Patents by Inventor Che AN

Che AN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11998894
    Abstract: A composite solid base catalyst, a manufacturing method thereof and a manufacturing method of glycidol are provided. The composite solid base catalyst includes an aluminum carrier and a plurality of calcium particles. The plurality of calcium particles are supported by the aluminum carrier. Beta basic sites of the composite solid base catalyst are 0.58 mmol/g-3.89 mmol/g.
    Type: Grant
    Filed: June 14, 2022
    Date of Patent: June 4, 2024
    Assignees: NATIONAL TSING HUA UNIVERSITY, Chang Chun Plastics Co., Ltd., Chang Chun Petrochemical Co., LTD., DAIREN CHEMICAL CORP.
    Inventors: De-Hao Tsai, Yung-Tin Pan, Che-Ming Yang, Ching-Yuan Chang, Ding-Huei Tsai, Chien-Fu Huang, Yi-Ta Tsai
  • Patent number: 12001208
    Abstract: The system and method make it feasible to develop an autonomous vehicle control system for complex vehicles, such as for cargo trucks and other large payload vehicles. The method and system commence by first obtaining 3-dimensional data for one or more sections of roadway. Once the 3-dimensional roadway data is obtained, that data is used to run computer simulations of a computer model of a specific vehicle being controlled by a generic vehicle control algorithm or system. The generic vehicle control algorithm is optimized by running the simulations utilizing the 3-dimensional roadway data until an acceptable performance result is achieved. Once an acceptable simulation is executed using the generic vehicle control algorithm, the control algorithm/system is used to run one or more real-world driving tests on the roadway for which the 3-dimensional data was obtained. Finally, the computer model for the vehicle is modified.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: June 4, 2024
    Assignee: TUSIMPLE, INC.
    Inventors: Liu Liu, Che Kun Law, Ke Quan
  • Patent number: 12001093
    Abstract: An electronic device is provided. The electronic device includes a first substrate, a polarizer, and a conductive adhesive. The polarizer is disposed on the first substrate and has a conductive layer. The conductive adhesive is disposed on the first substrate and electrically connected to the conductive layer. From a top view, the conductive adhesive is adjacent to an edge of the polarizer and has an extending direction. An angle between the extending direction and an absorption-axis direction of the polarizer is between 80° and 100°.
    Type: Grant
    Filed: April 13, 2023
    Date of Patent: June 4, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tsung-Che Lu, Chieh-Hsiang Hsu, Chang-Heng Tsai
  • Patent number: 12001616
    Abstract: A mouse device includes a lateral pressure sensing unit and a base unit having a base seat, a housing, and an inner space cooperatively defined by the base seat and the housing. The base seat is elongated in a front-rear direction, and includes a bottom face portion and an extension face portion surrounding and extending upwardly from the bottom face portion, and having spaced apart first and second lateral sections. The housing surrounds the base seat, extends upwardly from the extension face portion, and includes an operating portion extending upwardly from the first lateral section and having front, rear, upper, and lower pressing regions. The lateral pressure sensing unit is located in the inner space, is adjacent to the front, rear, upper and lower pressing regions, and is triggered upon operation on the operating portion.
    Type: Grant
    Filed: August 11, 2023
    Date of Patent: June 4, 2024
    Assignee: SUNREX TECHNOLOGY CORP.
    Inventors: Chun-Chieh Chen, Che-Hsun Chang, Chi-Shu Hsu, Chang-Cheng Lee
  • Patent number: 12001556
    Abstract: An anti-virus chip includes a first connection terminal, a second connection terminal, a detection unit and a processing unit. The first connection terminal and the second connection terminal are respectively coupled to a connection port and a system circuit of an electronic device. The detection unit detects whether the connection port is connected to an external device via the first connection terminal. When the detection unit detects that the connection port is connected to the external device, the processing unit performs a virus-scan program on the external device to determine whether a virus exists in the external device. When determining that a virus does not exist in the external device, the processing unit establishes a first transmission path between the first connection terminal and the second connection terminal. When determining that a virus exists in the external device, the processing unit does not establish the first transmission path.
    Type: Grant
    Filed: April 18, 2023
    Date of Patent: June 4, 2024
    Assignee: NUVOTON TECHNOLOGY CORPORATION
    Inventors: Ming-Che Hung, Chia-Ching Lu, Shih-Hsuan Yen, Chih-Wei Tsai
  • Patent number: 12001132
    Abstract: Fabricating a photomask includes forming a protection layer over a substrate. A plurality of multilayers of reflecting films are formed over the protection layer. A capping layer is formed over the plurality of multilayers. An absorption layer is formed over capping layer. A first photoresist layer is formed over portions of absorption layer. Portions of the first photoresist layer and absorption layer are patterned, forming first openings in absorption layer. The first openings expose portions of the capping layer. Remaining portions of first photoresist layer are removed and a second photoresist layer is formed over portions of absorption layer. The second photoresist layer covers at least the first openings. Portions of the absorption layer and capping layer and plurality of multilayer of reflecting films not covered by the second photoresist layer are patterned, forming second openings. The second openings expose portions of protection layer and second photoresist layer is removed.
