Patents by Inventor Chao-nien Tung
Chao-nien Tung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7430804Abstract: A method of manufacturing a heat pipe, including the steps of: providing a hollow body with an open end and an opposite close end; filling a predetermined quantity of working fluid into the hollow body through the open end thereof after an interior of the hollow body having been evacuated to a predetermined vacuum degree; and sealing the open end of the hollow body.Type: GrantFiled: April 26, 2006Date of Patent: October 7, 2008Assignee: Foxconn Technology Co., Ltd.Inventors: Chuen-Shu Hou, Chao-Nien Tung, Tay-Jian Liu
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Patent number: 7418996Abstract: An integrated liquid cooling system (100) includes a heat absorbing member (10), a heat dissipating member (20) and a pump (15). The heat absorbing member defines therein a fluid flow channel (115) for passage of a coolant. The heat dissipating member is mounted to and maintained in fluid communication with the heat absorbing member. The pump is received in the heat dissipating member and is maintained in fluid communication with the heat absorbing member and the heat dissipating member. The pump is configured for driving the coolant to circulate through the heat absorbing member and the heat dissipating member. The components (i.e., the heat absorbing member, the heat dissipating member and the pump) of the liquid cooling system are combined together to form an integrated structure without utilizing any separate connecting pipes.Type: GrantFiled: March 15, 2006Date of Patent: September 2, 2008Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hao Yang, Chao-Nien Tung, Chuen-Shu Hou
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Patent number: 7380585Abstract: A loop-type heat exchange module (10) is disclosed, which includes an evaporator (11), a vapor conduit (12), a condenser (13), a liquid conduit (14), a cooling fan (16), a fastening seat (151) and a fan cover (152). The evaporator contains therein a working fluid. The working fluid evaporates into vapor after absorbing heat in the evaporator, and the generated vapor flows, via the vapor conduit, to the condenser where the vapor releases the heat and is condensed into condensate. The condensate then returns back, via the liquid conduit, to the evaporator to thereby form a heat transfer loop. The cooling fan is applied to produce a forced airflow towards the condenser. The fastening seat is used for fastening the evaporator to have an intimate contact with a heat-generating electronic component. The fan cover extends from one side of the fastening seat and receives the cooling fan and the condenser therein.Type: GrantFiled: December 25, 2005Date of Patent: June 3, 2008Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou, Chih-Hao Yang
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Patent number: 7379301Abstract: An integrated liquid cooling system for removing heat from a heat-generating component includes a base (10), a pump (20) mounted in the base and a heat-dissipating member (30) communicating with the pump and coupling with the base. The pump includes a casing (21) having a chamber (212). A rotor (22), a partition seat (23) and a stator (24) are in turn received in the chamber. A top cover (25) is attached on the casing. The casing includes a bottom plate (214) having a bottom surface. The bottom surface of the bottom plate contacts the heat-generating electronic component for absorbing heat generated by the electronic component.Type: GrantFiled: May 12, 2006Date of Patent: May 27, 2008Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chao-Nien Tung, Chuen-Shu Hou
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Patent number: 7374334Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe needing to be tested. A movable portion is capable of moving relative to the immovable portion. A receiving structure is located between the immovable portion and the movable portion for receiving the heat pipe therein. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions and has sidewalls thereof slidably contacting at least one of the immovable portion and the movable portion.Type: GrantFiled: June 15, 2006Date of Patent: May 20, 2008Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hsien Sun, Chao-Nien Tung, Chuen-Shu Hou
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Patent number: 7360583Abstract: An integrated liquid cooling system (100) includes a pump (10), a mounting base (15), a heat dissipating member (20). The mounting base defines therein a through hole (151). The heat dissipating member is mounted to and maintained in fluid communication with the mounting base. The pump is received in the through hole of the mounting base. The pump has a bottom plate for thermally contacting a heat generating component and is configured for driving a coolant to circulate through the mounting base and the heat dissipating member. The pump, the mounting base and the heat dissipating member of the liquid cooling system are combined together to form an integrated and compact structure without utilizing any connecting pipes or fittings.Type: GrantFiled: March 15, 2006Date of Patent: April 22, 2008Assignee: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chih-Hao Yang, Chao-Nien Tung, Chuen-Shu Hou
