Patents by Inventor Chao Yi

Chao Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240083981
    Abstract: The present invention relates to the treatment of herpes simplex virus (HSV) infection using an anti-HSV antibody. In particular, the anti-HSV antibody specifically binds to the glycoprotein D (gD) of herpes simplex virus-1 (HSV-1) and herpes simplex virus-2 (HSV-2). The treatment of the present invention is effective against drug-resistant and/or recurrent HSV infection.
    Type: Application
    Filed: September 1, 2023
    Publication date: March 14, 2024
    Applicant: United BioPharma, Inc.
    Inventors: Be-Sheng KUO, Chao-Hung LI, Hsiao-Yun SHAO, Yaw-Jen LIU, Shugene LYNN, Chang Yi WANG
  • Publication number: 20240082163
    Abstract: A metformin tablet, a metformin tablet for relieving pain and reducing inflammation, and a manufacturing method thereof. The tablet for relieving pain and reducing inflammation comprises: a filler, a diluent, an excipient, a binder, a slow-release agent, a sweetener, and a medicinal powder; the excipient comprises: at least one of PVP, PEG, and polymer; the medicinal powder comprises: at least one of metformin and the excipient. The metformin tablet comprises: a hollow part, a thick colloidal layer formed on an outer side of the hollow part, and a powder colloidal layer formed on an outer side of the thick colloidal layer. The tablet for relieving pain and reducing inflammation comprises: a thick colloidal layer, a powder colloidal layer formed on an outer side of the thick colloidal layer, and a hollow part located at a center of the tablet and on an inner side of the thick colloidal layer.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 14, 2024
    Inventors: CHAO-YI CHEN, CHIH-CHIA TSAI
  • Publication number: 20240088124
    Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Inventors: HSIANG-TAI LU, SHUO-MAO CHEN, MILL-JER WANG, FENG-CHENG HSU, CHAO-HSIANG YANG, SHIN-PUU JENG, CHENG-YI HONG, CHIH-HSIEN LIN, DAI-JANG CHEN, CHEN-HUA LIN
  • Patent number: 11929561
    Abstract: An antenna module includes a first antenna radiator including a feeding terminal, a second antenna radiator, a first ground radiator, a second ground radiator and a capacitive element. The second antenna radiator is disposed on one side of the first antenna radiator, and a first gap is formed between a main portion of the second antenna radiator and the first antenna radiator. The first ground radiator is disposed on another side of the first antenna radiator, and a second gap is formed between the first antenna radiator and the first antenna radiator. The second ground radiator is disposed between the second antenna radiator and the first ground radiator, and a third gap is formed between the second ground radiator and a first branch of the second antenna radiator. The capacitive element is disposed on the third gap and connects the second antenna radiator and the second ground radiator.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: March 12, 2024
    Assignee: PEGATRON CORPORATION
    Inventors: I-Shu Lee, Chih-Hung Cho, Hau Yuen Tan, Chien-Yi Wu, Po-Sheng Chen, Chao-Hsu Wu, Yi Chen, Hung-Ming Yu, Chih-Chien Hsieh
  • Publication number: 20240079758
    Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.
    Type: Application
    Filed: August 2, 2023
    Publication date: March 7, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Chien-Yi Wu, Chao-Hsu Wu, Chih-Wei Liao, Hau Yuen Tan, Shih-Keng Huang, Wen-Hgin Chuang, Lin-Hsu Chiang, Chang-Hua Wu, Han-Wei Wang, Chun-Jung Hu
  • Publication number: 20240072411
    Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 29, 2024
    Applicant: Pegatron Corporation
    Inventors: Chien-Yi Wu, Hau Yuen Tan, Chao-Hsu Wu, Chih-Wei Liao, Chia-Hung Chen, Chen-Kuang Wang, Wen-Hgin Chuang, Chia-Hong Chen, Hsi Yung Chen
  • Publication number: 20240069912
    Abstract: A method for identifying hard-coded strings in source code is disclosed. In one embodiment, such a method parses source code and associated localization resource files to identify hard-coded strings and their associated context. The method provides a confidence score for each hard-coded string that indicates whether the hard-coded string is translatable or non-translatable. Based on the confidence score for each hard-coded string, the method transforms each hard-coded string into a single equivalence word. The method then prepares training data by tagging the hard-coded strings in the source code and associated localization resource files as one of translatable and non-translatable. The method then trains a parts-of-speech (POS) tagging model using the training data. At runtime, the method fetches potential hard-coded strings and tags each hard-coded string as one of translatable and non-translatable using the POS tagging model. A corresponding system and computer program product are also disclosed.