    Type: Grant
    Filed: August 7, 2019
    Date of Patent: June 4, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Pei-Cheng Hsu, Ta-Cheng Lien, Ping-Hsun Lin, Shih-Che Wang, Hsin-Chang Lee
  • Patent number: 12001641
    Abstract: In some embodiments, a method is provided. The method includes identifying an incident situation based upon a sensor detecting an abnormal condition. One or more life safety systems are queried to obtain life safety system data. One or more databases, comprising equipment information, chemical information, personnel information, and/or emergency response contingency procedures, are queried to obtain on-site information. The life safety system data and the on-site information are integrated together to generate incident situation information. The incident situation information is displayed through an electronic display.
    Type: Grant
    Filed: March 16, 2023
    Date of Patent: June 4, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Adolph Lin, Jung Shiung Chen, Mao Rong Huang, Jet-Luen Shiu, Che-Chuan Chi, Yi-Feng Hsieh, Yen-Yu Chen
  • Patent number: 12003365
    Abstract: A configuration management system tracks the configuration of a managed computing environment in accordance with a configuration tracking policy. The configuration management system uses the tracking policy to map configuration information from the managed computing environment to a hierarchy of configuration items. Items may be included or excluded from the hierarchy based on relevance to the tracking policy and a predicted amount of dynamism. A signature of the hierarchy is generated. A change to the configuration environment is detected based on a change to the signature, and an action is performed in response to the detected change.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: June 4, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Dallas Lamont Willett, Jeremiah C. Wilton, Mostafa Ead, Ming Che Lee
  • Patent number: 12002883
    Abstract: A semiconductor device includes a semiconductor substrate, a gate structure, a first drift region, a first source/drain region, and a gate oxide layer. The gate structure and the gate oxide layer are disposed on the semiconductor substrate. The first drift region is disposed in the semiconductor substrate. The first source/drain region is disposed in the first drift region. At least a part of a first portion of the gate oxide layer is disposed between the gate structure and the semiconductor substrate in a vertical direction. A second portion of the gate oxide layer is disposed between the first portion and the first source/drain region in a horizontal direction. The second portion includes a bottom extending downwards and a first depressed top surface located above the bottom. A part of the first drift region is located under the first portion and the second portion of the gate oxide layer.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: June 4, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Tsung-Yu Yang, Shin-Hung Li, Ruei-Jhe Tsao, Che-Hua Chang
  • Publication number: 20240178362
    Abstract: An electrode plate manufacturing apparatus includes a first coating device configured to apply a first active material coating on a first side of a current collector; a perforating device configured to perforate the current collector from a second side of the current collector, the second side being opposite to the first side; and a second coating device configured to apply a second active material coating on the second side of the current collector, where the perforating device is located downstream of the first coating device along a travel path of the current collector, and the second coating device is located downstream of the perforating device along the travel path of the current collector.
    Type: Application
    Filed: February 9, 2024
    Publication date: May 30, 2024
    Inventors: Diwu LI, Hongwu SHANG, Shisong LI, Huan CHE, Zhenguang TANG, Linchen LIAO
  • Publication number: 20240177269
    Abstract: A method of local implicit normalizing flow for arbitrary-scale image super-resolution, an associated apparatus and an associated computer-readable medium are provided. The method applicable to a processing circuit may include: utilizing the processing circuit to run a local implicit normalizing flow framework to start performing arbitrary-scale image super-resolution with a trained model of the local implicit normalizing flow framework according to at least one input image, for generating at least one output image, where a selected scale of the output image with respect to the input image is an arbitrary-scale; and during performing the arbitrary-scale image super-resolution with the trained model, performing prediction processing to obtain multiple super-resolution predictions for different locations of a predetermined space in a situation where a same non-super-resolution input image among the at least one input image is given, in order to generate the at least one output image.
    Type: Application
    Filed: November 24, 2023
    Publication date: May 30, 2024
    Applicant: MEDIATEK INC.
    Inventors: Jie-En Yao, Yi-Chen Lo, Li-Yuan Tsao, Shou-Yao Tseng, Chia-Che Chang, Chun-Yi Lee
  • Publication number: 20240178091
    Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.
    Type: Application
    Filed: February 7, 2024
    Publication date: May 30, 2024
    Inventors: Tzu-Sung Huang, Ming Hung Tseng, Yen-Liang Lin, Hao-Yi Tsai, Chi-Ming Tsai, Chung-Shi Liu, Chih-Wei Lin, Ming-Che Ho
  • Publication number: 20240178952
    Abstract: A Bluetooth (BT) communication method includes: setting a BT frequency hopping configuration in a frequency band that is higher than a 2.4 GHz band; and performing a BT communication operation that is compliant with the BT frequency hopping configuration in the frequency band. In addition, the BT communication method is employed by a BT communication device having a control circuit and a wireless communication circuit.
