Patents by Inventor Chen-An Chen

Chen-An Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943190
    Abstract: Disclosed in some examples are methods, systems, devices, and machine-readable mediums which provide for sidebar communication threads forked from, or related to, a principal thread. Messages in the sidebar communication thread may include a history of the principal thread, including one or more messages from the principal thread, and may include a proposed principal thread message that is the subject of the sidebar thread discussion. The sidebar thread may also include sidebar thread messages that carries the conversation of the sidebar thread participants. Once a termination condition is reached for the sidebar thread, the sidebar thread terminates and either the proposed principal thread message (as potentially modified by participants of the sidebar thread) becomes an accepted principal thread message and it is posted to the principal thread as if it was sent by the sidebar initiator or no message is posted (e.g., the proposed principal thread message is rejected).
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: March 26, 2024
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Amer Aref Hassan, Wei-Chen Chen
  • Publication number: 20240093416
    Abstract: A sewing machine includes a main body and a quick release needle plate module. The main body includes a base seat having an inner frame, and an outer case that is mounted to the inner frame and that defines an accommodating compartment. The quick release needle plate module includes a catch member, and a needle plate that covers the accommodating compartment, that is detachably pivoted to a rear section of the inner frame, and that engages the catch member. The quick release needle plate module further includes a press member inserted through the outer case and the inner frame, and operable to push the catch member to disengage the catch member. The needle plate has a plate body that covers the accommodating compartment, and a resilient member mounted between the inner frame and the plate body for driving pivot action of the plate body away from the inner frame.
    Type: Application
    Filed: January 20, 2023
    Publication date: March 21, 2024
    Applicant: ZENG HSING INDUSTRIAL CO., LTD.
    Inventors: Kun-Lung HSU, Ming-Ta LEE, Wei-Chen CHEN, Po-Hsien TSENG
  • Publication number: 20240090668
    Abstract: A linkage device for implementing no backrest clearance, a supporting frame, a seat unit, and a seat, including a bottom base, a linkage mechanism, a support side plate, and a backrest mechanism; the support side plate is provided with a side plate linkage point and a backrest point; the support side plate is rotatably connected to the linkage mechanism at the side plate linkage point; the support side plate is rotatably connected to the backrest mechanism at the backrest point; the backrest mechanism includes a backrest mounting member and a backrest linkage member; and when the backrest mechanism is retracted to an ultimate position, an included angle ? between a connecting line between two ends of the backrest mounting member and a connecting line between the backrest point and the side plate linkage point is an acute angle.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 21, 2024
    Inventors: Xiaohong Li, Yuankun Li, Chen Chen, Xiaochun Lei, Zhanzheng Lv
  • Publication number: 20240096830
    Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.
    Type: Application
    Filed: January 9, 2023
    Publication date: March 21, 2024
    Inventors: Yu-Yi Huang, Yu-Hung Lin, Wei-Ming Wang, Chen Chen, Shih-Peng Tai, Kuo-Chung Yee
  • Publication number: 20240098833
    Abstract: A method for mobility enhancement in wireless communication systems is provided. The method is performed by a User Equipment (UE) configured with a first Small Data Transmission (SDT) configuration by a first cell. The method includes receiving a Radio Resource Control (RRC) release message including a suspend configuration from the first cell; transitioning to an RRC INACTIVE state in response to receiving the RRC release message; receiving, in the RRC INACTIVE state, a System Information Block Type 1 (SIB1) including a second SDT configuration from a second cell; camping on the second cell in response to receiving the SIB1 from the second cell; and while the UE is camping on the second cell, refraining from using the first SDT configuration to initiate an SDT procedure associated with the second cell in a case that the UE does not support performing the SDT procedure associated with the second cell.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Inventors: YUNG-LAN TSENG, YEN-HUA LI, HAI-HAN WANG, HUNG-CHEN CHEN
  • Patent number: 11937327
