Abstract: Systems and methods are provided for bridging a bi-directional communication link between an external device and an implantable medical device (IMD). The systems and methods establish a first bi-directional communication link between an external device and a wireless bridge device according to a wireless protocol, and establish a second bi-directional communication link between the wireless bridge device and an IMD concurrently with the first bi-direction communication link according to the wireless protocol. The systems and methods further receive a data packet from the external device at the wireless bridge device. The data packet is received during the communication interval. The systems and methods further transmit the data packet from the wireless bridge device to the IMD during the communication interval.

Abstract: A method is provided for a bridge device to interface between an external device and an implantable medical device (“IMD”), the bridge device includes a system on a chip (“SoC”) having a memory, an input/output interface, a standard wireless computer network (“SWCN”) controller and a bridge controller integrated into a single integrated circuit (“IC”). The method includes configuring the bridge controller to convert data between a Medical Implant Communication Service (MICS) protocol and a SWCN protocol, coupling a MICS controller to the SoC, and configuring the MICS controller to manage operation of a first transceiver based on the MICS protocol. The method includes configuring the SWCN controller to manage operation of a second transceiver based on the SWCN protocol, communicating between the bridge device and an IMD utilizing the first transceiver, and communicating between the bridge device and an external device utilizing the second transceiver.

Abstract: A liquid-cooling device and an air collector thereof are provided. The air collector includes a tank, an inlet channel, an outlet channel, and a barrier plate. The inlet channel is located at one end of the tank and extended into the tank. The outlet channel is located at the other end of the tank and extended into the tank. The barrier plate is located in the tank between the inlet channel and the outlet channel. The diameter of the tank is greater than those of the inlet channel and the outlet channel.

Abstract: A heat dissipation device includes a first casing, a second casing, a thin pump, and a cooling member. The second casing is connected to the first casing to form a first accommodating space and a second accommodating space adjacent to and communicating with the first accommodating space. The thin pump is disposed in the first accommodating space. The cooling member is disposed in the second accommodating space and has a plurality of spacers, and the spacers and the thin pump are disposed on the same plane of the first casing. A portable electronic device having the heat dissipation device is also disclosed.

Abstract: The invention provides a semiconductor device including a substrate, a dielectric layer, a dummy bonding pad, a bonding pad, a redistribution layer, and a metal interconnect. The substrate includes a non-device region and a device region. The dielectric layer is on the non-device region and the device region. The dummy bonding pad is on the dielectric layer of the non-device region. The metal interconnect is in the dielectric layer of the non-device region and connected to the dummy bonding pad. The bonding pad is on the dielectric layer of the device region. The buffer layer is between the bonding pad and the dielectric layer. The buffer layer includes metal, metal nitride, or a combination thereof. The redistribution layer is on the dielectric layer and connects the dummy bonding pad and the bonding pad.

Abstract: A semiconductor structure includes a die including a first surface, a recess extended from an aperture disposed on the first surface and including a sidewall disposed within the die, and a polymeric member configured for filling and sealing the recess and including a first outer surface and a second outer surface, wherein the first outer surface is interfaced with the sidewall of the recess.

Abstract: An embodiment device package includes a semiconductor device die comprising a passivation layer at a top surface, a first conductive line over the passivation layer and electrically connected to the device die, and a second conductive line over the passivation layer and electrically connected to the device die. The first conductive line is thicker than the second conductive line, and the first conductive line and the second conductive line are formed in a same device package layer.

Abstract: A heat dissipating device for dissipating the heat produced by a heating element is disclosed. The heat dissipating device includes a fixing assembly, two moving assemblies and an elastic assembly. The fixing assembly has a thermal conductive member. Each moving assembly has a mass body and is relatively moveable with respect to the fixing assembly. The two moving assemblies are disposed on two opposite sides of the fixing assembly, respectively, and each moving assembly forms a moving space with respect to the fixing assembly. The elastic assembly connects the fixing assembly to the two moving assemblies.

Abstract: A method for manufacturing a semiconductor structure includes: receiving a semiconductive substrate with a post passivation interconnect including an oval landing area; forming a first conductor on the oval landing area; forming a polymer layer above the semiconductive substrate, thereby surrounding a portion of the first conductor; polishing the polymer layer and the first conductor in order to form a planarized surface; and forming a second conductor on the polished first conductor.

Abstract: A wireless charging system includes a wireless charging device and a power-consuming device installed in a charging area. The wireless charging device has a signal conversion module connected to a controller, a transmitter antenna and a power input terminal. The power-consuming device has a receiver coil connected to a rectifier and outputting generated power through a power output terminal. Before or when the wireless charging device charges the power-consuming device, the controller of the wireless charging device can detect a power consumption status, voltage and current information and phase difference information of the transmitter antenna to instantly determine if any foreign metal object enters the charging area, thereby preventing high temperature generated by the foreign metal object from causing equipment damage and danger and enhancing wireless charging safety.

Abstract: A semiconductor device includes a substrate defined with a seal ring region and a circuit region, the substrate includes a seal ring structure and an integrated circuit structure, the seal ring structure is disposed in the seal ring region and includes a plurality of stacked conductive layers interconnected by a plurality of via layers, the integrated circuit structure is disposed in the circuit region and includes an active or a passive device; a metal pad disposed over the seal ring region and contacted with the seal ring structure; a passivation layer disposed over the substrate and covering the metal pad; a polymeric layer disposed over the passivation layer and the circuit region; and a molding disposed over the passivation layer and the polymeric layer, wherein the seal ring structure is covered by the molding.

