Abstract: Systems, methods, and computer programs products are described for optimizing circuit synthesis for implementation on an integrated circuit. A register transfer level code description of logic behavior of a circuit. The register transfer level code description is converted into structurally defined circuit designs for multiple types of components and feature size technologies. A floor plan of each structurally defined circuit design is generated. A physically simulated circuit is created for each floor plan. A range of operating conditions is swept over to analyze power, performance, and area of each physically simulated circuit.

Abstract: A semiconductor structure includes a substrate. The substrate is divided into a first element region, a second element region and a boundary region. The boundary region is disposed between the first element region and a second element region. A first mask structure covers the first element region. A second mask structure is disposed in the second element region. A logic gate structure is disposed within the second element region.

Abstract: An information converting method and a system thereof are configured to convert a first information into a second information. An information obtaining step is performed to obtain the first information corresponding to a first communication protocol and transmit the first information to a converter. The first information includes a first access layer sub-information and an upper-layer protocol sub-information. A first access layer removing step is performed to drive the converter to remove the first access layer sub-information from the first information according to a converting process. A second access layer adding step is performed to drive the converter to add a second access layer sub-information corresponding to a second communication protocol to the first information and combine the second access layer sub-information with the upper-layer protocol sub-information according to the converting process, so that the first information is converted into the second information.

Abstract: Semiconductor structures are provided. The semiconductor structure includes a substrate and nanostructures formed over the substrate. The semiconductor structure further includes a gate structure surrounding the nanostructures and a source/drain structure attached to the nanostructures. The semiconductor structure further includes a contact formed over the source/drain structure and extending into the source/drain structure.

Abstract: An electronic seal includes a housing, a cover, at least one touch piece, and, a transmission mechanism. The housing has at least one through track, in which the through track is disposed on the bottom of the housing. The cover is disposed on the housing and covers the housing. The touch piece is movably disposed on the through track and is partially exposed out of the housing. The transmission mechanism includes a driving member, in which the driving member drives the touch piece to move along the through track when the driving member is actuated relative to the housing.

Abstract: An electronic seal includes a housing, a cover, at least one touch piece, and, a transmission mechanism. The housing has at least one through track, in which the through track is disposed on the bottom of the housing. The cover is disposed on the housing and covers the housing. The touch piece is movably disposed on the through track and is partially exposed out of the housing. The transmission mechanism includes a driving member, in which the driving member drives the touch piece to move along the through track when the driving member is actuated relative to the housing.

Abstract: A real-time lighting control system of an ecosystem and real-time lighting control method includes a computer device, multiple lighting devices and multiple wireless base stations. The lighting devices and the wireless base stations are arranged in multiple lighting regions of an indoor space. Each wireless base station emits a wireless signal continuously, and controls one or more connected lighting devices when receiving a lighting control signal. The computer device senses the wireless signals continuously, and keeps determining its position at the different time points according to the received wireless signals and the arranged positions of the wireless base stations. Next, the computer selects one of the lighting regions according to space information and the determined positions, and sends the lighting control signal to one of the wireless base stations arranged in the selected lighting region.

Abstract: A real-time lighting control system of an ecosystem and real-time lighting control method includes a computer device, multiple lighting devices and multiple wireless base stations. The lighting devices and the wireless base stations are arranged in multiple lighting regions of an indoor space. Each wireless base station emits a wireless signal continuously, and controls one or more connected lighting devices when receiving a lighting control signal. The computer device senses the wireless signals continuously, and keeps determining its position at the different time points according to the received wireless signals and the arranged positions of the wireless base stations. Next, the computer selects one of the lighting regions according to space information and the determined positions, and sends the lighting control signal to one of the wireless base stations arranged in the selected lighting region.

Abstract: An article includes a glass substrate and an insert within the glass substrate, the surface roughness (Ra) of the glass substrate and the insert is about 0.05 ?m to about 0.2 ?m.

