Abstract: An electronic device includes a case, a speaker, a supporting stand, and a waterproof breathable membrane. The case includes a first inner space and a through hole connected to the first inner space. The speaker is disposed in the first inner space, and produces sound waves outwards from the through hole. The supporting stand connects the case to cover the through hole. The supporting stand includes a sound hole and a second inner space connected to the sound hole and the through hole. The waterproof breathable membrane covers one of the sound hole and the through hole.

Abstract: A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.

Abstract: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

Abstract: An electronic device including a main body, a heat dissipation fan and at least one block is provided. The main body has a side shell and a bottom shell. The side shell has a first air inlet and a first air outlet. The heat dissipation fan is disposed in the main body and has at least one second air inlet and at least one second air outlet. The second air outlet is aligned to the first air outlet. The block is disposed in the main body to form a channel with the bottom shell and the dissipation fan. The channel is extended between the second air inlet and the first air inlet, so as to guide airflow to pass through the first air inlet and the second air inlet sequentially and enter the heat dissipation fan.

Abstract: A fan module used in an electronic apparatus is provided. The electronic apparatus includes an upper cover and a lower cover. The fan module includes a fan housing, a fixing shaft, a bearing, and a fan body. The fan housing is mounted on the lower cover. The fixing shaft includes a first end and a second end. The first end is mounted on the fan housing. The second end passes out of the fan housing. The bearing includes a first ring and a second ring. The first ring is pivotally connected to the second ring. The first ring is disposed around the outer edge of the fixing shaft. The fan body is disposed around the outer edge of the second ring, so as to rotate relative to the fixing shaft.

Abstract: An electronic device includes a case, a speaker, a supporting stand, and a waterproof breathable membrane. The case includes a first inner space and a through hole connected to the first inner space. The speaker is disposed in the first inner space, and produces sound waves outwards from the through hole. The supporting stand connects the case to cover the through hole. The supporting stand includes a sound hole and a second inner space connected to the sound hole and the through hole. The waterproof breathable membrane covers one of the sound hole and the through hole.

Abstract: An electronic apparatus includes a housing, a fan module, a heat-dissipating module, and a channel. The housing includes a first heat-dissipating vent and a second heat-dissipating vent. The fan module is disposed in the housing and includes a first outlet and a second outlet. The first outlet is substantially aligned with the first heat-dissipating vent and has a first airflow. The second outlet has a second airflow. The heat-dissipating module is disposed in the housing between the first outlet and the first heat-dissipating vent. The channel is located between the second outlet and the second heat-dissipating vent for guiding the second airflow out of the housing from the second heat-dissipating vent. The temperature of the first heat-dissipating vent is higher than that of the second heat-dissipating vent.

Abstract: A heat dissipation structure includes a first heat-conducting sheet, a second heat-conducting sheet and a meshed heat-conducting layer. The meshed heat-conducting layer is adhered between the first heat-conducting sheet and the second heat-conducting sheet. The meshed heat-conducting layer includes a plurality of first heat-conducting mediums and a plurality of second heat-conducting mediums, the first heat-conducting mediums and the second heat-conducting mediums are alternately arranged, and the thermal conductivity of each of the first heat-conducting mediums is less than the thermal conductivity of each of the second heat-conducting mediums.

Abstract: A thermal dissipating module suitable for removing heat from a heating element disposed on a circuit board is provided. The thermal dissipating module includes a heat conductive structure, an adhesive layer and an elastic member. The heat conductive structure is suitable for being disposed on the heating element. The adhesive layer is suitable for being disposed on the circuit board and adjacent to the heating element. The elastic member is glued to the circuit board by the adhesive layer, and the elastic member applies a force to make the heat conductive structure to be attached to the heating element.

Abstract: A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure.

Abstract: The present invention relates to a method of controlling a heat-dissipating fan of a computer device, which is provided with a heat-dissipating fan, a controller, a first sensor unit, and a second sensor unit. The method of the present invention includes the following steps. First, the controller accepts a first signal and a second signal and controls the rotating speed of the heat-dissipating fan according to the first signal. Subsequently, the controller determines the first signal and the second signal. Next, the controller reduces the rotating speed of the heat-dissipating fan corresponding to the first signal to temporarily maintain the rotating speed at a constant to thereby reduce a noise value produced by the heat-dissipating fan.

Abstract: An electronic apparatus includes a casing, a separation structure, a fan, a first heat generating element and a heat conducting module. The casing has an air inlet and an air outlet. An inner portion of the casing includes first and second areas connected to the air inlet and the air outlet respectively. The separation structure is disposed at a border between the first and the second areas to separate the first and second areas. The fan is disposed in the first area adjacent to the air inlet and adapted to provide a heat dissipation airflow. The heat dissipation airflow flows through the air inlet, the first area, the second area and the air outlet sequentially. The first heat generating element is disposed in the second area. The heat conducting module is connected between the fan and the first heat generating element.

Abstract: An electronic device including a main body, a heat dissipation fan and at least one block is provided. The main body has a side shell and a bottom shell. The side shell has a first air inlet and a first air outlet. The heat dissipation fan is disposed in the main body and has at least one second air inlet and at least one second air outlet. The second air outlet is aligned to the first air outlet. The block is disposed in the main body to form a channel with the bottom shell and the dissipation fan. The channel is extended between the second air inlet and the first air inlet, so as to guide airflow to pass through the first air inlet and the second air inlet sequentially and enter the heat dissipation fan.

Abstract: A docking station suitable for a portable electronic device includes a base, a supporting component and a first fan. The base includes an airflow guiding slope. The supporting component is disposed on the base and has an airflow guiding structure, in which the portable electronic device is configured to be supported on the supporting component. The first fan is disposed in the base and provides a cooling airflow, in which the airflow guiding slope and the airflow guiding structure guide the cooling airflow to flow into the portable electronic device.

Abstract: A charging control method adapted to be used in a portable electronic device is provided. The portable electronic device includes a display module and a rechargeable battery. The charging control method includes the following steps. Firstly, a working status of the display module is obtained and a control signal is transmitted by a control unit. Next, the control signal is received and a charging power provided to the rechargeable battery is adjusted according to the control signal by a power control unit.

Abstract: An electronic device includes a main body and a rotating base. The rotating base has a first vent and is pivoted at the main body and adapted to rotate between an operating position and a retracted position relatively to the main body. When the rotating base is located at the operating position, the first vent is exposed out of the main body, and when the rotating base is located at the retracted position, the first vent is retracted into the main body.

Abstract: A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel.

Abstract: The present invention relates to a method of controlling a heat-dissipating fan of a computer device, which is provided with a heat-dissipating fan, a controller, a first sensor unit, and a second sensor unit. The method of the present invention includes the following steps. First, the controller accepts a first signal and a second signal and controls the rotating speed of the heat-dissipating fan according to the first signal. Subsequently, the controller determines the first signal and the second signal. Next, the controller reduces the rotating speed of the heat-dissipating fan corresponding to the first signal to temporarily maintain the rotating speed at a constant to thereby reduce a noise value produced by the heat-dissipating fan.

Abstract: A touch panel device includes a display module with a touch function and an anti-solar radiation film. The anti-solar radiation film is disposed on a side of the display module and in the touch panel device, so as to prevent solar radiation that passes through the display module to increase an inside temperature of a housing of the touch panel device.