Abstract: A method for fabricating a peripheral wiring unit of a touch panel includes the following steps: (a) forming a transparent conductive layer on a substrate, the substrate including a peripheral region and a window region surrounded by the peripheral region, and forming a photosensitive conductive layer on the peripheral region of the substrate, such that the photosensitive conductive layer at least partially overlies the transparent conductive layer; (b) exposing the photosensitive conductive layer by using a photomask; and (c) developing the exposed photosensitive conductive layer to form a peripheral wiring unit on the peripheral region of the substrate.

Abstract: A pill grasping method comprises rotating a grasping arm with a nozzle to a predetermined initial position driven by a driving mechanism, rotating a number of pill storage cases to position one of the pill storage cases with a set number of pills to a predetermined grasping pill position driven by an actuating mechanism, rotating the grasping arm to enter into the corresponding pill storage case, starting a pump to generate a vacuum in the nozzle for sucking a pill, and determining if an actual pressure value in a pipe connecting the nozzle to the pump is less than a predetermined pressure value. The grasping arm is rotated to the predetermined initial position when the actual pressure value is less than the predetermined pressure value.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a circuit region, a seal ring region and an assembly isolation region. The circuit region includes a first conductive layer. The seal ring region includes a second conductive layer. The assembly isolation region is between the circuit region and the seal ring region. The first conductive layer and the second conductive layer respectively include a portion extending into the assembly isolation region thereby forming an electric component in the assembly isolation region.

Abstract: An image sensor mechanism for use in a digital image capture device. The mechanism generally includes a photo sensor array, a liquid crystal light valve array, and a control module. The liquid crystal light valve array is operatively disposed in front of the photo sensor array and includes a plurality of light valves, each of which is independently controllable and corresponds to at least one pixel sensor of the photo sensor array so as to selectively prevent light from reaching the photo sensor array. The control module is electrically coupled to the liquid crystal light valve array and the photo sensor array for applying a variable electric field across each of the light valves and for selectively adjusting the light valves with different transmittances based on a preliminary image previously captured by the photo sensor array in order to transform the preliminary image into a resultant image to be re-captured by the photo sensor array.

Abstract: A transmission method comprises: connecting a first wireless device to a second wireless device; determining by the first wireless device whether a silence time is assigned to the second wireless device; setting a communication period with the second wireless device according to the assigned silence time if the silence time assigned to the second wireless device is recorded in the first wireless device; and determining by the first wireless device the silence time according to a traffic transmitted from the second wireless device if the silence time assigned to the second wireless device is not recorded in the first wireless device.

Abstract: A semiconductor structure includes a semiconductive substrate, a post passivation interconnect (PPI) and a polymer layer. The PPI is disposed above the semiconductive substrate and includes a landing area for receiving a conductor. The polymer layer is on the PPI, wherein the conductor is necking a turning point so as to include an oval portion being substantially surrounded by the polymer layer, and the oval portion of the conductor is disposed on the landing area of the PPI.

Abstract: A method of manufacturing a semiconductor structure includes receiving a substrate including a die pad disposed thereon; disposing a passivation over the substrate and around the die pad; disposing a polymer over the passivation; forming a post passivation interconnect (PPI) including an elongated portion and a via portion contacting with the die pad; depositing a metallic paste on the elongated portion of the PPI by a stencil; disposing a conductive bump over the metallic paste; and disposing a molding over the PPI and around the metallic paste and the conductive bump.

Abstract: An operation mode is determined based on user behavior data, an environmental data of the electronic device is determined and a system operating data of the electronic device is determined. A system control parameter can be adjusted based on the environmental data and the system operating data to regulate the heat generating element and/or the cooling element to achieve the operating mode.

Abstract: A package, comprising a substrate having electrical devices disposed at a first side of the substrate, vias extending from the first side of the substrate to a second side of the substrate opposite the first side and metallization layers disposed on the first side of the substrate. Contact pads are disposed over the first metallization layers and a protection layer is disposed over the contact pads. Post-passivation interconnects are disposed over the protection layer and extend to the contact pads through openings in the protection layer. Connectors are disposed on the PPIs and a molding compound extends over the PPIs and around the connectors.

Abstract: A centrifugal fan is provided. The centrifugal fan includes an impeller and a housing. The impeller has an impeller diameter. The housing includes an upper plate, a lower plate and a side wall, wherein the upper plate axially corresponds to the lower plate, a side wall is formed between the upper plate and the lower plate, an axial inlet is formed on the upper plate, a lateral outlet is formed on the side wall, the impeller is disposed in the housing and corresponds to the inlet, and a flow path communicates the inlet to the outlet, wherein a greatest width of the inlet is greater than or equal to the impeller diameter.

Abstract: A method for operating an implantable medical device (IMD) implanted within a patient may include scanning for a wakeup request signal from an external programmer over a first frequency band at a first power level, switching to communication over a second frequency band at a second power level after the IMD detects the wakeup request signal, wherein the switching operation initiates an initial data exchange session during a common connected time period between the IMD and the external programmer, and cycling between the first and second power levels during the common connected time period based on whether data is being exchanged between the external programmer and the IMD.