    Abstract: A user equipment (UE) and a method performed by the UE are provided. The method includes transitioning from a radio resource control (RRC) inactive (RRC_INACTIVE) state to an RRC idle (RRC_IDLE) state upon determining that the UE has failed to find a suitable cell and camped on an acceptable cell; and discarding a radio access network (RAN) notification area (RNA) configuration that comprises at least one of a list of tracking area identities (IDs) or a list of RAN area IDs in response to the transitioning from the RRC_INACTIVE state to the RRC_IDLE state. The acceptable cell fulfills a minimum set of requirements to initiate an emergency call and to receive one or more Earthquake & Tsunami Warning System (ETWS) and Commercial Mobile Alert System (CMAS) notifications. The suitable cell provides normal services. The acceptable cell provides limited services.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: March 19, 2024
    Assignee: FG Innovation Company Limited
    Inventors: Mei-Ju Shih, Yung-Lan Tseng, Hung-Chen Chen, Chie-Ming Chou
  • Patent number: 11937519
    Abstract: Permanent magnets using high temperature superconductor tapes are disclosed. For example, a magnet may include a superconductor tape having two ends, a slit in the superconductor tape between the two ends that forms two legs, a separation between the legs that forms a loop, and a trapped magnetic field in the superconductor tape.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 19, 2024
    Assignee: TECO-WESTINGHOUSE MOTOR COMPANY
    Inventors: Leslie Bromberg, Dean Sarandria, Edward Kuan-Chen Chen, Gabriel Rupertus
  • Patent number: 11933138
    Abstract: A sliding sleeve device has an outer cylinder, a circulation hole being provided in the wall of the outer cylinder; and an inner cylinder provided in an inner cavity of the outer cylinder. In an initial state, the inner cylinder and the outer cylinder are fixed to each other to seal the circulation hole. In a first state, the inner cylinder is movable relative to the outer cylinder, thereby unsealing the circulation hole. A protection mechanism is provided in the circulation hole, which has an inner member located on the radially inner side and an outer member located on the radially outer side.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: March 19, 2024
    Assignees: CHINA PETROLEUM & CHEMICAL CORPORATION, SINOPEC SOUTHWEST OIL & GAS COMPANY
    Inventors: Zhimin Hou, Dan Hu, Qiang Wang, Yijun Zhou, Jiang Qian, Chen Chen, Tao Liu, Jianfa Ci, Wenfeng Pang, Wenjiang Teng
  • Patent number: 11936028
    Abstract: An electrochemical system includes: an anode; a cathode; an electrolyte; and at least one dielectrically heatable material.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: March 19, 2024
    Assignee: Ampcera Inc.
    Inventors: James Emery Brown, Hui Du, Chen Chen, Sumin Zhu
  • Patent number: 11934783
    Abstract: Disclosed embodiments relate to natural language processing. Techniques can include receiving input text, extracting, from the input text, at least one modifier and aspect pair, receiving data from a knowledgebase, based on the at least one modifier and aspect pair and commonsense data, generate one or more premise embeddings, convert the input text into tokens, generating at least one vector for one or more of the tokens based on an analysis of the tokens, combine the at least one vector with the one or more premise embeddings to create at least one combined vector, and analyze the at least one combined vector wherein the analysis generates an output indicative of a feature of the input text.
    Type: Grant
    Filed: April 4, 2023
    Date of Patent: March 19, 2024
    Assignee: RECRUIT CO., LTD.
    Inventors: Yoshihiko Suhara, Behzad Golshan, Yuliang Li, Chen Chen, Xiaolan Wang, Jinfeng Li, Wang-Chiew Tan, çagatay Demiralp, Aaron Traylor
  • Patent number: 11932647
    Abstract: Provided are cyclic iminopyridimdine compounds and their bicyclic derivatives, pharmaceutical compositions comprising such compounds, and methods of using such compounds or compositions, such as methods of treating a proliferation disorder, such as a cancer or a tumor, or in some embodiments disease or disorders related to the dysregulation of kinase such as, but not limited to B-Raf V600E kinase.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: March 19, 2024
    Assignee: ABM Therapeutics Corporation
    Inventor: Chen Chen
  • Patent number: 11935894
    Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fong-yuan Chang, Chun-Chen Chen, Po-Hsiang Huang, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao, Sheng-Hsiung Chen, Chin-Chou Liu
  • Publication number: 20240081394
    Abstract: An electronic vaporization device includes a vaporizable material storage device and an electronic vaporization device body. The electronic vaporization device body includes a first light source, and a second light source. In response to a control signal indicating that a user is starting to use, the electronic vaporization device enters a start stage, and performs the following operations in the start stage: controlling the first light source to increase the brightness from first preset brightness at a first rate at a first time point, and the second light source to increase the brightness from the first preset brightness at a second rate at a second time point, where the first time point is earlier than the second time point, and the first rate is less than the second rate.
