Abstract: A packaging structure with a box for containing at least a portable electronic device is provided. The box has plates, which are connected to one another and surrounded to form an opening for the portable electronic device passing through, and a lid selectively covering or exposing the opening. First solar cells each fastened on an inner surface of each plate in the box. At least a cable electrically connects the first solar cells and is operated for electrically connecting the portable electronic device.

Abstract: Disclosed herein is a dye-sensitized solar cell. The dye-sensitized solar cell includes a semiconductor electrode with a dye adsorbed thereon; a counter electrode; and an electrolyte composition provided between the semiconductor electrode and the counter electrode; wherein the electrolyte composition comprises an oxidation-reduction mediator and a eutectic ionic liquid including a choline halide or derivatives thereof mixed with alcohols or urea.

Abstract: A method of forming an electrode including an electrochemical catalyst layer is disclosed, which comprises forming a graphitized porous conductive fabric layer, optionally conditioning the graphitized porous conductive fabric layer, and dipping the graphitized porous conductive fabric layer into a solution containing a plurality of polymer-capped noble metal nanoclusters dispersed therein. The polymer-capped noble metal nanoclusters as an electrochemical catalyst layer are adsorbed onto the graphitized porous conductive fabric layer. An electrochemical device with the electrode made thereby is also contemplated.

Abstract: A method of forming an electrode including an electrochemical catalyst layer is disclosed, which comprises forming a graphitized porous conductive fabric layer, optionally conditioning the graphitized porous conductive fabric layer, and dipping the graphitized porous conductive fabric layer into a solution containing polymer-capped noble metal nanoclusters dispersed therein. The polymer-capped noble metal nanoclusters as an electrochemical catalyst layer are adsorbed onto the graphitized porous conductive fabric layer. An electrochemical device with the electrode made thereby is also contemplated.

Abstract: A write pole for vertical magnetic recording is described. It includes a trapezoidal prism of high magnetic moment material, having inwardly sloping sidewalls. Its parallel surfaces are between about 0.1 and 0.3 microns apart and the sidewalls slope in the range of 15.5 to 60 degrees relative to vertical.

Abstract: A method of forming an electrode having an electrochemical catalyst layer is disclosed, which comprises providing a substrate with a conductive layer formed on the surface of a substrate, conditioning the surface of the substrate, immersing the substrate in a solution containing polymer-capped noble metal nanoclusters dispersed therein to form a polymer-protected electrochemical catalyst layer on the conditioned surface of the substrate, and thermally treating the polymer-protected electrochemical catalyst layer at a temperature approximately below 300° C.

Abstract: A removable interface card expansion module slidably disposed in a case for the insertion of at least one interface card is provided. An opening is opened in the case, and a mainboard having at least one interface card slot corresponding to the interface card is disposed in the case. The removable interface card expansion module includes a removable frame, an expansion circuit board, and an interface adapter device. The removable frame slidably passes through the opening to be fixed in the case. The expansion circuit board is fixed in the removable frame, and includes at least one expansion slot for the insertion of the interface card. The interface adapter device is electrically connected to the expansion circuit board and the interface card slot of the mainboard, so as to electrically connect the interface card to the mainboard.

Abstract: A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shifts along a integrate direction or a release direction. The retention device includes a fastener, a latching member, and a releasing member. The fastener is movably disposed on the case and has a stopping portion. The latching member is disposed on one side of the circuit board. The releasing member is movably disposed on the case and is located on one side of the fastener, and pushes the fastener to shift. The latching member shifts along the integrate direction with the circuit board, pushes the fastener to shift, and is blocked by the stopped portion. When the fastener is pushed by the releasing member to shift, the latching member is separated along the release direction, such that the circuit board is fixed on or detached from the case.

Abstract: A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shift relative to the case along a integrate direction or a release direction. The retention device includes a fixed base, a fastener, and a latching member. The fixed base is disposed on the case and has a slot. The fastener is disposed on the case, and may be deformed under a force. The latching member is disposed on one side of the circuit board. When the latching member shifts along the integrate direction with the circuit board, the fastener is pressed to be deformed, so the latching member is limited in the slot. When the fastener is deformed by an external force, the latching member is disengaged with the slot along the release direction, so that the circuit board may be fixed on or detached from the case.

Abstract: A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shifts along a integrate direction or a release direction. The retention device includes a fastener, a latching member, and a releasing member. The fastener is movably disposed on the case and has a stopping portion. The latching member is disposed on one side of the circuit board. The releasing member is movably disposed on the case and is located on one side of the fastener, and pushes the fastener to shift. The latching member shifts along the integrate direction with the circuit board, pushes the fastener to shift, and is blocked by the stopped portion. When the fastener is pushed by the releasing member to shift, the latching member is separated along the release direction, such that the circuit board is fixed on or detached from the case.

Abstract: A retention device is applied in an electronic device that has a case and a circuit board. The circuit board may shift relative to the case along a integrate direction or a release direction. The retention device includes a fixed base, a fastener, and a latching member. The fixed base is disposed on the case and has a slot. The fastener is disposed on the case, and may be deformed under a force. The latching member is disposed on one side of the circuit board. When the latching member shifts along the integrate direction with the circuit board, the fastener is pressed to be deformed, so the latching member is limited in the slot. When the fastener is deformed by an external force, the latching member is disengaged with the slot along the release direction, so that the circuit board may be fixed on or detached from the case.