Abstract: An automatic pill grasping apparatus includes an enclosure, a control chip, a pill grasping mechanism, and a pill storage mechanism. The enclosure includes a base. The pill grasping mechanism includes a grasping arm, a nozzle, and a driving mechanism. The nozzle being is engaged with the grasping arm, and the driving mechanism is attached to the base. The pill storage mechanism includes a plurality of pill storage cases for storing pills and an actuating mechanism attached to the base. The control chip is configured to control the actuating mechanism to rotate the plurality of pill storage cases in a first plane substantially parallel to the base and control the driving mechanism to rotate the grasping arm in a second plane perpendicular to the first plane, for rotating the nozzle to stretch into the one of the plurality of pill storage cases to pick a pill.

Abstract: Systems and methods are provided for initiating a bi-directional communication link with an implantable medical device. The systems and methods configure an implantable medical device (IMD) to detect activation fields from a triggering device when the triggering device is positioned proximate to the IMD, and to identify a field characterization of the activation field. The systems and methods further configure the IMD to establish a bi-directional communication link with an external device through a select communication initialization mode form a plurality of communication initialization modes defined by a wireless protocol in response to the field characterization of the activation field.

Abstract: An oil seal bearing of a fan includes a ring-shaped body for supporting a shaft of the fan, and a protruded portion disposed on the ring-shaped body. The protruded portion has a first slope, wherein the first slope is disposed corresponding to an inner top surface of a hub of the fan. An oil storage space is formed between the first slope, the shaft and the inner top surface for storing a lubricant. A first angle is formed by the extension of the first slope and the inner top surface, such that the lubricant is retained by the capillarity between the first slope and the inner top surface. Under this circumstance, the oil sealing is achieved without any additional oil seal, the effective bearing height is maximized, and the advantages of enhancing the supporting efficiency and lengthening the lifetime of the product are also achieved.

Abstract: A heat dissipation device is applied to an electronic device and comprises a heat conduction plate, at least an induction coil and a first heat dissipation plate. The heat conduction plate receives the heat provided by a heat source and includes a first contact element disposed on a first surface of the heat conduction plate. The induction coil is disposed at the heat conduction plate. The first heat dissipation plate is disposed at the first contact element of the heat conduction plate. The first heat dissipation plate and the heat conduction plate form a gap. The first heat dissipation plate includes at least a first magnetic element disposed opposite the induction coil.

Abstract: A semiconductor device and a method of manufacturing the semiconductor device are disclosed. The semiconductor device includes a chip substrate, a mold, and a buffer layer. The mold is disposed over the chip substrate. The buffer layer is externally embedded between the chip substrate and the mold. The buffer layer has an elastic modulus or a coefficient of thermal expansion less than that of the mold. The method includes disposing a buffer layer at least covering scribe lines of a substrate, forming a mold over the substrate and covering the buffer layer, and cutting along the scribe lines and through the mold, the buffer layer and the substrate.

Abstract: A semiconductor device includes a substrate defined with a seal ring region and a circuit region, the substrate includes a seal ring structure and an integrated circuit structure, the seal ring structure is disposed in the seal ring region and includes a plurality of stacked conductive layers interconnected by a plurality of via layers, the integrated circuit structure is disposed in the circuit region and includes an active or a passive device; a metal pad disposed over the seal ring region and contacted with the seal ring structure; a passivation layer disposed over the substrate and covering the metal pad; a polymeric layer disposed over the passivation layer and the circuit region; and a molding disposed over the passivation layer and the polymeric layer, wherein the seal ring structure is covered by the molding.

Abstract: A method for manufacturing a motor includes the following steps of: providing a substrate with an opening and a bushing; disposing the bushing within the opening of the substrate; providing a cushioning material disposed between the substrate and the bushing by injection molding.

Abstract: Apparatus and methods for forming a heat spreader on a substrate to release heat for a semi-conductor package are disclosed. The apparatus comprises a substrate. A dielectric layer is formed next to the substrate and in contact with a surface of the substrate. A heat spreader is formed next to the substrate and in contact with another surface of the substrate. A passivation layer is formed next to the dielectric layer. A connection pad is placed on top of the passivation layer. The substrate may comprise additional through-silicon-vias. The contact surface between the substrate and the heat spreader may be a scraggy surface. The packaging method further proceeds to connect a chip to the connection pad by way of a connection device such as a solder ball or a bump.

Abstract: A semiconductor device includes a substrate including a pad and an alignment feature disposed over the substrate, a passivation disposed over the substrate and a periphery of the pad, a post passivation interconnect (PPI) including a via portion disposed on the pad and an elongated portion receiving a conductive bump to electrically connect the pad with the conductive bump, a polymer covering the PPI, and a molding material disposed over the polymer and around the conductive bump, wherein the molding material comprises a first portion orthogonally aligned with the alignment feature and adjacent to an edge of the semiconductor device and a second portion distal to the edge of the semiconductor device, a thickness of the first portion is substantially smaller than a thickness of the second portion, thereby the alignment feature is visible through the molding material under a predetermined radiation.