Abstract: A device includes a semiconductor substrate, a first fin arranged over the semiconductor substrate, and an isolation structure. The first fin includes an upper portion, a bottom portion, and an insulator layer between the upper portion and the bottom portion. A top surface of the insulator layer is wider than a bottom surface of the upper portion of the first fin. The isolation structure surrounds the bottom portion of the first fin.

Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. A first insulating layer is formed, in the source/drain space, at least on etched first semiconductor layers. A source/drain epitaxial layer is formed in the source/drain space, thereby forming air gaps between the source/drain epitaxial layer and the first semiconductor layers.

Abstract: A method for manufacturing a semiconductor device, including forming a first hard mask strip, a second hard mask strip, and a dummy structure over a substrate, in which the dummy structure is formed between and in contact with the first hard mask strip and the second hard mask strip; forming a hard mask layer over the first hard mask strip, the dummy structure, and the second hard mask strip; patterning the hard mask layer to form an opening exposing the first hard mask strip and the dummy structure, and partially exposing the second hard mask strip; and performing an etching process to remove the first hard mask strip and form a recess in the second hard mask strip, in which the performing the etching process includes forming a polymer in the recess.

Abstract: A method for manufacturing a nickel-titanium alloy includes steps of: placing a titanium material on a first bracket, and placing a nickel material on a second bracket; vacuumizing the vacuum confined space of the melting chamber to below a pressure of 10?5 Torr, and lifting up the titanium material placed on the first bracket to a working area of an induction coil; introducing inert gases; starting the induction coil, to make the titanium material in a levitation state and electromagnetically stirred and heated; dropping the first bracket; measuring whether the temperature of the working area of the induction coil reaches a predetermined temperature range; when the first active metal is in the half molten state, dropping the nickel material placed on the second bracket to be added to the titanium material, and obtaining a homogenizing nickel-titanium alloy by means of electromagnetic stirring and heating; and recycling the homogenizing nickel-titanium alloy.

Abstract: An device for manufacturing an active alloy includes: a melting chamber including: a working pipe surrounded by an induction coil and forming a working area; a chamber base disposed below the working pipe and communicated with the working pipe, and including: a gas inlet hole; a vacuum pump connection port; and a vacuum sensor, for measuring a vacuum degree in the working pipe; a chamber door communicated with the chamber base; a first bracket passing through the chamber base, and moving towards a direction away from or near the working area; a second bracket extending into the working pipe, and moving towards a direction away from or near the working area; and a material recycling seat which can extend into the chamber base in a push and pull way.

Abstract: An ejector with multi-ejection pins is used in the post-processes of the semiconductor industry and is used by a selection device to choose a predetermined quantity of ejection pins. When a propelling device lifts the selection device, a pin-base vertical driver controls the vertical motion of a pin base, and a pin-base motion device controls the planar motion of the pin base; the chosen ejection pins can be lifted to elevate the respective dies for separation from adhesive film.

Abstract: An ejector with multi-ejection pins is used in the post-processes of the semiconductor industry and is used by a selection device to choose a predetermined quantity of ejection pins. When a propelling device lifts the selection device, a pin-base vertical driver controls the vertical motion of a pin base, and a pin-base motion device controls the planar motion of the pin base; the chosen ejection pins can be lifted to elevate the respective dies for separation from adhesive film.

Abstract: A tray-positioning device comprises a driving unit and a positioning unit, wherein the positioning unit provides a plurality of sidewalls that correspond to a plurality of upper sidewalls of a tray. By allowing the driving unit to move the positioning unit toward the tray or vice versa that said individual upper sidewalls are in close contact with the corresponding sidewalls, the tray-positioning device is capable of providing precise positioning for the tray.

Abstract: An air-suspended die sorter is disclosed, in particular an air-suspended die sorter capable of performing die sorting, die attaching and die pick-up in the semiconductor industry. The present invention provides an air-suspended die sorter capable of eliminating spring preload, and lowering mechanical friction so as to lift die sorting precision and elevate the success rate, and has a cylinder unit, a piston unit and a pressure unit. The piston type design and a precise control of pressure on top and on bottom of the piston, respectively, enables the present invention to offer an air-suspended state that has done away with stress problems associated with the use of springs. The present invention further provides a novel buffer design for reducing friction and die impact often encountered in prior art applications.

Abstract: An air-suspended die sorter is disclosed, in particular an air-suspended die sorter capable of performing die sorting, die attaching and die pick-up in the semiconductor industry. The present invention provides an air-suspended die sorter capable of eliminating spring preload, and lowering mechanical friction so as to lift die sorting precision and elevate the success rate, and has a cylinder unit, a piston unit and a pressure unit. The piston type design and a precise control of pressure on top and on bottom of the piston, respectively, enables the present invention to offer an air-suspended state that has done away with stress problems associated with the use of springs. The present invention further provides a novel buffer design for reducing friction and die impact often encountered in prior art applications.

Abstract: The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above.

Abstract: The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above.

Abstract: A tray-positioning device comprises a driving unit and a positioning unit, wherein the positioning unit provides a plurality of sidewalls that correspond to a plurality of upper sidewalls of a tray. By allowing the driving unit to move the positioning unit toward the tray or vice versa that said individual upper sidewalls are in close contact with the corresponding sidewalls, the tray-positioning device is capable of providing precise positioning for the tray.