Patents by Inventor Chang-Yuan Wu
Chang-Yuan Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11839050Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion, wherein a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is adjacent to the heat dissipation portion, wherein the heat dissipation fan or the heat dissipation structure has an air flow guiding portion with a slot connected to the heat dissipation flow channel, the heat dissipation fan provides a heat dissipation air flow, and the air flow guiding portion guides a part of the heat dissipation air flow to pass through the slot along a direction not parallel to an outflow direction of the heat dissipation fan and then pass through the heat dissipation flow channel.Type: GrantFiled: April 9, 2020Date of Patent: December 5, 2023Assignee: COMPAL ELECTRONICS, INC.Inventor: Chang-Yuan Wu
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Patent number: 10936028Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.Type: GrantFiled: December 27, 2017Date of Patent: March 2, 2021Assignee: COMPAL ELECTRONICS, INC.Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
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Publication number: 20200400618Abstract: A paper warping detection device comprises: an input tray for loading a plurality of pieces of paper to be fed; a processor for storing a first threshold; a first emitting unit disposed at a front end of the input tray that forms a first angle with the input tray, and then emits a first ultrasonic beam toward the input tray in an obliquely and downward direction; a first receiving unit which is disposed at the front end of the input tray and formed a second angle with the input tray for receiving the ultrasonic beam reflected by the paper loaded in the input tray in a direction leaned downward; and a first analog to digital converter which is electrically connected to the first receiving unit and the processor respectively, for converting the reflected first ultrasonic beam received by the first receiving unit into a first digital signals and outputting the first digital signals to the processor.Type: ApplicationFiled: September 4, 2019Publication date: December 24, 2020Inventors: Ming Da Wu, Shih Sen Huang, Chang Yuan Wu
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Publication number: 20200245498Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion, wherein a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is adjacent to the heat dissipation portion, wherein the heat dissipation fan or the heat dissipation structure has an air flow guiding portion with a slot connected to the heat dissipation flow channel, the heat dissipation fan provides a heat dissipation air flow, and the air flow guiding portion guides a part of the heat dissipation air flow to pass through the slot along a direction not parallel to an outflow direction of the heat dissipation fan and then pass through the heat dissipation flow channel.Type: ApplicationFiled: April 9, 2020Publication date: July 30, 2020Applicant: COMPAL ELECTRONICS, INC.Inventor: Chang-Yuan Wu
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Patent number: 10506739Abstract: A laptop computer including a main body, a fan disposed in a receiving space of the main body, a keyboard assembly movably disposed on the main body, and a heat dissipation assembly movably disposed in the main body and linked with the keyboard assembly is provided. The main body has an air outlet and at least one first air inlet. In a process of the keyboard assembly gradually moving out of the main body, the keyboard assembly drives the heat dissipation assembly to move in the main body and form a second air inlet in the main body to communicate with the receiving space.Type: GrantFiled: December 27, 2018Date of Patent: December 10, 2019Assignee: COMPAL ELECTRONICS, INC.Inventors: Shang-Che Lee, I-Lung Chen, Yi-Hsuan Wu, Wang-Hung Yeh, Chang-Yuan Wu, Jie-Ting Hsieh, Yu-Fan Chuang
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Patent number: 10484544Abstract: A method and a system for adjusting a volume of a conference call are provided. The system includes at least one sub-device and a host. The host respectively connects the at least one sub-device and detects a number of the connected sub-devices. The host adjusts a volume of an original voice signal received from an external device according to the number of the connected sub-devices to generate an adjusted voice signal adapted to each sub-device and provides the same to each sub-device to play. The host also adjusts volumes of the original voice signals received by the host and each sub-device, integrates the adjusted original voice signals into an integrated voice signal adapted to the external device, and provides the same to the external device to play.Type: GrantFiled: May 27, 2016Date of Patent: November 19, 2019Assignee: COMPAL ELECTRONICS, INC.Inventors: Yi-Chang Wu, Po-Yueh Lan, Ming-Che Weng, Chang-Yuan Wu, Chih-Yuan Lin
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Patent number: 10364111Abstract: A paper warping detection device includes an input tray, a processor, a first emitting element, a first receiving element and a first analog-to-digital converter. A first critical value is stored in the processor. The first emitting element is electrically connected with the processor. The first receiving element is disposed to the other side of the input tray. The first receiving element and the first emitting element face each other. When the first emitting element is switched on, the first emitting element emits first ultrasonic wave signals towards the first receiving element. The first analog-to-digital converter is electrically connected with the first receiving element and the processor for converting the first ultrasonic wave signals into first digital signals and outputting the first digital signals to the processor. The processor reads the first digital signals and compares the first digital signals with the first critical value.Type: GrantFiled: September 6, 2018Date of Patent: July 30, 2019Assignee: Foxlink Image Technology Co., Ltd.Inventors: Ming Da Wu, Shih Sen Huang, Chang Yuan Wu
