Patents by Inventor Chao-nien Tung

Chao-nien Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7648267
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: August 22, 2006
    Date of Patent: January 19, 2010
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung
  • Patent number: 7637982
    Abstract: A group of powders (40) for making a wick structure of a heat pipe includes main powders (50) and supplemental powders (60). The melting point of the supplemental powder is lower than that of the main powder. During a sintering process, the powders are filled in a casing of the heat pipe and have a eutectic reaction between the main powders and the supplemental powders to form the wick structure. The temperature for the eutectic reaction is lower than the melting temperature of the supplemental powders.
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: December 29, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung
  • Patent number: 7637655
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: December 29, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7632010
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: August 24, 2006
    Date of Patent: December 15, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Xiao-Long Li, Chao-Nien Tung
  • Patent number: 7632009
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Grant
    Filed: July 20, 2006
    Date of Patent: December 15, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun
  • Patent number: 7631426
    Abstract: A powder feeding apparatus of manufacturing a heat pipe includes a vibration tray having a supporting board and a plurality of pipes positioned in the supporting board of the tray. A mandrel is coaxially inserted in each of the pipes. A feeder is located corresponding to an end of each pipe for feeding powder into the pipe. A vibration source drive the tray to vibrate along a direction perpendicular to an axial direction of each of the pipes when feeding the powder into the pipes from the feeders, whereby the pipes vibrate with substantially the same amplitude in the vibration direction.
    Type: Grant
    Filed: May 16, 2006
    Date of Patent: December 15, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chuen-Shu Hou, Chao-Nien Tung, Tay-Jian Liu, Cheng-Chi Lee
  • Publication number: 20090279821
    Abstract: A self-lubrication bearing structure includes a bearing, which is made from a porous material capable of absorbing and transferring a lubricating oil and which has a center axle hole for the passing of the shaft of a motor and multiple oil retaining grooves that retain a lubricating oil, and a casing surrounds the bearing around the shaft of the motor. During rotation of the shaft, the lubricating oil is caused to move out of the porous structure of the bearing to lubricate the shaft. When the rotation of the shaft is stopped, the lubricating oil flows back to the oil retaining grooves.
    Type: Application
    Filed: January 20, 2009
    Publication date: November 12, 2009
    Applicant: NEWCERA TECHNOLOGY CO., LTD.
    Inventors: Han-Ching Liu, Chao-Nien Tung, Lung-Wei Huang
  • Patent number: 7611276
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: November 3, 2009
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung, Qian-Hua He
  • Patent number: 7594749
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 14, 2006
    Date of Patent: September 29, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun, Hui-Fu Lee
  • Patent number: 7594537
    Abstract: A heat pipe includes a casing (100) containing a working fluid therein and a capillary wick (200) arranged on an inner wall of the casing. The casing includes an evaporating section (400) at one end thereof and a condensing section (600) at an opposite end thereof, and a central section (500) located between the evaporating section and the condensing section. The thickness of the capillary wick formed at the evaporating section is smaller than that of the capillary wick formed at the central section in a radial direction of the casing. The capillary wick is capable of reducing thermal resistance between the working fluid and the casing.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: September 29, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun
  • Patent number: 7559143
    Abstract: A powder feeding apparatus and a method of manufacturing a heat pipe are disclosed. The method includes: a) proving the powder feeding apparatus including a vibrating tray and a pump (800); b) positioning a tube in the vibrating tray; c) inserting a mandrel (400) into the tube from a first open end of the tube, wherein at least one groove (410) is defined in an end of the mandrel corresponding to a second open end of the tube; d) positioning a feeder (300) on the first end of the tube; e) driving the vibrating tray to vibrate and feeding powder into the tube from the feeder whilst the pump is operating to generate a forced airflow flowing from the first to the second open end of the tube. By using this method, bridging of the powder is prevented.
    Type: Grant
    Filed: July 7, 2006
    Date of Patent: July 14, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chuen-Shu Hou, Chao-Nien Tung, Tay-Jian Liu, Cheng-Chi Lee
  • Patent number: 7553072
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Grant
    Filed: July 13, 2006
    Date of Patent: June 30, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou, Cheng-Chi Lee
  • Patent number: 7553074
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement the movable portion relative to the immovable portion.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: June 30, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
  • Patent number: 7553073
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: June 30, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun
  • Patent number: 7552759
    Abstract: A loop-type heat exchange device (10) is disclosed, which includes an evaporator (20), a condenser (40), a vapor conduit (30) and a liquid conduit (50). The evaporator contains therein a working fluid. The working fluid in the evaporator evaporates into vapor after absorbing heat, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases its latent heat of evaporation and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The condenser defines therein a chamber, and a plurality of heat-exchange pins is provided inside the chamber for effectively exchanging heat with the vapor entering into the condenser.
    Type: Grant
    Filed: December 28, 2005
    Date of Patent: June 30, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Peng Lee, Chuen-Shu Hou, Chih-Hao Yang
  • Patent number: 7547139
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: June 16, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun, Hui-Fu Lee
  • Patent number: 7547138
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: July 26, 2006
    Date of Patent: June 16, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chih-Hsien Sun, Chuen-Shu Hou
  • Patent number: 7543380
    Abstract: A heat pipe includes a body with working fluid contained therein and a sealing structure forming on an end of the body. The sealing structure includes a single layer sealing portion formed at a distal end thereof. The sealing structure further comprises a two layer sealing portion connecting the single layer sealing portion to the body. The single layer and two layer sealing portions and the body are made of the same metallic material. A method for sealing the heat pipe, includes the steps of: (1) providing a metallic pipe with an end sealed and an opposite open portion; (2) pressing the open portion of the pipe to form a two layer sealing portion; (3) melting at least one part of the two layer sealing portion to form a single layer sealing portion.
    Type: Grant
    Filed: May 15, 2006
    Date of Patent: June 9, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chuen-Shu Hou, Cheng-Chi Lee, Chao-Nien Tung, Tay-Jian Liu
  • Patent number: 7537380
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: May 26, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Keng-Han Liu
  • Patent number: 7537048
    Abstract: An integrated liquid cooling system (100) includes a heat absorbing member (10), a heat dissipating member (20) and a pump (15). The heat absorbing member defines therein a fluid flow channel (115) for passage of a coolant and a pump receiving housing (120) adjacent to the fluid flow channel. The heat dissipating member is mounted to and maintained in fluid communication with the heat absorbing member. The pump is received in the pump receiving housing of the heat absorbing member. The pump is configured for driving the coolant to circulate through the heat absorbing member and the heat dissipating member. The heat absorbing member, the heat dissipating member and the pump of the liquid cooling system are combined together to form an integrated structure without utilizing any connecting pipes.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: May 26, 2009
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hao Yang, Chao-Nien Tung, Chuen-Shu Hou