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Publication number: 20080012308Abstract: A heat pipe includes a body with working fluid contained therein and a sealing structure forming on an end of the body. The sealing structure includes a single layer sealing portion formed at a distal end thereof. The sealing structure further comprises a two layer sealing portion connecting the single layer sealing portion to the body. The single layer and two layer sealing portions and the body are made of the same metallic material. A method for sealing the heat pipe, includes the steps of: (1) providing a metallic pipe with an end sealed and an opposite open portion; (2) pressing the open portion of the pipe to form a two layer sealing portion; (3) melting at least one part of the two layer sealing portion to form a single layer sealing portion.Type: ApplicationFiled: May 15, 2006Publication date: January 17, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHUEN-SHU HOU, CHENG-CHI LEE, CHAO-NIEN TUNG, TAY-JIAN LIU
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Publication number: 20070295485Abstract: A heat pipe includes a shell containing a working fluid therein, a capillary wick arranged within the shell and a vapor channel. The shell includes an evaporating section, a condensing section and an adiabatic section located between the evaporating section and the condensing section. The capillary wick includes a first segment occupying the whole of the evaporating section, a second segment and a third segment received in the condensing section and connected to the first segment by the second segment. The vapor channel is defined between the second segment of the capillary wick and the shell.Type: ApplicationFiled: August 22, 2006Publication date: December 27, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU
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Publication number: 20070283771Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a first heating member located therein for heating an evaporating section of the heat pipe. A movable portion is capable of moving relative to the immovable portion and has a second heating member located therein for heating the evaporating section. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein.Type: ApplicationFiled: August 29, 2006Publication date: December 13, 2007Applicant: Foxconn Technology Co., Ltd.Inventors: Tay-Jian Liu, Chuen-Shu Hou, Chao-Nien Tung
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Publication number: 20070286258Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member located therein for heating an evaporating section of the heat pipe. The movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section therein. A positioning structure extends from the immovable portion toward the movable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable and movable portions for detecting temperature of the heat pipe. An enclosure encloses the immovable portion and the movable portions therein, and defines a space therein for movement of the movable portion relative to the immovable portion.Type: ApplicationFiled: August 24, 2006Publication date: December 13, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TAY-JIAN LIU, CHUEN-SHU HOU, XIAO-LONG LI, CHAO-NIEN TUNG
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Publication number: 20070286257Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a heating member located therein for heating an evaporating section of a heat pipe requiring testing. A movable portion is capable of moving relative to the immovable portion and has a heating member therein for heating the evaporating section of the heat pipe. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A positioning structure extends from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. Temperature sensors are attached to the immovable portion and the movable portion for detecting temperature of the heat pipe.Type: ApplicationFiled: August 23, 2006Publication date: December 13, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TAY-JIAN LIU, CHUEN-SHU HOU, XIAO-LONG LI, CHAO-NIEN TUNG
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Publication number: 20070286256Abstract: A performance testing apparatus for a heat pipe includes an immovable portion and a movable portion each having a heating member for heating an evaporating section of a heat pipe requiring test. The movable portion is movable relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the evaporating section of the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion to ensure the receiving structure being capable of receiving the heat pipe precisely. Temperature sensors are attached in the immovable portion and the movable portion for detecting temperature of the heat pipe.Type: ApplicationFiled: August 22, 2006Publication date: December 13, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TAY-JIAN LIU, CHUEN-SHU HOU, CHAO-NIEN TUNG
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Publication number: 20070277963Abstract: A heat pipe includes a hollow metal casing (100) and a honeycombed wick structure (200) arranged at an inner surface of the hollow metal casing. The wick structure includes a plurality of slices (210, 220) stacked together. Each of the slices has a plurality of pores therein and a plurality of protrusions (222) formed thereon along a longitudinal direction of the heat pipe to form a plurality of liquid channels (230) in the wick structure along the longitudinal direction of the heat pipe. Each liquid channel has alternate large and small sections (232, 231) along a length thereof.Type: ApplicationFiled: August 4, 2006Publication date: December 6, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHUEN-SHU HOU, TAY-JIAN LIU, CHAO-NIEN TUNG