Abstract: The present disclosure provides a semiconductor package, which includes a substrate, a passivation layer, a post-passivation interconnect (PPI) having a top surface; and a conductive structure. The top surface of the PPI includes a first region receiving the conductive structure, and a second region surrounding the first region. The second region includes metal derivative transformed from materials made of the first region. The present disclosure provide a method of manufacturing a semiconductor package, including forming a first flux layer covering a portion of a top surface of a PPI; transforming a portion of the top surface of the PPI uncovered by the first flux layer into a metal derivative layer; removing the first flux layer; forming a second flux layer on the first region of the PPI; dropping a solder ball on the flux layer; and forming electrical connection between the solder ball and the PPI.

Abstract: A fan device includes a bottom shell, a cover, and an impeller. The cover includes a main body, a support, and a spoiler. The main body has a through opening. A connection position between the support and the main body has a first folding line. The support is bended along the first folding line to form a portion of the through opening. The support is perpendicular to the main body, and is abutted against the bottom shell. A connection position between the spoiler and the main body has a second folding line. The spoiler is bended along the second folding line to locate in the through opening. An acute angle is formed between the spoiler and the surface of the main body facing away from the bottom shell. The impeller is located in an accommodating space between the cover and the bottom shell.

Abstract: The present disclosure provides a semiconductor package, which includes a substrate, a passivation layer, a post-passivation interconnect (PPI) having a top surface; and a conductive structure. The top surface of the PPI includes a first region receiving the conductive structure, and a second region surrounding the first region. The second region includes metal derivative transformed from materials made of the first region. The present disclosure provide a method of manufacturing a semiconductor package, including forming a first flux layer covering a portion of a top surface of a PPI; transforming a portion of the top surface of the PPI uncovered by the first flux layer into a metal derivative layer; removing the first flux layer; forming a second flux layer on the first region of the PPI; dropping a solder ball on the flux layer; and forming electrical connection between the solder ball and the PPI.

Abstract: A semiconductor structure includes a semiconductive substrate, a post passivation interconnect (PPI) and a polymer layer. The PPI is disposed above the semiconductive substrate and includes a landing area for receiving a conductor. The polymer layer is on the PPI, wherein the conductor is necking a turning point so as to include an oval portion being substantially surrounded by the polymer layer, and the oval portion of the conductor is disposed on the landing area of the PPI.

Abstract: A Hydrocarbyl Carboxybetaine represented by Formula (1) is provided: wherein, n1?0 and n2>0, A is a C1-C20 alkyl group when n1>0, and A is a single bond when n1=0.

Abstract: A package, comprising a substrate having electrical devices disposed at a first side of the substrate, vias extending from the first side of the substrate to a second side of the substrate opposite the first side and metallization layers disposed on the first side of the substrate. Contact pads are disposed over the first metallization layers and a protection layer is disposed over the contact pads. Post-passivation interconnects are disposed over the protection layer and extend to the contact pads through openings in the protection layer. Connectors are disposed on the PPIs and a molding compound extends over the PPIs and around the connectors.

Abstract: A high-admittance local suppression highlight imaging system includes a first optical zoom lens having a plurality of lenses, inclusive of at least three aspheric lenses, to thereby function as an imaging system; a second optical zoom lens including a plurality of lenses symmetrically arranged to thereby function as a relay system; a polarizing beam splitter disposed between the first optical zoom lens and the second optical zoom lens; a LCoS disposed at an imaging point at an end of the first optical zoom lens; and a photosensitive component provided in form of a CCD or a CMOS and disposed at an imaging point at an end of the second optical zoom lens. Therefore, the imaging system features enhanced admittance of light, ensures that images captured during a nocturnal picture-taking process will be clear but not overexposed, and is applicable to nocturnal vehicle surveillance and the other safety detection systems.

Abstract: A voice control system including a voice receiving unit, an image capturing unit, a storage unit and a control unit is disclosed. The voice receiving unit receives a voice. The image capturing unit captures a video image stream including several human face images. The storage unit stores the voice and the video image stream. The control unit is electrically connected to the voice receiving unit, the image capturing unit and the storage unit. The control unit detects a feature of a human face from the human face images, defines a mouth motion detection region from the feature of the human face, and generates a control signal according to a variation of the mouth motion detection region and a variation of the voice over time. A voice control method, a computer program product and a computer readable medium are also disclosed.

Abstract: A semiconductor device includes a substrate including a pad and an alignment feature disposed over the substrate, a passivation disposed over the substrate and a periphery of the pad, a post passivation interconnect (PPI) including a via portion disposed on the pad and an elongated portion receiving a conductive bump to electrically connect the pad with the conductive bump, a polymer covering the PPI, and a molding material disposed over the polymer and around the conductive bump, wherein the molding material comprises a first portion orthogonally aligned with the alignment feature and adjacent to an edge of the semiconductor device and a second portion distal to the edge of the semiconductor device, a thickness of the first portion is substantially smaller than a thickness of the second portion, thereby the alignment feature is visible through the molding material under a predetermined radiation.