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Publication number: 20190208662Abstract: A laptop computer including a main body, a fan disposed in a receiving space of the main body, a keyboard assembly movably disposed on the main body, and a heat dissipation assembly movably disposed in the main body and linked with the keyboard assembly is provided. The main body has an air outlet and at least one first air inlet. In a process of the keyboard assembly gradually moving out of the main body, the keyboard assembly drives the heat dissipation assembly to move in the main body and form a second air inlet in the main body to communicate with the receiving space.Type: ApplicationFiled: December 27, 2018Publication date: July 4, 2019Applicant: COMPAL ELECTRONICS, INC.Inventors: Shang-Che Lee, I-Lung Chen, Yi-Hsuan Wu, Wang-Hung Yeh, Chang-Yuan Wu, Jie-Ting Hsieh, Yu-Fan Chuang
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Patent number: 10321233Abstract: A method and a portable electronic apparatus for adaptively adjusting a playback effect of speakers are provided. The portable electronic apparatus includes a speaker enclosure volume adjusting device and a processor coupled to the speakers and the speaker enclosure volume adjusting device. In the method, the processor detects a usage demand for the portable electronic apparatus and accordingly determines an audio mode. Based on the determined audio mode, the processor selects and activates multiple speakers, and adjusts an enclosure volume of at least one of the activated speakers, so as to change an audio frequency range of the at least one speaker and an overall audio frequency range covered by the activated speakers. Finally, the processor plays an audio through the activated speakers.Type: GrantFiled: June 24, 2016Date of Patent: June 11, 2019Assignee: COMPAL ELECTRONICS, INC.Inventors: Po-Yueh Lan, Chang-Yuan Wu, Yi-Chang Wu, Kun-Tien Kuo, Ya-Hui Tseng, Chen-Yi Huang, Chun-Yi Ho, Hsiao-Ching Hung
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Publication number: 20190100395Abstract: A paper warping detection device includes an input tray, a processor, a first emitting element, a first receiving element and a first analog-to-digital converter. A first critical value is stored in the processor. The first emitting element is electrically connected with the processor. The first receiving element is disposed to the other side of the input tray. The first receiving element and the first emitting element face each other. When the first emitting element is switched on, the first emitting element emits first ultrasonic wave signals towards the first receiving element. The first analog-to-digital converter is electrically connected with the first receiving element and the processor for converting the first ultrasonic wave signals into first digital signals and outputting the first digital signals to the processor. The processor reads the first digital signals and compares the first digital signals with the first critical value.Type: ApplicationFiled: September 6, 2018Publication date: April 4, 2019Inventors: Ming Da Wu, Shih Sen Huang, Chang Yuan Wu
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Publication number: 20190059177Abstract: A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion and an extending portion, wherein the extending portion has a slot, and a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is detachably assembled to the extending portion to be adjacent to the heat dissipation portion, wherein the heat dissipation fan covers the slot, the slot is connected to the heat dissipation flow channel, the heat dissipation fan is adapted to provide a heat dissipation air flow, and a part of the heat dissipation air flow passes through the slot and the heat dissipation flow channel in sequence.Type: ApplicationFiled: February 12, 2018Publication date: February 21, 2019Applicant: COMPAL ELECTRONICS, INC.Inventors: Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh
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Publication number: 20180341299Abstract: An electronic device, including a main body and a first auxiliary body. The main body includes a processor, a plurality of fans electrically connected to the processor, and a connector electrically connected to the processor. The first auxiliary body is detachably connected to the connector, the processor correspondingly adjusts the heat dissipation capability of at least some of these fans according to the connected first auxiliary body. Further provided is a fan activation method of an electronic device.Type: ApplicationFiled: May 23, 2018Publication date: November 29, 2018Applicant: COMPAL ELECTRONICS, INC.Inventors: Wei-Ning Chai, Li-Fang Chen, Jiun-Yau Wang, Chien-Ming Su, Chang-Yuan Wu
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Patent number: 10091907Abstract: An electronic assembly including a machine body and a docking station is provided. The machine body includes a casing, a heat transfer plate, and a heat dissipation fin set. The casing has a first hole and a second hole. The heat transfer plate and the heat dissipation fin set are disposed in the casing. The heat dissipation fin set includes heat dissipation fins, and a diversion portion of at least one of the heat dissipation fins is aligned to the first hole and the second hole. The docking station includes a body and a fan. The body has a third hole. The fan is disposed in the body. When the machine body is assembled to the docking station, an air flow generated by the fan flows into the casing via the third the first holes, and the air flow is divided into two flows by the diversion portion.Type: GrantFiled: November 9, 2017Date of Patent: October 2, 2018Assignee: COMPAL ELECTRONICS, INC.Inventors: Chien-Ming Su, Chang-Yuan Wu, I-Feng Hsu, Jen-Chang Chen