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Publication number: 20070267178Abstract: A heat pipe includes a casing (100) having an inner surface. A capillary wick (200) is attached to the inner surface of casing. The casing includes an evaporating section (400) for receiving heat, a condensing section (600) for releasing the heat and an adiabatic section (500) for transferring the heat from the evaporating section to the condensing section. The evaporating and condensing sections are made of metal material and the adiabatic section is made of nonmetallic material.Type: ApplicationFiled: July 28, 2006Publication date: November 22, 2007Applicant: Foxconn Technology Co., Ltd.Inventors: CHUEN-SHU HOU, CHAO-NIEN TUNG, TAY-JIAN LIU
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Publication number: 20070251673Abstract: A heat pipe includes a casing (100) and a capillary wick (200) received in the casing. The casing has an evaporating section (400), a condensing section (600) and a central section (500) between the evaporating section and the condensing section. The capillary wick arranged at the central section is made of non-metallic material. The capillary wick at the central section of the casing provides a low cost and a lightweight to the heat pipe.Type: ApplicationFiled: August 24, 2006Publication date: November 1, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHUEN-SHU HOU, CHAO-NIEN TUNG, TAY-JIAN LIU
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Publication number: 20070246194Abstract: A heat pipe includes a metal casing (100) and a composite capillary wick received in the casing. The casing has an evaporating section (400), a condensing section (600) and a central section (500) between the evaporating section and the condensing section. A first type of capillary wick (250) is provided in the central section of casing and a second type of capillary wick (240) is disposed at the evaporating section of the casing. The capillary pore size of the first type of capillary wick is larger than that of the second type of capillary wick and the first type of capillary wick is made by stacked metal sheets.Type: ApplicationFiled: August 11, 2006Publication date: October 25, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Chuen-Shu Hou, Tay-Jian Liu, Chao-Nien Tung, Xian-Mei Ke, Chih-Hsien Sun
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Publication number: 20070240856Abstract: A heat pipe includes a hollow metal casing (10). The casing has an evaporating section (120) and a condensing section (160) at opposite ends thereof, and an adiabatic section (140) located between the evaporating section and the condensing section. A capillary wick (12) is arranged at an inner surface of the hollow metal casing. A working fluid is received in the metal casing. A sealed heat reservoir (20) is mounted on the condensing section of the heat pipe to increase heat dissipation area of the heat pipe. The heat reservoir has a capillary wick structure (22) and a working fluid therein.Type: ApplicationFiled: July 25, 2006Publication date: October 18, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU, CHIH-HSIEN SUN
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Publication number: 20070240851Abstract: A heat pipe includes a hollow metal casing (10). The casing has an evaporating section (120) and a condensing section (160) at respective opposite ends thereof, and an adiabatic section (140) located between the evaporating section and the condensing section. A capillary wick structure (12) is arranged at an inner surface of the hollow metal casing. A sealed heat reservoir (20) is mounted on the evaporating section of the heat pipe to increase heat absorbing area of the heat pipe. The heat reservoir has working fluid and a capillary wick structure (22) therein. Heat generated by a heat source is first absorbed by the heat reservoir and then transferred to the evaporating section of the metal casing.Type: ApplicationFiled: July 25, 2006Publication date: October 18, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: TAY-JIAN LIU, CHAO-NIEN TUNG, CHUEN-SHU HOU, Ji-Feng Wang, Qian-Hua He
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Publication number: 20070240858Abstract: A heat pipe includes a metal casing (100) and a composite capillary wick received in the casing. The metal casing has an evaporating section (400), a condensing section (600) and a central section (500) between the evaporating section and the condensing section. First type of capillary wick (200) is provided on an inner all of the metal casing at all of the condensing, central and evaporating sections, while second type of capillary wick (220) is provided on the first type of capillary wick at the central and evaporating sections only. A capillary pore size of the first type of capillary wick is larger than that of the second type of capillary wick.Type: ApplicationFiled: August 11, 2006Publication date: October 18, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: Chuen-Shu Hou, Tay-Jian Liu, Qian-Hua He, Chih-Hsien Sun, Chao-Nien Tung
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Publication number: 20070240857Abstract: A heat pipe includes a cylinder-shaped casing (100) containing a working fluid therein and a capillary wick (200) arranged on an inner wall of the casing. The capillary wick encloses a vapor passage (300) in a center of the casing. The capillary wick includes a plurality of shaped foils stacked on the inner wall of the casing along a radial direction thereof. The foils are sintered to the inner wall of the casing and define a multi-channel structure for the working fluid to flow from a condensing section to an evaporating section of the heat pipe.Type: ApplicationFiled: August 2, 2006Publication date: October 18, 2007Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: CHUEN-SHU HOU, TAY-JIAN LIU, CHAO-NIEN TUNG, CHIH-HSIEN SUN