Patents by Inventor Chao-nien Tung

Chao-nien Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070240855
    Abstract: A heat pipe includes a metal casing (100) having an evaporating section (400) and a condensing section (600). A composite wick structure is provided in the evaporating section. The composite wick structure comprises at least two wick layers in a radial direction of the heat pipe, and one of the at least two wick layers is a plurality of fine grooves (200) defined in an inner surface of the evaporating section. A singular wick structure is provided in the condensing section. An average capillary pore size of the evaporating section is smaller than that of the condensing section.
    Type: Application
    Filed: July 20, 2006
    Publication date: October 18, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUEN-SHU HOU, CHAO-NIEN TUNG, TAY-JIAN LIU
  • Publication number: 20070240854
    Abstract: A heat pipe and a method for producing the heat pipe are disclosed. The heat pipe includes a hollow metal casing and a honeycombed wick structure arranged at an inner surface of the hollow metal casing. The wick structure includes a plurality of slices stacked together. Each of the slices defines a plurality of pores therein to form a plurality of micro-channels in the wick structure, whereby porosity of the wick structure can be accurately controlled.
    Type: Application
    Filed: July 19, 2006
    Publication date: October 18, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU
  • Publication number: 20070240852
    Abstract: A heat pipe includes a hollow metal casing (10). The casing has an evaporating section (C) and a condensing section (A) at opposite ends thereof, and an adiabatic section (B) located between the evaporating section and the condensing section. A capillary wick structure (12) is arranged at an inner surface of the hollow metal casing. Two sealed heat reservoirs (20, 21) are respectively mounted on the evaporating and condensing sections of the heat pipe for increasing heat absorbing and dissipation areas of the heat pipe.
    Type: Application
    Filed: August 2, 2006
    Publication date: October 18, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU, CHIH-HSIEN SUN
  • Patent number: 7282678
    Abstract: An electric heating module includes an electric heater (10), a heat pipe (20) having an evaporating section (22) thermally attached to the electric heater and a condensing section (24), and at least one heat radiator (30, 40) thermally attached to the condensing section. The electric heater includes a pair of electrode plates (12, 14) and a heating element (16) sandwiched between and electrically connecting the electrode plates. An insulation frame (19) encloses the electrode plates therein for electrically insulating the electric heater from the heat radiator. For the non-linear PTC heating element, the electric heater can rapidly heat up to and stay at a desired stable temperature. The heat pipe can transfer heat from the electric heater to the heat radiator rapidly and timely by phase change.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: October 16, 2007
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Chao-Nien Tung, Chuen-Shu Hou, Chih-Hao Yang
  • Publication number: 20070235165
    Abstract: A heat pipe (10) includes a hollow metal casing (110). The casing has an evaporating section (120) and a condensing section (160) at opposing ends thereof, and an adiabatic section (140) located between the evaporating section and the condensing section. A capillary wick structure (130) is arranged at an inner surface of the hollow metal casing. A vapor channel (150) is defined along an axial direction of the heat pipe and surrounded by the capillary wick structure. The vapor channel includes a nozzle (154) defined at a boundary between the evaporating section and the adiabatic section, wherein the nozzle has a cross section which gradually reduces towards the condensing section.
    Type: Application
    Filed: July 21, 2006
    Publication date: October 11, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU, CHIH-HSIEN SUN
  • Publication number: 20070204975
    Abstract: A heat pipe includes a pipe containing phase changeable working media therein. A wick structure is located on an inner face of the pipe. A space is surrounded by the wick structure in the pipe. At least one muzzle with an inlet and an outlet is positioned inside the pipe; the inlet and the outlet are deferent in radius thereof.
    Type: Application
    Filed: July 20, 2006
    Publication date: September 6, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU, CHIH-HSIEN SUN
  • Publication number: 20070195854
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Application
    Filed: August 29, 2006
    Publication date: August 23, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung, Qian-Hua He
  • Publication number: 20070193722
    Abstract: A heat pipe includes a casing (100) containing a working fluid therein and a capillary wick (200) arranged in an inner wall of the casing. The casing includes an evaporating section (400) at one end thereof and a condensing section (600) at an opposite end thereof, and a central section (500) located between the evaporating section and the condensing section. The thickness of the capillary wick formed at the condensing section is smaller than that of the capillary wick formed at the central section in a radial direction of the casing. The capillary wick is capable of reducing the thermal resistance between the working fluid and the casing at the condensing section.
