention, there is provided a MIMO antenna assembly having a lightweight stacked structure, in which a calibration network, which was provided between antenna elements and filters in the related art, is provided on one printed circuit board (PCB), together with a power amplifier and a digital circuit, and filters are closely coupled to the bottom of the PCB on which the feeding network is provided. The present invention employs a strategy in which an antenna assembly is reduced to a compact size while managing phase deviation caused due to filters at an acceptable level.

Abstract: The present disclosure relates to a multi input and multi output antenna apparatus. The multi input and multi output antenna apparatus may include: an antenna board having a plurality of antenna elements arranged on a front surface thereof; and a transmitting/receiving module board having a plurality of first heat generation elements provided on a front surface thereof and a plurality of second heat generation elements provided on a rear surface thereof, and disposed to have a separation space from the antenna board. The heat generated from the plurality of first heat generation elements may be radiated to the front of the transmitting/receiving module board, and the heat generated from the plurality of second heat generation elements may be radiated to the rear of the transmitting/receiving module board.

Abstract: Provided is an antenna device including a first antenna body, and a power supply module detachably attached to the first antenna body. The power supply module is provided on a fastening region of a first radiation fin of the first antenna body.

Abstract: The present invention relates to an antenna apparatus, which specifically comprises: a filter unit which is disposed to form at least one layer; an electric appliance unit which is coupled and is spaced apart from the filter unit to form a layer different from that of the filter unit, and includes various electric devices installed therein; a filter unit heat dissipation module which is coupled to the opposite surface of a surface of the filter unit, the surface being coupled to the electric appliance unit, and thus radiates heat generated from the filter unit to the outside; and an electric appliance unit heat dissipation module including a first electric appliance unit heat dissipation module and a second electric appliance unit heat dissipation module, wherein: the first electric appliance unit heat dissipation module is coupled to the opposite surface of a surface of the electric appliance unit, the surface being coupled to the filter unit, and thus radiates, to the outside, heat generated from first heat

Abstract: Provided is a multiple-input multiple-output (MIMO) antenna having a lightweight stacked structure. According to one aspect of the present invention, there is provided a MIMO antenna assembly having a lightweight stacked structure, in which a calibration network, which was provided between antenna elements and filters in the related art, is provided on one printed circuit board (PCB), together with a power amplifier and a digital circuit, and filters are closely coupled to the bottom of the PCB on which the feeding network is provided. The present invention employs a strategy in which an antenna assembly is reduced to a compact size while managing phase deviation caused due to filters at an acceptable level.

Abstract: An antenna assembly and an antenna device including the same are provided. The antenna assembly includes antenna elements, a first printed circuit board (PCB), cavity filters, and a second PCB. The first PCB has one surface provided with the antenna elements. The cavity filters are installed on the other surface of the first PCB and electrically connected to the plurality of antenna elements. The second PCB has one surface electrically connected to the cavity filters and includes at least a power amplifier, digital processing circuit, and calibration network. The second PCB includes one or more first processing areas and one or more second processing areas extending in parallel with each other. The digital processing circuit is disposed in the second processing area and not in the first processing area. The power amplifier is disposed in the first processing area and not in the second processing area.

Abstract: The present disclosure relates to a heat-radiating mechanism for an antenna device, and particularly, includes: a plurality of communication elements generating predetermined heat upon electrical operation, a heat-radiating combined case having the plurality of communication elements accommodated in one surface thereof and a plurality of heat-radiating ribs integrally formed on the other surface thereof, and an antenna board mounted with the plurality of communication elements on one surface of the heat-radiating combined case, in which the plurality of heat-radiating ribs are formed such that the rising airflow formed by being heat-radiated from the relatively lower portion of the heat-radiating combined case is exhausted to be inclined upward to the left and right outsides of the heat-radiating combined case in the width direction from the relatively upper position, thereby improving the heat-radiating performance of the antenna device.

Abstract: The present disclosure relates to a multi input and multi output antenna apparatus. The multi input and multi output antenna apparatus may include: an antenna board having a plurality of antenna elements arranged on a front surface thereof; and a transmitting/receiving module board having a plurality of first heat generation elements provided on a front surface thereof and a plurality of second heat generation elements provided on a rear surface thereof, and disposed to have a separation space from the antenna board. The heat generated from the plurality of first heat generation elements may be radiated to the front of the transmitting/receiving module board, and the heat generated from the plurality of second heat generation elements may be radiated to the rear of the transmitting/receiving module board.

Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and includes a printed circuit board which has a plurality of electronic elements mounted on one surface, at least one of the plurality of electronic elements generating heat at operation, a board case which accommodates the printed circuit board, a cooling cover which has the inner surface in close contact with the other surface of the printed circuit board while covering the board case, and a plurality of radial cooling bodies which have at least one provided to protrude from the outer surface of the cooling cover, are each formed to extend to be inclined upward, and receive heat generated from the printed circuit board to dissipate the heat outward, thereby increasing an effective cooling area on a limited cooling portion to largely improve cooling performance.

Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and particularly, includes a printed circuit board which has a plurality of electronic elements provided on one surface thereof as a unit heat-generating element, a housing main body which has the other surface of the printed circuit board accommodated to be in close contact therewith, and has a plurality of first cooling ribs provided to protrude from the outer surface thereof, an additional cooling part which is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body, and a heat transfer part which has one end connected to the outer surface of the housing main body and the other end connected to the additional cooling part to transfer heat generated from the electronic element to the additional cooling part, thereby improving cooling performance.

Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.

Abstract: The present disclosure relates to an MIMO antenna apparatus, and in particular, includes a PCB having at least one heat-generation element provided on one surface thereof, a first heat-dissipation part disposed to cover one surface of the PCB, having a through hole formed in a portion corresponding to the position provided with the heat-generation element, and having a plurality of vertical heat-dissipation fins formed to be extended in a direction perpendicular to the outside surface thereof, and a second heat-dissipation part detachably coupled to the through hole to contact one surface of the heat-generation element to receive heat from the heat-generation element and to dissipate heat at a long distance father than the first heat-dissipation part, thereby enhancing heat-dissipation performance and expanding universality of a product.

Abstract: An antenna assembly and an antenna device including the same are provided. The antenna assembly includes antenna elements, a first printed circuit board (PCB), cavity filters, and a second PCB. The first PCB has one surface provided with the antenna elements. The cavity filters are installed on the other surface of the first PCB and electrically connected to the plurality of antenna elements. The second PCB has one surface electrically connected to the cavity filters and includes at least a power amplifier, digital processing circuit, and calibration network. The second PCB includes one or more first processing areas and one or more second processing areas extending in parallel with each other. The digital processing circuit is disposed in the second processing area and not in the first processing area. The power amplifier is disposed in the first processing area and not in the second processing area.

Abstract: An aluminum alloy includes 6 to 8.5 wt % of magnesium (Mg), 4 to 6 wt % of silicon (Si), 0.4 to 0.8 wt % of iron (Fe), 0.2 to 0.5 wt % of manganese (Mn), 0.01 to 0.1 wt % of copper (Cu), 0.05 to 0.15 wt % of titanium (Ti), and the remainder being aluminum (Al), and may be in use for die-casting electronic components or communication components which require weight reduction and high corrosion resistance.

Abstract: A multi-band antenna apparatus according to one of various embodiments of the present invention may comprise: an antenna housing in which an antenna module having two or more frequency bands is mounted; a plurality of repeaters detachably coupled to the antenna housing according to slide movement thereof; connector parts which protrude from the antenna housing and are connected to the plurality of repeaters, respectively; and a bracket which fixes the antenna housing to an outer wall and couples the plurality of repeaters to the antenna housing in an individually detachable manner.

Abstract: Provided is an antenna device including a first antenna body, and a power supply module detachably attached to the first antenna body. The power supply module is provided on a fastening region of a first radiation fin of the first antenna body.

Abstract: Provided is a multiple-input multiple-output (MIMO) antenna having a lightweight stacked structure. According to one aspect of the present invention, there is provided a MIMO antenna assembly having a lightweight stacked structure, in which a calibration network, which was provided between antenna elements and filters in the related art, is provided on one printed circuit board (PCB), together with a power amplifier and a digital circuit, and filters are closely coupled to the bottom of the PCB on which the feeding network is provided. The present invention employs a strategy in which an antenna assembly is reduced to a compact size while managing phase deviation caused due to filters at an acceptable level.

Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.

Abstract: An aluminum alloy includes 6 to 8.5 wt % of magnesium (Mg), 4 to 6 wt % of silicon (Si), 0.4 to 0.8 wt % of iron (Fe), 0.2 to 0.5 wt % of manganese (Mn), 0.01 to 0.1 wt % of copper (Cu), 0.05 to 0.15 wt % of titanium (Ti), and the remainder being aluminum (Al), and may be in use for die-casting electronic components or communication components which require weight reduction and high corrosion resistance.

Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.