Patents by Inventor Chao Peng
Chao Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20110171429Abstract: The present invention discloses a low gloss surface decorative film comprising a dulling layer and a releasing layer. The dulling layer has a plurality of dulling particles secured therein and has a dulling surface on one side thereof. The dulling particles are distributed in the dulling layer and make the dulling surface have a plurality of protrusions and recessions. The releasing layer is formed on the dulling surface of the dulling layer and adheres to a hard layer or an ink layer. The hard layer has a first protrusion-recession surface complementary to the dulling surface.Type: ApplicationFiled: January 12, 2010Publication date: July 14, 2011Inventors: Ming-Hung HUANG, Chao-Peng Tseng, Chih-Yuan Liao
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Publication number: 20110094888Abstract: A method of rejuvenating a Ru plating seed layer during write pole fabrication in a PMR head is disclosed that involves forming an opening in a mold forming layer. A Ru seed layer is deposited by CVD within the opening and on a top surface of the mold forming layer. The substrate with the Ru seed layer is immersed in an acidic solution and an electric potential is applied for 1 to 2 minutes such that hydrogen is generated to reduce ruthenium oxides to Ru metal on the seed layer surface in an activation step. One or more surfactants are used to improve wettability of the Ru layer. The substrate is transferred directly to an electroplating solution without drying following the activation step to minimize exposure to oxygen that could regenerate oxides on the surface of the Ru layer. As a result, write pole voids and delamination are significantly reduced.Type: ApplicationFiled: October 26, 2009Publication date: April 28, 2011Inventors: Chao-Peng Chen, Chien-Li Lin, Jas Chudasama, Situan Lam
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Publication number: 20110068240Abstract: An interface card fixing device for fixing an interface card in a case of a computer device is presented. The interface card fixing device includes a body and a pressing member. The body is fixed on the case, and has an accommodation slot, and a guiding slot crossing the accommodation slot. The interface card slides within the guiding slot to a combination position. A pivoting end of the pressing member is pivotally connected to the body, such that a pressing end of the pressing member relatively pivotally rotates to a pressing position, and is fixed in the accommodation slot. The pressing end and the pivoting end form an angle, so as to press against the interface card to maintain the interface card at the combination position.Type: ApplicationFiled: September 18, 2009Publication date: March 24, 2011Inventors: Chun Ying Yang, Ying Chao Peng
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Publication number: 20110011744Abstract: A method of forming a write pole in a PMR head is disclosed that involves forming an opening in a mold forming layer. A conformal Ru seed layer is formed within the opening and on a top surface. An auxiliary layer made of CoFeNi or alloys thereof is formed as a conformal layer on the seed layer. All or part of the auxiliary layer is removed in an electroplating solution by applying a (?) current or voltage during an activation step that is controlled by activation time. Thereafter, a magnetic material is electroplated with a (+) current to fill the opening and preferably has the same CoFeNi composition as the auxiliary layer. The method avoids Ru oxidation that causes poor adhesion to CoFeNi, and elevated surfactant levels that lead to write pole impurities. Voids in the plated material are significantly reduced by forming a seed layer surface with improved wettability.Type: ApplicationFiled: July 17, 2009Publication date: January 20, 2011Inventors: Chao-Peng Chen, Jas Chudasama, Situan Lam, Chien-Li Lin
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Patent number: 7864490Abstract: The series resistance of a CPP GMR stack can be reduced by shaping it into a small upper, on a somewhat larger, lower part. Because of the sub-micron dimensions involved, good alignment between these is normally difficult to achieve. The present invention discloses a self-alignment process based on first laying down a mask that will determine the shape of the top part. Ion beam etching is then initiated, the ion beam being initially applied from one side only at an angle to the surface normal. During etching, all material on the near side of the mask gets etched but, on the far side, only material that is outside the mask's shadow gets removed so, depending on the beam's angle, the size of the lower part is controlled and the upper part is precisely centrally aligned above it.Type: GrantFiled: September 18, 2007Date of Patent: January 4, 2011Assignee: Headway Technologies, Inc.Inventors: Jeiwei Chang, Stuart Kao, Chao Peng Chen, Chunping Luo, Kochan Ju, Min Li
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Publication number: 20100249624Abstract: The present invention relates to a device for analyzing quality of sleep, which contains multiple electrode patches attached to human body and an electro-cardio measurement unit connected with the electrode patches. The device of the present invention provides an electro-cardio signal by the multiple electrode patches attached to human body and analyzes the electro-cardio signal by an analyzing unit to know the quality of sleep.Type: ApplicationFiled: March 25, 2010Publication date: September 30, 2010Applicant: PLATINUM TEAM CO., LTD.Inventors: Yung-Kang PENG, Wei-Chao Peng