    Type: Application
    Filed: July 19, 2006
    Publication date: August 23, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUEN-SHU HOU, TAY-JIAN LIU, CHAO-NIEN TUNG, CHIH-HSIEN SUN
  • Publication number: 20070193723
    Abstract: A heat pipe includes a casing (100) containing a working fluid therein and a capillary wick (200) arranged on an inner wall of the casing. The casing includes an evaporating section (400) at one end thereof and a condensing section (600) at an opposite end thereof, and a central section (500) located between the evaporating section and the condensing section. The thickness of the capillary wick formed at the evaporating section is smaller than that of the capillary wick formed at the central section in a radial direction of the casing. The capillary wick is capable of reducing thermal resistance between the working fluid and the casing.
    Type: Application
    Filed: July 19, 2006
    Publication date: August 23, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHUEN-SHU HOU, TAY-JIAN LIU, CHAO-NIEN TUNG, CHIH-HSIEN SUN
  • Publication number: 20070165692
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is telescopically mounted in at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Application
    Filed: July 21, 2006
    Publication date: July 19, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: TAY-JIAN LIU, CHUEN-SHU HOU, CHAO-NIEN TUNG, QIAN-HUA HE
  • Publication number: 20070160111
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement the movable portion relative to the immovable portion.
    Type: Application
    Filed: August 3, 2006
    Publication date: July 12, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHIH-HSIEN SUN, CHAO-NIEN TUNG, CHUEN-SHU HOU
  • Publication number: 20070158051
    Abstract: A cooling system for removing heat from a heat generating component, includes a base (100) and a heat sink (200) mounted on the base. The base includes a bottom wall (20) and a side wall (10) surrounding the bottom wall. The bottom wall and the side wall cooperatively define a space (40) receiving working fluid therein. The heat sink defines an evaporating passage (220) and a condensing passage (230) therein. The two passages are in fluid communication with the space. Cooperatively the space and the passages define a loop for circulating the working fluid therein. The working fluid has a phase change for dissipating heat generated by a heat-generating electronic component.
    Type: Application
    Filed: July 21, 2006
    Publication date: July 12, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: CHIH-HAO YANG, CHAO-NIEN TUNG, CHUEN-SHU HOU, TAY-JIAN LIU
  • Publication number: 20070160109
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Application
    Filed: July 20, 2006
    Publication date: July 12, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU, CHIH-HSIEN SUN
  • Publication number: 20070160110
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.
    Type: Application
    Filed: August 3, 2006
    Publication date: July 12, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU, CHIH-HSIEN SUN
  • Publication number: 20070147465
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion to detect the temperature of the evaporating section of the heat pipe. An enclosure encloses the immovable portion and the movable portion therein and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.
    Type: Application
    Filed: July 25, 2006
    Publication date: June 28, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHIH-HSIEN SUN, CHUEN-SHU HOU, CHENG-CHI LEE
  • Publication number: 20070147470
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of the heat pipe, and a movable portion capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion and slideably receives the movable portion therein for avoiding the movable portion from deviating from the immovable portion during movement of the movable portion relative the immovable portion. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.
    Type: Application
    Filed: July 19, 2006
    Publication date: June 28, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHIH-HSIEN SUN, CHAO-NIEN TUNG, CHUEN-SHU HOU
  • Publication number: 20070137321
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Application
    Filed: July 27, 2006
    Publication date: June 21, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hsien Sun, Hui-Fu Lee
  • Publication number: 20070140313
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein for cooling the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion to detect a temperature of the heat pipe.
    Type: Application
    Filed: July 14, 2006
    Publication date: June 21, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU, CHIH-HSIEN SUN, HUI-FU LEE
  • Publication number: 20070133655
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. At least one temperature sensor is attached to at least one of the immovable portion and the movable portion. The least one temperature sensor has a detecting section exposed in the receiving structure for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.
    Type: Application
    Filed: July 13, 2006
    Publication date: June 14, 2007
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHIH-HSIEN SUN, CHUEN-SHU HOU, CHENG-CHI LEE
  • Publication number: 20070131041
    Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a cooling structure defined therein. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe. A positioning structure extends from at least one of the immovable portion and the movable portion to ensure that the receiving structure is capable of precisely receiving the heat pipe therein. Temperature sensors are attached to the immovable portion and the movable portion to detect a temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space for movement of the movable portion relative to the immovable portion.
    Type: Application
    Filed: July 27, 2006
    Publication date: June 14, 2007
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou, Keng-Han Liu