    Type: Application
    Filed: August 27, 2022
    Publication date: February 29, 2024
    Applicant: International Business Machines Corporation
    Inventors: Jin Shi, Chih-Yuan Lin, Shu-Chih Chen, Pei-Yi Lin, Chao Yuan Huang
  • Publication number: 20240072287
    Abstract: Molten carbonate fuel cell structures are provided that include a structural mesh support layer at the interface between the surface of the cathode and the cathode current collector. The structural mesh layer can have a mesh open area of 25% to 45%. In addition to providing structural support, the structural mesh layer can reduce or minimize ohmic resistance at the interface between the cathode and the cathode current collector.
    Type: Application
    Filed: August 3, 2023
    Publication date: February 29, 2024
    Inventors: Abdelkader HILMI, Chao-Yi YUH, Timothy C. GEARY, Aaron SATTLER, William C. HORN, William A. LAMBERTI, Gabor KISS
  • Publication number: 20240069636
    Abstract: A touch device includes a touch panel, a circuit board, a vibrating unit and a pressure detection module. The touch panel includes two press regions. When different press regions of the touch panel are pressed by the user, the vibration feedback values generated by different press regions are different.
    Type: Application
    Filed: September 14, 2022
    Publication date: February 29, 2024
    Inventors: Chieh-Hung Hsieh, Wei-Chiang Huang, Chao-Wei Lee, Hsueh-Chao Chang, Sian-Yi Chiu
  • Patent number: 11915971
    Abstract: A method and structure for forming a via-first metal gate contact includes depositing a first dielectric layer over a substrate having a gate structure with a metal gate layer. An opening is formed within the first dielectric layer to expose a portion of the substrate, and a first metal layer is deposited within the opening. A second dielectric layer is deposited over the first dielectric layer and over the first metal layer. The first and second dielectric layers are etched to form a gate via opening. The gate via opening exposes the metal gate layer. A portion of the second dielectric layer is removed to form a contact opening that exposes the first metal layer. The gate via and contact openings merge to form a composite opening. A second metal layer is deposited within the composite opening, thus connecting the metal gate layer to the first metal layer.
    Type: Grant
    Filed: May 2, 2022
    Date of Patent: February 27, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Hsun Wang, Wang-Jung Hsueh, Kuo-Yi Chao, Mei-Yun Wang
  • Patent number: 11914541
    Abstract: In example implementations, a computing device is provided. The computing device includes an expansion interface, a first device, a second device, and a processor communicatively coupled to the expansion interface. The expansion interface includes a plurality of slots. Two slots of the plurality of slots are controlled by a single reset signal. The first device is connected to a first slot of the two slots and has a feature that is compatible with the single reset signal. The second device is connected to a second slot of the two slots and does not have the feature compatible with the single reset signal. The process is to detect the first device connected to the first slot and the second device connected to the second slot and disable the feature by preventing the first slot and the second slot from receiving the single reset signal.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: February 27, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wen Bin Lin, ChiWei Ding, Chun Yi Liu, Shuo-Cheng Cheng, Chao-Wen Cheng
  • Patent number: 11908818
    Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad over the semiconductor substrate, a conductive bump, a conductive cap over the conductive bump, and a passivation layer. The conductive pad is over the semiconductor substrate. The conductive bump is over the conductive pad, wherein the conductive bump has a stepped sidewall structure including a lower sidewall, an upper sidewall laterally offset from the lower sidewall, and an intermediary surface laterally extending from a bottom edge of the upper sidewall to a top edge of the lower sidewall. The conductive cap is over the conductive bump. The passivation layer is over the semiconductor substrate and laterally surrounds the conductive bump, wherein the passivation layer has a top surface higher than the intermediary surface of the stepped sidewall structure of the conductive bump and lower than a top surface of conductive cap.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: February 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sheng-Yu Wu, Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang, Hon-Lin Huang, Zi-Zhong Wang, Chun-Mao Chiu
  • Publication number: 20240039011
    Abstract: A method of manufacturing a current collector for an electrochemical cell assembly includes providing a base plate including a surface, bend-forming the base plate to create a plurality of open corrugations protruding from the surface, each open corrugation including a first flange and a second flange, and forming a foot between the first flange and the second flange of each open corrugation to close each open corrugation and form a corrugation.
    Type: Application
    Filed: July 27, 2023
    Publication date: February 1, 2024
    Inventors: Thomas M. LUCAS, Ramakrishnan VENKATARAMAN, Abdelkader HILMI, Chao-Yi YUH
  • Patent number: 11888187
    Abstract: Molten carbonate fuel cells (MCFCs) are operated to provide enhanced CO2 utilization. This can increase the effective amount of carbonate ion transport that is achieved. The enhanced CO2 utilization is enabled in part by operating an MCFC under conditions that cause transport of alternative ions across the electrolyte. The amount of alternative ion transport that occurs during enhanced CO2 utilization can be mitigated by using a more acidic electrolyte.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: January 30, 2024
    Assignees: ExxonMobil Technology and Engineering Company, FuelCell Energy, Inc.