    Type: Application
    Filed: October 21, 2021
    Publication date: March 14, 2024
    Inventors: Chen CHEN, Wenchen GAO
  • Publication number: 20240086021
    Abstract: A substrate assembly is provided, including a first substrate, an active element layer, a plurality of first electrodes, a circuit substrate, and a plurality of second electrodes. The active element layer is disposed on the first substrate. The plurality of first electrodes are disposed on the first substrate and arranged along a first direction. The circuit substrate is partially overlapping the first substrate in a vertical projection direction. The plurality of second electrodes are disposed on the circuit substrate. A distance between the edge of one of the plurality of second electrodes and the edge of one of the plurality of first electrodes is greater than zero in the first direction, and a width of the one of the plurality of first electrodes is different from a width of the one of the plurality of second electrodes.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: Chia-Hsiung CHANG, Yang-Chen CHEN, Kuo-Chang SU, Hsia-Ching CHU
  • Publication number: 20240088210
    Abstract: Various embodiments of the present disclosure are directed towards a trench capacitor with a trench pattern for yield improvement. The trench capacitor is on a substrate and comprises a plurality of capacitor segments. The capacitor segments extend into the substrate according to the trench pattern and are spaced with a pitch on an axis. The plurality of capacitor segments comprises an edge capacitor segment at an edge of the trench capacitor and a center capacitor segment at a center of the trench capacitor. The edge capacitor segment has a greater width than the center capacitor segment and/or the pitch is greater at the edge capacitor segment than at the center capacitor segment. The greater width may facilitate stress absorption and the greater pitch may increase substrate rigidity at the edge of the trench capacitor where thermal expansion stress is greatest, thereby reducing substrate bending and trench burnout for yield improvements.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Yuan-Sheng Huang, Yi-Chen Chen
  • Publication number: 20240087799
    Abstract: An inductor device including a frame portion, a first winding set, a second winding set and a first common magnetic core I piece is provided. The first winding set, the second winding set and the first common magnetic core I piece are disposed in the frame portion. The first common magnetic core I piece substantially connects the first winding set and the second winding set and the frame portion. The material of the two winding sets is different from that of the first common magnetic core I piece.
    Type: Application
    Filed: November 21, 2022
    Publication date: March 14, 2024
    Inventors: Kai-De CHEN, Yong-Long SYU, Chen CHEN, De-Jia LU, Chao-Lin CHUNG
  • Publication number: 20240083844
    Abstract: Provided are kinases inhibitors, pharmaceutical compositions comprising such compounds, and methods of using such compounds or compositions, such as methods of treating a proliferation disorder, such as a cancer or a tumor, or in some embodiments disease or disorders related to the dysregulation of kinase such as, but not limited to kinases such as MEK, COT1, FGFR4, MINK, MYO3A, PKG1B, and PLK3.
    Type: Application
    Filed: December 16, 2021
    Publication date: March 14, 2024
    Applicant: ABM Therapeutics Corporation
    Inventor: Chen CHEN
  • Publication number: 20240088899
    Abstract: A logic cell structure includes a first portion, a second portion and a third portion. The first portion, arranged to be a first layout of a first semiconductor element, is placed in a first cell row of a substrate area extending in a first direction. The second portion, arranged to be a second layout of a second semiconductor element, is placed in a second cell row of the substrate area. The third portion is arranged to be a third layout of an interconnecting path used for coupling the first semiconductor element and the second semiconductor element. The first, second and third portions are bounded by a bounding box with a height in a second direction and a width in the first direction. Respective centers of the first portion and the second portion are arranged in a third direction different from each of the first direction and the second direction.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Inventors: SHAO-HUAN WANG, CHUN-CHEN CHEN, SHENG-HSIUNG CHEN, KUO-NAN YANG
  • Publication number: 20240088001
    Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 14, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Cheng Yuan CHEN
  • Patent number: D1018814
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: March 19, 2024
    Assignee: PEZ CROWN INTERNATIONAL CORPORATION
    Inventor: Yu-Chen Chen