Abstract: EMI-proof server chassis preventing EMI on an electronic component, includes a chassis and a double aperture flexible piece. The chassis includes a connection portion connected to the chassis, a first engagement portion and a second engagement portion. The first engagement portion and the second engagement portion are connected to and disposed on two sides of the connection portion. The first engagement portion and the second engagement portion are parallelly prolonged, and substantially opposite to each other. The double aperture flexible piece, shaped as a curvature plate, has a first aperture and a second aperture on two sides. The first engagement portion and the second engagement portion are engaged to the first aperture and the second aperture respectively, and the portion of the double aperture flexible piece between the first aperture and the second aperture is curved toward the electronic component, and contact with the electronic component.

Abstract: Systems and methods are provided for audio encoding. For example, first quantization encoding is performed on audio data associated with a current frame of an audio data stream to obtain first quantization-encoded data; second quantization encoding is performed on the audio data to obtain second quantization-encoded data; the first quantization-encoded data is coupled to the current frame of the audio data stream; and the second quantization-encoded data is coupled to a next frame of the audio data stream.

Abstract: A display device comprises a cover and a display module. The cover includes a bottom plate and at least one cover limit element. The cover limit element projects inwardly from an inner surface of the bottom of the cover. A space is formed between the bottom plate and the cover limit element. The display module includes a frame with at least one frame limit element disposed at an end of the frame and projecting at a position between the cover limit element and the bottom plate. The frame limit element is configured to be disposed in the space and between the cover limit element and the bottom plate to retain the display module with the cover.

Abstract: Polymers including ?-hydroxymethylacrylate units and methods of preparing polymers from ?-hydroxymethylacrylates are provided. Advantageously, ?-hydroxymethylacrylates may be used in an emulsion polymerization and function as a polymerizable surfactant. The ability of the ?-hydroxymethylacrylates to be used as a polymerizable surfactant allows for emulsion polymerization systems to be prepared without other surfactants.

Abstract: A fan module includes a casing, a fan, and two vibration absorption assemblies. The casing has an accommodating space. The fan is located in the accommodating space and keeps a distance from the casing. Each of the two vibration absorption assemblies includes two first vibration absorption components and a second vibration absorption component. The two first vibration absorption components are respectively in contact with the fan and separated from the casing, respectively. The second vibration absorption component is connected with two first vibration absorption components and the casing, respectively. The first vibration absorption components and the second vibration absorption components are adapted for absorbing the vibration waves having different frequency ranges.

Abstract: A method of preparing a polymer is provided comprising preparing a Baylis-Hillman adduct by reacting an activated alkene with a carbon electrophile; and polymerizing the Baylis-Hillman adduct. The Baylis-Hillman reaction provides an efficient platform for the synthesis of densely functionalized monomers, from which polymers with multiple functional groups can be readily synthesized. It has been discovered that that Baylis-Hillman adducts are versatile monomers for both controlled radical and step-growth polymerizations.

Abstract: A method of removing copper oxide from copper surfaces is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.

Abstract: Systems and methods are provided for audio encoding. For example, first quantization encoding is performed on audio data associated with a current frame of an audio data stream to obtain first quantization-encoded data; second quantization encoding is performed on the audio data to obtain second quantization-encoded data; the first quantization-encoded data is coupled to the current frame of the audio data stream; and the second quantization-encoded data is coupled to a next frame of the audio data stream.

Abstract: A device, medium and method for deblending seismic data associated with a subsurface of the earth. The method includes a step of receiving seismic data S recorded with one or more seismic receivers, wherein the seismic data S includes shot recordings generated by first and second source arrays that are simultaneously actuated; a step of detecting incoherent energy of the seismic data S using a median filter; a step of replacing incoherent parts of the seismic data with a projection filter to obtain deblended data for one of the two or more source arrays; and a step of generating in a computing device an image of the subsurface based on the deblended data.

Abstract: A method of activating a copper seed layer during a plating process is disclosed that comprises application of vapor generated by an ultrasonic wave nebulizer. The energized vapor droplets include water and a weak organic acid such as acetic acid, lactic acid, citric acid, uric acid, oxalic acid, or formic acid that have a vapor pressure proximate to that of water. The weak organic acid preferably has a pKa high enough to avoid Cu etching but is sufficiently acidic to remove copper oxide at a rate that is compatible with high throughput manufacturing. In one embodiment, weak acid/water vapor is applied to a substrate in a spin bowl and is followed by a deionized water rinse step in the same spin bowl. Improved wettability results in improved uniformity in subsequently plated copper films. Considerable cost savings is realized as a result of reduced chemical consumption and higher product yields.