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Patent number: 7781152Abstract: A method for forming a bi-layer lift-off mask, including a hardened photoresistive stencil layer on a PMGI layer, for use in fabricating GMR read-head sensors with trackwidths of less than 0.1 microns and TMJ MRAM devices of similar critical dimensions. The stencil portion of the mask includes a narrow portion with sharply defined edge and corners which are formed, without rounding or extreme undercut, by a photolithographic process which includes the formation, in a first development process, of auxiliary pattern pieces over the corners of the stencil and a subsequent oxidation in ozone for removing those auxiliary pattern pieces and obtaining sharply defined edge and corners and a controlled dissolution of the PMGI layer.Type: GrantFiled: July 28, 2004Date of Patent: August 24, 2010Assignee: Headway Technologies, Inc.Inventors: Chao-Peng Chen, Rina Kaji, Jei-Wei Chang
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Publication number: 20100108240Abstract: A method of forming an electrode having an electrochemical catalyst layer is disclosed. The method includes etching a surface of a substrate, followed by immersing the substrate in a solution containing surfactants to form a conditioner layer on the surface of the substrate, and immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioner layer.Type: ApplicationFiled: October 29, 2009Publication date: May 6, 2010Applicant: TRIPOD TECHNOLOGY CORPORATIONInventors: Tzu-Chien WEI, Hai-Peng CHENG, Shien-Ping FENG, Jo-Lin LAN, Chao PENG, Wen-Chi HSU, Ya-Huei CHANG, Wen-Hsiang CHEN
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Publication number: 20100101623Abstract: A packaging structure with a box for containing at least a portable electronic device is provided. The box has plates, which are connected to one another and surrounded to form an opening for the portable electronic device passing through, and a lid selectively covering or exposing the opening. First solar cells each fastened on an inner surface of each plate in the box. At least a cable electrically connects the first solar cells and is operated for electrically connecting the portable electronic device.Type: ApplicationFiled: March 10, 2009Publication date: April 29, 2010Applicant: TRIPOD TECHNOLOGY CORPORATIONInventors: Tzu-Chien WEI, Chao PENG, Jo-Lin LAN, Ya-Huei CHANG, Wen-Chi HSU, Hai-Peng CHENG, Shien-Ping FENG, Wen-Hsiang CHEN
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Publication number: 20100101644Abstract: Disclosed herein is a dye-sensitized solar cell. The dye-sensitized solar cell includes a semiconductor electrode with a dye adsorbed thereon; a counter electrode; and an electrolyte composition provided between the semiconductor electrode and the counter electrode; wherein the electrolyte composition comprises an oxidation-reduction mediator and a eutectic ionic liquid including a choline halide or derivatives thereof mixed with alcohols or urea.Type: ApplicationFiled: October 23, 2009Publication date: April 29, 2010Applicant: TRIPOD TECHNOLOGY CORPORATIONInventors: Huei-Ru JHONG, Hai-Peng CHENG, Shien-Ping FENG, Jo-Lin LAN, Chao PENG, Tzu-Chien WEI, Wen-Chi HSU, Ya-Huei CHANG, Wen-Hsiang CHEN
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Publication number: 20100071839Abstract: A method of forming an electrode including an electrochemical catalyst layer is disclosed, which comprises forming a graphitized porous conductive fabric layer, optionally conditioning the graphitized porous conductive fabric layer, and dipping the graphitized porous conductive fabric layer into a solution containing a plurality of polymer-capped noble metal nanoclusters dispersed therein. The polymer-capped noble metal nanoclusters as an electrochemical catalyst layer are adsorbed onto the graphitized porous conductive fabric layer. An electrochemical device with the electrode made thereby is also contemplated.Type: ApplicationFiled: February 6, 2009Publication date: March 25, 2010Applicant: TRIPOD TECHNOLOGY CORPORATIONInventors: Hai-Peng CHENG, Shien-Ping FENG, Jo-Lin LAN, Chao PENG, Tzu-Chien WEI, Wen-Chi HSU, Ya-Huei CHANG, Wen-Hsiang CHEN
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Publication number: 20100071759Abstract: A method of forming an electrode including an electrochemical catalyst layer is disclosed, which comprises forming a graphitized porous conductive fabric layer, optionally conditioning the graphitized porous conductive fabric layer, and dipping the graphitized porous conductive fabric layer into a solution containing polymer-capped noble metal nanoclusters dispersed therein. The polymer-capped noble metal nanoclusters as an electrochemical catalyst layer are adsorbed onto the graphitized porous conductive fabric layer. An electrochemical device with the electrode made thereby is also contemplated.Type: ApplicationFiled: February 10, 2009Publication date: March 25, 2010Applicant: TRIPOD TECHNOLOGY CORPORATIONInventors: Hai-Peng CHENG, Shien-Ping FENG, Jo-Lin LAN, Chao PENG, Tzu-Chien WEI, Wen-Chi HSU, Ya-Huei CHANG, Wen-Hsiang CHEN
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Patent number: 7633712Abstract: A write pole for vertical magnetic recording is described. It includes a trapezoidal prism of high magnetic moment material, having inwardly sloping sidewalls. Its parallel surfaces are between about 0.1 and 0.3 microns apart and the sidewalls slope in the range of 15.5 to 60 degrees relative to vertical.Type: GrantFiled: April 10, 2008Date of Patent: December 15, 2009Assignee: Headway Technologies, Inc.Inventors: Chao-Peng Chen, Jei-Wei Chang, Xiaohong Yang
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Publication number: 20090263569Abstract: A method of forming an electrode having an electrochemical catalyst layer is disclosed, which comprises providing a substrate with a conductive layer formed on the surface of a substrate, conditioning the surface of the substrate, immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioned surface of the substrate, and thermally treating the polymer-protected electrochemical catalyst layer at a temperature approximately below 300° C.Type: ApplicationFiled: June 18, 2008Publication date: October 22, 2009Inventors: Chao Peng, Jo-Lin Lan, Ya-Huei Chang, Wen-Chi Hsu, Hai-Peng Cheng, Shien-Ping Feng, Wen-Hsiang Chen, Tzu-Chien Wei