    Type: Application
    Filed: November 27, 2023
    Publication date: May 30, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yen-Shuo Lu, Ting-Che Tseng, Wen-Chieh Tsai
  • Publication number: 20240178086
    Abstract: Disclosed are a package, a package structure and a method of manufacturing a package structure. In one embodiment, the package includes a die, a plurality of through vias, at least one dummy structure, an encapsulant and a redistribution structure. The plurality of through vias surround the die. The at least one dummy structure is disposed between the die and the plurality of through vias and adjacent to at least one corner of the die. The encapsulant encapsulates the die, the plurality of through vias and the at least one dummy structure. The redistribution structure is disposed on the die, the plurality of through vias, the at least one dummy structure and the encapsulant and electrically connected to the die and the plurality of through vias.
    Type: Application
    Filed: February 14, 2023
    Publication date: May 30, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Che-Yu Yeh, Chien-Chia Chiu, Hua-Wei Tseng, Wan-Yu Lee
  • Publication number: 20240178300
    Abstract: A device includes a semiconductor fin semiconductor fin extending from a substrate, a gate structure extending across the semiconductor fin, and a multilayer gate spacer on a sidewall of the gate structure. The multilayer gate spacer includes an inner spacer layer, an outer spacer layer, and a dielectric structure. The inner spacer layer has a vertical portion extending along the sidewall of the gate structure, and a lateral portion laterally extending from the vertical portion in a direction away from the gate structure. The outer spacer layer is spaced apart from the vertical portion of the inner spacer layer by an air gap. The dielectric structure spaces apart a bottom end of the outer spacer layer from the lateral portion of the inner spacer layer.
    Type: Application
    Filed: February 5, 2024
    Publication date: May 30, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chang-Yin CHEN, Che-Cheng CHANG, Chih-Han LIN
  • Publication number: 20240174388
    Abstract: A filling and covering machine for centrifuge tubes with tethered caps includes a conveying device, a cap-flapping device, a filling device, and a cap-pressing device. The cap-flapping device has an upper planar surface and a cap-guiding member having a starting end portion, an ending end portion that is opposite to the starting end portion, and a guiding surface extending from the starting end portion to the ending end portion, and cooperates with the upper planar surface to define an included angle therebetween decreasing gradually from the starting end portion to the ending end portion to guide a cap of each of the centrifuge tubes with tethered caps toward a tube body thereof.
    Type: Application
    Filed: November 10, 2023
    Publication date: May 30, 2024
    Applicant: EZpack Co., Ltd.
    Inventors: Jui-Che Wu, Ai-Chen Ho-Yeh, Chun-Hsien Li
  • Publication number: 20240179368
    Abstract: The present disclosure relates to a video processing method for an application, and an electronic device. The method comprises: during a video editing process, receiving an editing instruction for audio; in response to the editing instruction, acquiring the duration of the audio and a time parameter of a video; when the duration of the audio and the time parameter of the video meet a preset condition, displaying a repeat play control in an audio editing page; when it is detected that the repeat play control is turned on, repeatedly configuring the audio within a time range represented by the time parameter of the video; and when it is detected that the repeat play control is turned off, not repeatedly configuring the audio within the time range represented by the time parameter of the video.
    Type: Application
    Filed: March 14, 2022
    Publication date: May 30, 2024
    Inventors: Weishu MO, Wanli CHE
  • Publication number: 20240178196
    Abstract: The present application provides an array base plate and a detecting method thereof, and a light emitting apparatus, which relates to the technical field of displaying. The array base plate includes: a substrate, wherein the substrate includes a plurality of first light transmitting areas; and a first conductive layer located on the substrate; the first conductive layer includes a plurality of conductive-pad groups, and each of the conductive-pad groups includes at least one conductive pad; an overlapping area exists between an orthographic-projection area of the conductive pad on the substrate and one of the first light transmitting areas; and a transmittance of parts of the substrate that are located at the first light transmitting areas is greater than or equal to a first preset value.
    Type: Application
    Filed: September 16, 2021
    Publication date: May 30, 2024
    Applicants: HEFEI BOE PIXEY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Hai Tang, Liang Gao, Ming Zhai, Jianwei Qin, Xiaopan Che, Guanghe Ma
  • Patent number: D1029961
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: June 4, 2024
    Assignee: Beijing KingSmith Technology Co., Ltd
    Inventors: Xuan Che, Fei Peng, Ningyang Wang, Guoqiang Jin
  • Patent number: D1029962
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: June 4, 2024
    Assignee: Beijing KingSmith Technology Co., Ltd
    Inventors: Xuan Che, Fei Peng, Ningyang Wang, Xingwei Peng, Guoqiang Jin