Abstract: An electronic device includes a housing, a module, a main board, and a fan. The module, the main board and the fan are all installed in the housing. The main board divides the interior of the housing into a first space and a second space, and there exists a channel opening between the main board and the module so as to communicate the first space with the second space. The fan is electrically connected to the main board, has a fan outlet and is capable of outputting airflow through the fan outlet to the outside of the housing.

Abstract: An electronic apparatus includes a host, a fan module, and a heat-dissipating module. The host includes a first housing, a second housing, and a first housing vent that is located at the edge of the second housing. The fan module includes a fan outlet. The fan module is disposed in the host obliquely, so as to make the fan outlet face the first housing vent. The heat-dissipating module is located between the fan outlet and the first housing vent, and a portion of the first housing vent is located at the bottom of the heat-dissipating module. The airflow generated by the fan module is In exhausted out of the first housing vent via the heat-dissipating module from the fan outlet.

Abstract: An electronic apparatus includes a housing, a fan module, a heat-dissipating module, and a channel. The housing includes a first heat-dissipating vent and a second heat-dissipating vent. The fan module is disposed in the housing and includes a first outlet and a second outlet. The first outlet is substantially aligned with the first heat-dissipating vent and has a first airflow. The second outlet has a second airflow. The heat-dissipating module is disposed in the housing between the first outlet and the first heat-dissipating vent. The channel is located between the second outlet and the second heat-dissipating vent for guiding the second airflow out of the housing from the second heat-dissipating vent. The temperature of the first heat-dissipating vent is higher than that of the second heat-dissipating vent.

Abstract: A fan module is disposed in an electrical device. The electrical device has a main board and a casing. The fan module includes a vane module, a fan motor, a circuit board and a fan housing. The vane module has a hub and a plurality of vanes disposed around the edge of the hub. The fan motor is disposed in the hub. The circuit board is used to control the fan motor, so that the vanes rotate related to an axis of the hub for generating an air flow. The fan housing has a main body portion, a protruding portion and a fixing portion, wherein the protruding portion is located in a side of the main body portion, the vane module and the fan motor are disposed in the main body portion and the circuit board is disposed in the protruding portion.

Abstract: A heat dissipation module for an electronic apparatus including a heat-generating structure is provided. The heat dissipation module includes a heat dissipation structure and a heat-conducting structure. The heat-conducting structure includes a heat-conducting portion and an extending portion. The heat-conducting portion is adhered between the heat-generating structure and the heat dissipation structure. The heat generated by the heat-generating structure is transmitted to the heat dissipation structure through the heat-conducting portion. The extending portion is connected to the heat-conducting portion and exposed to the heat-generating structure and the heat dissipation structure.

Abstract: A heat-dissipating module is disclosed, which is suitable for an electronic apparatus with a case and a heat source. The heat-dissipating module includes a set of dissipation fins and a fan. The set of dissipation fins is suitable to connect a heat source and there is a flow channel between the set of dissipation fins and the case. The fan is for producing an airflow flowing towards the set of dissipation fins, while the partial airflow flows through the flow channel.

Abstract: An electronic device includes a housing, a module, a main board, and a fan. The module, the main board and the fan are all installed in the housing. The main board divides the interior of the housing into a first space and a second space, and there exists a channel opening between the main board and the module so as to communicate the first space with the second space. The fan is electrically connected to the main board, has a fan outlet and is capable of outputting airflow through the fan outlet to the outside of the housing.

Abstract: A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.

Abstract: A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

Abstract: A thermal module suitable for cooling a heat generating element within a casing of an electronic apparatus includes a fan, a heat sink and a heat pipe. The fan is mounted within the casing for generating airflow to an opening of the casing. The heat sink is mounted within the casing between the opening of the casing and the fan, such that the airflow generated by the fan passes through the heat sink and then flows out of the opening. The heat pipe contacts the heat generating element, extends from the heat generating element to the heat sink, and extends along a periphery of the fan to contact the heat generating element again.

Abstract: A thermal module includes a thermal conductor and at least one first magnetic element. The thermal conductor is disposed above a carrier. In addition, the thermal module may further include at least one second magnetic element or at least one magnetically susceptible element. Either the second magnetic element or the magnetically susceptible element and the first magnetic element can produce magnetic attractive force or magnetic repulsion force therebetween. By such magnetic force, the thermal conductor can be retained with respect to the carrier, thus making contact with a heat generating component.

Abstract: A thermal conducting medium protector is applicable for being assembled to a carrier, so as to protect a thermal conducting medium disposed on the carrier. The thermal conducting medium protector includes a shell and a cover plate. The shell has a first buckling portion on one side of the shell, and an opening. When the carrier is placed on a side surface of the shell, the thermal conducting medium is located in the opening. The cover plate has a second buckling portion, a first side, on which the second buckling portion is located, and a second side opposite to the first side and pivoted to the shell. When the cover plate rotates along the second side and then span across the carrier placed on the side surface of the shell, the buckling portions are buckled with each other to hold the carrier between the shell and the cover plate.

Abstract: A cooler module includes a heat pipe, which has one end terminating in a heat absorbing section that has at least one pane closely attached to the CPU to absorb heat from the CPU and a relatively greater metal wall thickness than the metal wall thickness of the heat pipe, and a heat sink connected to the other end of the heat pipe for dissipating heat absorbed from the CPU by the heat absorbing section of the heat pipe. The invention also provides a heat pipe for use in such a cooler module.

Abstract: An input detection device contains a button set having a plurality of buttons utilized for inputting commands, each button outputting a unique voltage level when the button is activated. The input detection device also contains a voltage generating circuit for outputting a plurality of generated voltage levels corresponding to the unique voltage levels outputted by each of the buttons in the button set, and a comparator for comparing each of the generated voltage levels outputted from the voltage generating circuit with the voltage outputted from the button set. A control circuit controls the voltage generating circuit to alternately output each of the generated voltage levels, records the generated voltage level that is approximately equal to the voltage outputted from the button set, and determines which button in the button set was activated based on the recorded generated voltage level.