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Patent number: 7602611Abstract: A removable interface card expansion module slidably disposed in a case for the insertion of at least one interface card is provided. An opening is opened in the case, and a mainboard having at least one interface card slot corresponding to the interface card is disposed in the case. The removable interface card expansion module includes a removable frame, an expansion circuit board, and an interface adapter device. The removable frame slidably passes through the opening to be fixed in the case. The expansion circuit board is fixed in the removable frame, and includes at least one expansion slot for the insertion of the interface card. The interface adapter device is electrically connected to the expansion circuit board and the interface card slot of the mainboard, so as to electrically connect the interface card to the mainboard.Type: GrantFiled: January 30, 2007Date of Patent: October 13, 2009Assignee: Inventec CorporationInventors: Ying-Chao Peng, Chun-Ying Yang
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Patent number: 7539021Abstract: A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shifts along a integrate direction or a release direction. The retention device includes a fastener, a latching member, and a releasing member. The fastener is movably disposed on the case and has a stopping portion. The latching member is disposed on one side of the circuit board. The releasing member is movably disposed on the case and is located on one side of the fastener, and pushes the fastener to shift. The latching member shifts along the integrate direction with the circuit board, pushes the fastener to shift, and is blocked by the stopped portion. When the fastener is pushed by the releasing member to shift, the latching member is separated along the release direction, such that the circuit board is fixed on or detached from the case.Type: GrantFiled: October 16, 2007Date of Patent: May 26, 2009Assignee: Inventec CorporationInventor: Ying-Chao Peng
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Patent number: 7535731Abstract: A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shift relative to the case along a integrate direction or a release direction. The retention device includes a fixed base, a fastener, and a latching member. The fixed base is disposed on the case and has a slot. The fastener is disposed on the case, and may be deformed under a force. The latching member is disposed on one side of the circuit board. When the latching member shifts along the integrate direction with the circuit board, the fastener is pressed to be deformed, so the latching member is limited in the slot. When the fastener is deformed by an external force, the latching member is disengaged with the slot along the release direction, so that the circuit board may be fixed on or detached from the case.Type: GrantFiled: September 21, 2007Date of Patent: May 19, 2009Assignee: Inventec CorporationInventor: Ying-Chao Peng
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Publication number: 20090097216Abstract: A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shifts along a integrate direction or a release direction. The retention device includes a fastener, a latching member, and a releasing member. The fastener is movably disposed on the case and has a stopping portion. The latching member is disposed on one side of the circuit board. The releasing member is movably disposed on the case and is located on one side of the fastener, and pushes the fastener to shift. The latching member shifts along the integrate direction with the circuit board, pushes the fastener to shift, and is blocked by the stopped portion. When the fastener is pushed by the releasing member to shift, the latching member is separated along the release direction, such that the circuit board is fixed on or detached from the case.Type: ApplicationFiled: October 16, 2007Publication date: April 16, 2009Applicant: INVENTEC CORPORATIONInventor: Ying-Chao PENG
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Publication number: 20090080171Abstract: A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shift relative to the case along a integrate direction or a release direction. The retention device includes a fixed base, a fastener, and a latching member. The fixed base is disposed on the case and has a slot. The fastener is disposed on the case, and may be deformed under a force. The latching member is disposed on one side of the circuit board. When the latching member shifts along the integrate direction with the circuit board, the fastener is pressed to be deformed, so the latching member is limited in the slot. When the fastener is deformed by an external force, the latching member is disengaged with the slot along the release direction, so that the circuit board may be fixed on or detached from the case.Type: ApplicationFiled: September 21, 2007Publication date: March 26, 2009Applicant: INVENTEC CORPRATIONInventor: Ying-Chao PENG
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Patent number: 7457114Abstract: A heat dissipation air duct is provided. The air duct is fixed inside a computer case, and covers a plurality of high heat-generating elements on a mainboard. The air duct includes a main air duct and an auxiliary air duct. The main air duct isolates a first air duct area inside the computer case, and an air inlet is formed in a side of the air duct area. The auxiliary air duct is fixed on the bottom of the main air duct, and is accommodated in the first air duct area, so as to further isolate a second air duct area in communication with the air inlet it the first air duct area. One of the pluralities of high-generating elements is covered by the auxiliary air duct, and is accommodated in the second air duct area.Type: GrantFiled: January 31, 2007Date of Patent: November 25, 2008Assignee: Inventec CorporationInventors: Ying-Chao Peng, Chun-Ying Yang