Abstract: Provided is a method for detecting an audio input interface, comprising: acquiring input signals of every one of audio input interfaces; acquiring energy values of said input signals of every one of said audio input interfaces, and acquiring an interface identification of the audio input interface of which the energy value is the maximum among the energy values; adding said interface identification acquired herein into an identification sequence in an order by acquiring time; and identifying the audio input interface, of which the interface identification is saved most often in said identification sequence, as a valid audio input interface. Also provided is a system for detecting an audio input interface. The present disclosure is capable of effectively identifying the audio input interface connected to the microphone that the user is using, so that the user does not need to switch manually.

Abstract: A display device comprises a cover and a display module. The cover includes a bottom plate and at least one cover limit element. The cover limit element projects inwardly from an inner surface of the bottom of the cover. A space is formed between the bottom plate and the cover limit element. The display module includes a frame with at least one frame limit element disposed at an end of the frame and projecting at a position between the cover limit element and the bottom plate. The frame limit element is configured to be disposed in the space and between the cover limit element and the bottom plate to retain the display module with the cover.

Abstract: A plastic bezel is disclosed. The plastic bezel includes a plate body and a plurality of bosses connected to the plate body. The plate body has a plate thickness. Each of the bosses has an opening and an accommodating hole inwardly formed from the opening. The accommodating hole is configured to engage an insert nut of which the type is #6-32. Each of the bosses has a wall thickness. The wall thickness is equal to or larger than 1.5 mm, and the plate thickness is 1.6-2 times of the wall thickness.

Abstract: A metal plate reinforcement method includes: (a) providing a metal plate, in which the metal plate has a first surface and a second surface opposite to each other; (b) stamping the metal plate to form a plurality of first protruding portions protruding from the first surface; (c) respectively stamping the first protruding portions so as to respectively form a plurality of second protruding portions protruding at the second surface; and (d) flattening the second protruding portions to restore the metal plate.

Abstract: A base frame includes a base plate, a first side plate, and a second side plate. The base plate has a first edge and a second edge. The base plate includes a plurality of V-shaped reinforcing ribs. Each V-shaped reinforcing rib has a first end and a second end. The first and second ends are located at the first and second edges, respectively. The first side plate is connected to the first edge and has a plurality of first through holes. Each first through hole is locationally configured next to the first edge and faces to the corresponding first end. The second side plate is connected to the second edge and has a plurality of second through holes. Each second through hole is locationally configured next to the second edge and faces to the corresponding second end.

Abstract: A position-limiting mechanism includes a first position-limiting element, a second position-limiting element, and a knob. The first and second position-limiting elements and the knob are slidably configured on a main body. A first component and a second component are secured to the main body by the first and second position-limiting elements, respectively. The knob is movably connected to the first and second position-limiting elements. When the knob slides relatively to the main body along a first direction, the knob drives the first position-limiting element to release the first component. When the knob slides relatively to the main body along a second direction, the knob drives the second position-limiting element to release the second component.

Abstract: An electroplating method is disclosed that selectively deposits a greater thickness of a metal or alloy layer on a region of wafer that has a higher thickness loss during a subsequent chemical mechanical polish process. A paddle assembly has three rectangular sides joined at their edges to form a triangle shape from an end view, and a notch in a bottom side that faces a wafer during the plating process. The notch extends along second and third paddle sides to a height up to about 50% of the paddle thickness. The thickness in a K-block region that has two sides formed parallel to the wafer flat is selectively increased by aligning a first side of the paddle notch side directly over one K-block side and aligning a second notch side directly over a second K-block side during a paddle movement cycle. The notch may be rectangular shaped or tapered.

Abstract: A circuit (236, 300, 400, 536) is provided for an apparatus (200, 500) configured to convert an AC signal to a DC signal for driving at least one light source (240, 540). The circuit includes a damping element (350, 450) configured to damp a current in the apparatus during time periods when the current exceeds a threshold, and a bypass path (340, 440) for bypassing the damping element during time periods when the current does not exceed the threshold.

Abstract: A fan module includes a casing, a fan, and two vibration absorption assemblies. The casing has an accommodating space. The fan is located in the accommodating space and keeps a distance from the casing. Each of the two vibration absorption assemblies includes two first vibration absorption components and a second vibration absorption component. The two first vibration absorption components are respectively in contact with the fan and separated from the casing, respectively. The second vibration absorption component is connected with two first vibration absorption components and the casing, respectively. The first vibration absorption components and the second vibration absorption components are adapted for absorbing the vibration waves having different frequency ranges.

Abstract: A fan structure includes a casing, a fan, and two elastic members. The casing has an accommodation space. The fan is located in the accommodation space. The fan has a first side and a second side opposite to each other. One of the two elastic members is sandwiched between the casing and the first side of the fan. The other one of the two elastic members is sandwiched between the casing and the second side of the fan. The two elastic members normally keep the fan away from the casing, so as to make the fan contact the casing through the two elastic members, thereby achieving a damping effect.