Abstract: A heat dissipation air duct is provided. The air duct is fixed inside a computer case, and covers a plurality of high heat-generating elements on a mainboard. The air duct includes a main air duct and an auxiliary air duct. The main air duct isolates a first air duct area inside the computer case, and an air inlet is formed in a side of the air duct area. The auxiliary air duct is fixed on the bottom of the main air duct, and is accommodated in the first air duct area, so as to further isolate a second air duct area in communication with the air inlet it the first air duct area. One of the pluralities of high-generating elements is covered by the auxiliary air duct, and is accommodated in the second air duct area.

Abstract: A process for cathodically reducing unwanted Fe+3 ions to needed Fe+2 ions in an acidic ferrous based plating bath without reducing agents is disclosed. An auxiliary potential of 0.1 to 0.3 volts vs. SCE is applied between the working electrode and a reference electrode and can reduce the molar ratio [Fe+3]/[Fe+2] to 1 ppm without depositing Fe or other metals on the working electrode or causing hydrogen evolution. The process is applicable to electroplating soft magnetic films such as NiFe, FeCo, and CoNiFe and can be performed during plating or during cell idling. The process is cost effective by reducing the amount of hazardous waste and tool down time due to routine solution swap. Other benefits are improved uniformity in composition and thickness of plated films because issues associated with decomposed reducing agents are avoided.

Abstract: A positioning assembly is used for positioning a circuit board on a case. The circuit board shifts relative to a case along a integrate direction or a release direction. The positioning assembly includes a fixed member, a movable member, and a latching member. The latching member is disposed on a side surface of the circuit board, and the fixed member is disposed to the case, for the latching member to pass through in a single direction along a integrate direction, such that the latching member is stopped at one end of the fixed member, thereby positioning the circuit board case. The movable member makes the fixed member spread and deform, such that the latching member passes through the fixed member in an opposite direction along a release direction, so that the circuit board may fixed on or detached from the case.

Abstract: A retention device is applied in an electronic device. The electronic device has a case and a circuit board, and the circuit board can shifts relative to the case along an integrate direction or a release direction. The retention device includes a first fastener, a latching member, and a second fastener. The first fastener is movably disposed on the case, and the latching member is mounted on one side of the circuit board. When the latching member shifts with the circuit board along the integrate direction to push the first fastener to shift, the latching member is limited by the stopping of the first fastener, and the first fastener shifts due to the pushing of the second fastener. The latching member is separated from the first fastener along the release direction, such that the circuit board is fixed on or detached from the case.

Abstract: A write pole for vertical magnetic recording is described. It includes a trapezoidal prism of high magnetic moment material, having inwardly sloping sidewalls. Its parallel surfaces are between about 0.1 and 0.3 microns apart and the sidewalls slope in the range of 15.5 to 60 degrees relative to vertical.

Abstract: A heat dissipation air duct is provided. The air duct is fixed inside a computer case, and covers a plurality of high heat-generating elements on a mainboard. The air duct includes a main air duct and an auxiliary air duct. The main air duct isolates a first air duct area inside the computer case, and an air inlet is formed in a side of the air duct area. The auxiliary air duct is fixed on the bottom of the main air duct, and is accommodated in the first air duct area, so as to further isolate a second air duct area in communication with the air inlet it the first air duct area. One of the pluralities of high-generating elements is covered by the auxiliary air duct, and is accommodated in the second air duct area.

Abstract: A removable interface card expansion module slidably disposed in a case for the insertion of at least one interface card is provided. An opening is opened in the case, and a mainboard having at least one interface card slot corresponding to the interface card is disposed in the case. The removable interface card expansion module includes a removable frame, an expansion circuit board, and an interface adapter device. The removable frame slidably passes through the opening to be fixed in the case. The expansion circuit board is fixed in the removable frame, and includes at least one expansion slot for the insertion of the interface card. The interface adapter device is electrically connected to the expansion circuit board and the interface card slot of the mainboard, so as to electrically connect the interface card to the mainboard.

Abstract: A method for forming a big-layer lift-off mask for use in fabricating GMR read-head sensors with trackwidths of less than 0.1 microns. The mask layers are formed symmetrically on each other, each layer of the mask having a novel dog-bone shape and the lower mask layer being substantially undercut relative to the upper mask layer. The central portion of the lower mask layer forms a narrow ridge that maintains the upper mask layer at a fixed height above a substrate, thereby avoiding problems associated with big-layer lift-off masks of the prior art. The method of forming the lower ridge requires a carefully controlled undercutting of the lower mask layer, which is accomplished by using an ozone-assisted oxidation process.

Abstract: It is very difficult to produce a negative wall angle from either negative or positive-tone chemically amplified resists, especially by e-beam lithography. This problem has now been overcome by first forming a photoresist pedestal in the conventional way, followed by flood exposing with electrons. Then, a second development treatment is given. This results in removal of additional material from the sidewalls, said removal being greatest at the substrate and least at the pedestal's top surface, resulting in negatively sloping sidewalls. Application of this method to a process for forming a pole tip for a vertical magnetic writer is also discussed.