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Publication number: 20180228050Abstract: An electronic device and a method for controlling a fan operation are provided. A containing space of the electronic device has a fan module and a deformation sensor. The deformation sensor detects whether a fan housing of the fan module is deformed. The deformation sensor transmits a deformation signal to a controller when detecting that the fan housing is deformed. The controller drives a fan blade of the fan module to stop running after receiving the deformation signal.Type: ApplicationFiled: December 27, 2017Publication date: August 9, 2018Applicant: COMPAL ELECTRONICS, INC.Inventors: Chih-Chin Chien, I-Feng Hsu, Ching-Chung Chen, Tse-Yang Lin, Tse-An Chu, Ching-Ya Tu, Chang-Yuan Wu, Hao-Wu Yang, Huan-Yang Yeh, Chin-Hsien Chang, Chin-Yuan Chuang, Chia-Hung Lin
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Publication number: 20180184546Abstract: An electronic assembly including a machine body and a docking station is provided. The machine body includes a casing, a heat transfer plate, and a heat dissipation fin set. The casing has a first hole and a second hole. The heat transfer plate and the heat dissipation fin set are disposed in the casing. The heat dissipation fin set includes heat dissipation fins, and a diversion portion of at least one of the heat dissipation fins is aligned to the first hole and the second hole. The docking station includes a body and a fan. The body has a third hole. The fan is disposed in the body. When the machine body is assembled to the docking station, an air flow generated by the fan flows into the casing via the third the first holes, and the air flow is divided into two flows by the diversion portion.Type: ApplicationFiled: November 9, 2017Publication date: June 28, 2018Applicant: COMPAL ELECTRONICS, INC.Inventors: Chien-Ming Su, Chang-Yuan Wu, I-Feng Hsu, Jen-Chang Chen
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Publication number: 20170111739Abstract: A method and a portable electronic apparatus for adaptively adjusting a playback effect of speakers are provided. The portable electronic apparatus includes a speaker enclosure volume adjusting device and a processor coupled to the speakers and the speaker enclosure volume adjusting device. In the method, the processor detects a usage demand for the portable electronic apparatus and accordingly determines an audio mode. Based on the determined audio mode, the processor selects and activates multiple speakers, and adjusts an enclosure volume of at least one of the activated speakers, so as to change an audio frequency range of the at least one speaker and an overall audio frequency range covered by the activated speakers. Finally, the processor plays an audio through the activated speakers.Type: ApplicationFiled: June 24, 2016Publication date: April 20, 2017Applicant: COMPAL ELECTRONICS, INC.Inventors: Po-Yueh Lan, Chang-Yuan Wu, Yi-Chang Wu, Kun-Tien Kuo, Ya-Hui Tseng, Chen-Yi Huang, Chun-Yi Ho, Hsiao-Ching Hung
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Publication number: 20170034901Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.Type: ApplicationFiled: October 14, 2016Publication date: February 2, 2017Applicant: COMPAL ELECTRONICS, INC.Inventors: Jia-Yu Hung, Chang-Yuan Wu, Ching-Ya Tu, Tse-An Chu
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Publication number: 20160352913Abstract: A method and a system for adjusting a volume of a conference call are provided. The system includes at least one sub-device and a host. The host respectively connects the at least one sub-device and detects a number of the connected sub-devices. The host adjusts a volume of an original voice signal received from an external device according to the number of the connected sub-devices to generate an adjusted voice signal adapted to each sub-device and provides the same to each sub-device to play. The host also adjusts volumes of the original voice signals received by the host and each sub-device, integrates the adjusted original voice signals into an integrated voice signal adapted to the external device, and provides the same to the external device to play.Type: ApplicationFiled: May 27, 2016Publication date: December 1, 2016Applicant: COMPAL ELECTRONICS, INC.Inventors: Yi-Chang Wu, Po-Yueh Lan, Ming-Che Weng, Chang-Yuan Wu, Chih-Yuan Lin
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Patent number: 9414140Abstract: An electronic device includes a case, a speaker, a supporting stand, and a waterproof breathable membrane. The case includes a first inner space and a through hole connected to the first inner space. The speaker is disposed in the first inner space, and produces sound waves outwards from the through hole. The supporting stand connects the case to cover the through hole. The supporting stand includes a sound hole and a second inner space connected to the sound hole and the through hole. The waterproof breathable membrane covers one of the sound hole and the through hole.Type: GrantFiled: December 10, 2013Date of Patent: August 9, 2016Assignee: COMPAL ELECTRONICS, INC.Inventors: Shing-Da Wang, Chih-Wen Chiang, Chang-Yuan Wu, Yi-Chang Wu, Hsin-Chih Hsiao, Yen-Ling Liu, Chien-Chu Chen
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Patent number: 9332627Abstract: A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.Type: GrantFiled: August 5, 2013Date of Patent: May 3, 2016Assignee: COMPAL ELECTRONICS, INC.Inventors: Jia-Yu Hung, Chang-Yuan Wu, I-Feng Hsu, Ting-Wei Hsu