    Inventors: Abdelkader Hilmi, Timothy A. Barckholtz, Jonathan Rosen, Heather A. Elsen, Gabor Kiss, Carl A. Willman, Chao-Yi Yuh, Hossein Ghezel-Ayagh, Timothy C. Geary
  • Publication number: 20240030383
    Abstract: A light-emitting element includes a substrate includes an upper surface; a plurality of protrusions formed on the upper surface, wherein the plurality of protrusions includes a height less than or equal to 1 ?m; and a stack structure formed on the substrate, wherein the stack structure includes a first doped semiconductor layer, a light-emitting layer, and a second doped semiconductor layer, wherein the stack structure includes a total thickness less than 4 ?m.
    Type: Application
    Filed: July 24, 2023
    Publication date: January 25, 2024
    Inventors: Shih-Kuo LAI, Chao-Yi TSENG, Hai LIN, Zhong JU
  • Patent number: 11878471
    Abstract: A magnetic powder dispensing structure for tablet printing comprises a powder collecting device, a printing device, a guide rod device and a printing platform, the powder collecting device comprises a powder collecting box, a powder feeding device, a plurality of stirring rods, a plurality of rocker arms, a pressing rod, a driving motor and a first electromagnetic attraction device; the printing device comprises a second electromagnetic attraction device. The printing device and the powder collecting device are capable of moving laterally through the guide rod device, and capable of being magnetically attracted with each other or detached from each other by energizing or de-energizing the first electromagnetic attraction device and the second electromagnetic attraction device, thereby the powder collecting device can be driven when dispensing powder, and the printing device is capable of operating independently during printing.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: January 23, 2024
    Assignee: TAIWAN MERCURY MEDICAL CORPORATION
    Inventors: Chih-Chia Tsai, Yu-Hsien Hu, Chao-Yi Chen
  • Patent number: 11854972
    Abstract: A memory device includes a word line, a bit line, an active region and a bit line contact structure. The word line is disposed in the substrate, and extends along a first direction. The bit line is disposed over the substrate, and extends along a second direction. The active region is disposed in the substrate, and extends along a third direction. The bit line contact structure is disposed between the active region and the bit line. A top view pattern of the bit line contact structure has a long axis. An angle between the extending direction of this long axis and the third direction is less than an angle between the extending direction of this long axis and the first direction, and is less than an angle between the extending direction of this long axis and the second direction.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: December 26, 2023
    Assignee: Winbond Electronics Corp.
    Inventors: Chia-Jung Chuang, Isao Tanaka, Yung-Wen Hung, Chao-Yi Huang
  • Publication number: 20230395843
    Abstract: A ceramic-polymer film includes a polymer matrix; a plasticizer; a lithium salt; and AlxLi7-xLa3Zr1.75Ta0.25O12 where x ranges from 0.01 to 1 (LLZO), wherein the LLZO are nanoparticles with diameters that range from 20 to 2000 nm and wherein the film has an ionic conductivity of greater than 1×10?3 S/cm at room temperature. The nanocomposite film can be formed on a substrate and the concentration of LLZO nanoparticles decreases in the direction of the substrate to form a concentration gradient over the thickness of the film. The film can be employed as a non-flammable, solid-state electrolyte for lithium electrochemical cells and batteries. The LLZO serves as a barrier to dendrite growth.
    Type: Application
    Filed: July 14, 2023
    Publication date: December 7, 2023
    Inventors: Zhigang Lin, Chunhu Tan, Chao Yi
  • Publication number: 20230377915
    Abstract: An intensity of a power laser beam applied to a semiconductor device is adjusted. An applied intensity of the power laser beam is indicative of a magnitude at which the power laser beam is emitted toward the semiconductor device and a reflection intensity of a probing laser beam applied to the semiconductor device is indicative of an emissivity of the semiconductor device. The reflection intensity of the probing laser beam is measured to determine the emissivity of the semiconductor device and the applied intensity of the power laser beam is adjusted as a function of the emissivity.
    Type: Application
    Filed: May 17, 2022
    Publication date: November 23, 2023
    Inventors: Wei-Fu Wang, Yi-Chao Yi-Chao, Li-Ting Wang, Yee-Chia Yeo
  • Publication number: 20230345140
    Abstract: The disclosure provides a driving method. The driving method includes following steps. During a normal scan period, a part of drivers provide first control signals generated according to a first clock frequency to target gate lines included in a part of gate line groups. During a high scanning period, the part of drivers provide second control signals generated according to a second clock frequency to residual gate lines included in the part of gate line groups.
    Type: Application
    Filed: August 11, 2022
    Publication date: October 26, 2023
    Inventors: Jeng-Yi HUANG, Yen-Yu CHEN, Chao-Yi HSU, Tsung-Hsien HSIEH