Abstract: An audio playback system includes an earphone and an audio device. The earphone includes a first earphone body, a second earphone body, a first sensing unit mounted in the first earphone body, a second sensing unit mounted in the second earphone body, a first plug, and a second plug electronically connected to the first sensing unit and the second sensing unit. The audio device includes a first jack, a second jack configured to receive the second plug, and a control unit. The first sensing unit and the second sensing unit output sensing signals which indicate whether the earphone is used. The control unit receives the sensing signals from the second jack and controls a working state of the audio device.

Abstract: A film includes base and a photosensitive layer formed on the base. The photosensitive layer substantially includes a first photosensitive agent, a second photosensitive agent, and a thermosol. The first photosensitive agent is water-soluble. The second photosensitive agent is an aromatic ketone compound or a benzoin ether compound. The method for manufacturing the film and the masking method using the film is also provided.

Abstract: An audio playback system includes an earphone and an audio device. The earphone includes a first earphone body, a second earphone body, a first sensing unit mounted in the first earphone body, a second sensing unit mounted in the second earphone body, a first plug, and a second plug electronically connected to the first sensing unit and the second sensing unit. The audio device includes a first jack, a second jack configured to receive the second plug, and a control unit. The first sensing unit and the second sensing unit output sensing signals which indicate whether the earphone is used. The control unit receives the sensing signals from the second jack and controls a working state of the audio device.

Abstract: An article includes a glass substrate and an insert within the glass substrate, the surface roughness (Ra) of the glass substrate and the insert is about 0.05 ?m to about 0.2 ?m.

Abstract: A surface treatment for a glass substrate includes at least following steps: the glass substrate is provided; a fastening device is provided, the fastening device defines a receiving groove corresponding to the glass substrate; the glass substrate is positioned in the receiving groove, and the fastening device is heated to achieve a softened glass substrate; a insert is provided; and the insert is hot pressed and inserted to the softened glass substrate. An article manufactured by the surface treatment method is also disclosed.

Abstract: A surface treatment for a glass substrate includes at least following steps: the glass substrate is provided; a fastening device is provided, the fastening device defines a receiving groove corresponding to the glass substrate; the glass substrate is positioned in the receiving groove, and the fastening device is heated to achieve a softened glass substrate; a insert is provided; and the insert is hot pressed and inserted to the softened glass substrate. An article manufactured by the surface treatment method is also disclosed.

Abstract: A device housing includes a substrate and a decorative article formed in the substrate. The substrate defines a cutout therein and the decorative article is received in the cutout and bonded with the substrate. The decorative article is a glass article which is formed in the cutout by molding softened glass material into the cutout. A method for making the device housing is also provided.

Abstract: A device housing includes a metallic substrate, a pattern element formed in the substrate, and a transparent or translucent decorative layer formed on the substrate and the pattern layer. The substrate defines a receiving space therein, and the pattern element is formed in the receiving space. The pattern element is made of thermosetting plastic. A method for making the device housing is also described.

Abstract: A film includes base and a photosensitive layer formed on the base. The photosensitive layer substantially includes a first photosensitive agent, a second photosensitive agent, and a thermosol. The first photosensitive agent is water-soluble. The second photosensitive agent is an aromatic ketone compound or a benzoin ether compound. The method for manufacturing the film and the masking method using the film is also provided.

Abstract: A device housing includes a substrate and a decorative article formed in the substrate. The substrate defines a cutout therein and the decorative article is received in the cutout and bonded with the substrate. The decorative article is a glass article which is formed in the cutout by molding softened glass material into the cutout. A method for making the device housing is also provided.

Abstract: A device housing includes a main body and a first decorative layer formed on the main body. The main body defines a planar region and at least a concave region connected with the planar region. The first decorative layer includes a first pattern and a second pattern. The first pattern is formed on the planar region. The second pattern is formed on the concave region. The first pattern and the second pattern are an integral structure. A method for making the device housing is also provided.