Abstract: A computer device, a setting method for a memory module, and a mainboard are provided. The computer device includes a memory module, a processor, and the mainboard. A basic input output system (BIOS) of the mainboard stores a custom extreme memory profile (XMP). When the processor executes the BIOS, so that the computer device displays a user interface (UI), the BIOS displays multiple default XMPs stored in the memory module and the custom XMP through the UI. The BIOS stores one of the default XMPs and the custom XMP to the memory module according to a selecting result of the one of the default XMPs and the custom XMP displayed on the UI.

Abstract: A method includes attaching a die to a thermal compression bonding (TCB) head through vacuum suction, wherein the die comprises a plurality of conductive pillars, attaching a first substrate to a chuck through vacuum suction, wherein the first substrate comprises a plurality of solder bumps, contacting a first conductive pillar of the plurality of conductive pillars to a first solder bump of the plurality of solder bumps, wherein contacting the first conductive pillar to the first solder bump results in a first height between a topmost surface of the first conductive pillar and a bottommost surface of the first solder bump, and adhering the first solder bump to the first conductive pillar to form a first joint, wherein adhering the first solder bump to the first conductive pillar comprises heating the TCB head.

Abstract: A germ-repellent plastic for use in a gas pathway of a respiratory device contains an anti-biofouling compound, and a basic plastic. The anti-biofouling compound is optionally selected from the group of a polyol, a polyether polyol, a polyol derivative, and a combination thereof; or the anti-biofouling compound is selected from the group consisting of a polyether, a poly(ethylene glycol) ether, a polysorbate, and a combination thereof; or the anti-biofouling compound is selected from the group consisting of poly(ethylene glycol) sorbitan monolaurate, poly(ethylene glycol) sorbitan monooleate, poly(ethylene glycol) sorbitol hexaoleate, ceteareth, and a combination thereof. The basic plastic is selected from the group of a blend of a low-density polyethylene polymer and an ethyl vinyl acetate copolymer, a blend of a polypropylene polymer and an ethyl vinyl acetate copolymer, a blend of polyolefin elastomer polymers and a polyvinyl chloride polymer.

Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.

Abstract: An electronic device and method for generation of reflectance maps for relightable 3D models is disclosed. The electronic device acquires multi-view image data that includes a set of images of an object and generates a 3D mesh of the object based on the multi-view image data. The electronic device obtains a set of motion-corrected images based on a minimization of a rigid motion associated with the object between images of the set of images and generates texture maps in a UV space based on the set of motion-corrected images and the 3D mesh. The electronic device obtains specular and diffuse reflectance maps based on a separation of specular and diffuse reflectance components from the texture maps. and obtains a relightable 3D model of the object based on the specular and diffuse reflectance maps.

Abstract: A recycling apparatus for a solar cell module includes a platform for supporting and positioning the solar cell module, and at least one milling device disposed on the platform and having a milling member configured to contact a back plate of the solar cell module, and a casing defining a chip-receiving space and having an air inlet and a suction port communicating with the chip-receiving space. A drive device is connected to the at least one milling device for driving the at least one milling device to move around and mill the solar cell module through the milling member.

Abstract: Provided are an auxiliary alloy casting piece, a high-remanence and high-coercive force NdFeB permanent magnet, and preparation methods thereof. The method for preparing the auxiliary alloy casting piece includes the following steps: providing an auxiliary alloy material including, by mass percentage, 40% to 45% of Pr, 1% to 2% of Co, 0.5% to 1% of Ga, 0.6% to 0.8% of B, 0.1% to 0.2% of V, 0.3% to 0.7% of Ti, and a balance of Fe; smelting the auxiliary alloy material to obtain a smelted material; and subjecting the smelted material to a quick-setting casting to obtain the auxiliary alloy casting piece; where the quick-setting casting includes a refining and a casting in sequence.

Abstract: The present disclosure provides a video processing method, an apparatus, a device and a storage medium. The method includes: after determining a target effect style and determining a target video clip based on presentation of a video to be processed on a timeline, establishing a binding relationship between the target effect style and the target video clip in response to an effect application trigger operation, so as to achieve an effect of applying the target effect style to the target video clip. The embodiment of the present disclosure, by establishing the binding relationship between the target effect style and the target video clip, achieves the effect of effect processing only on a certain video clip of the video, thereby meeting the user's demand of effect processing only on a certain video clip, which increases flexibility of video effect processing, and further improves the user's experience of video effect processing.

Abstract: Provided are an audio/video processing method and apparatus, a device, and a storage medium. The method comprises: displaying text data corresponding to an audio/video to be edited, wherein the text data has a mapping relation with an audio/video timestamp of said audio/video; displaying said audio/video according to a time axis track; in response to a preset operation triggered for target text data in the text data, determining an audio/video timestamp corresponding to the target text data as a target audio/video timestamp; and processing, on the basis of the preset operation, an audio/video clip corresponding to the target audio/video timestamp in said audio/video.

Abstract: In some embodiments, a method selects a first template of pixels that is outside of a first block and a second template of pixels that is outside of the first block. Then, the method selects a first region of pixels that are inside the first block and a second region of pixels that are inside the first block. A first weight is calculated based on the first template of pixels and the first region of pixels and a second weight is calculated based on the second template of pixels and the second region of pixels. The first weight and the second weight are used in a motion prediction search for a second block.

Abstract: A method for identifying video signal source is provided. The method includes the following steps. A first identification code is assigned to a first transmitter device by a receiver control unit of a receiver device. A first video data is transmitted by the first transmitter device. The first video data and a first identification image corresponding to the first identification code are combined as a first combined video data by the receiver control unit. The first combined video data is outputted to a display device by the receiver control unit.

Abstract: A package structure and a formation method are provided. The method includes providing a semiconductor substrate and bonding a first chip structure on the semiconductor substrate through metal-to-metal bonding and dielectric-to-dielectric bonding. The method also includes bonding a second chip structure over the semiconductor substrate through solder-containing bonding structures. The method further includes forming a protective layer surrounding the second chip structure. A portion of the protective layer is between the semiconductor substrate and a bottom of the second chip structure.

Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, a semiconductor bridge, an integrated passive device, a first redistribution layer, and connective terminals. The second semiconductor die is disposed beside the first semiconductor die. The semiconductor bridge electrically connects the first semiconductor die with the second semiconductor die. The integrated passive device is electrically connected to the first semiconductor die. The first redistribution layer is disposed over the semiconductor bridge. The connective terminals are disposed on the first redistribution layer, on an opposite side with respect to the semiconductor bridge. The first redistribution layer is interposed between the integrated passive device and the connective terminals.

Abstract: The present disclosure provides an effect application previewing method, an apparatus, a device and a storage medium. The method includes: taking, in response to a preview trigger operation for a target effect style, a position of a pointer on a video track as a start point, to generate a virtual video frame for the target effect style; synchronously playing the virtual video frame and at least one video clip corresponding to the virtual video frame on the video track based on a timeline, to preview an effect of the target effect style applied to the at least one video clip.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: Features relating to a vaporizer body are provided. The vaporizer body may include an outer shell that includes an inner region defined by an outer shell sidewall. A support structure is configured to fit within the inner region of the outer shell. The support structure includes a storage region defined by a top support structure, a bottom support structure, a bottom cap, and a gasket. An integrated board assembly is configured to fit within the storage region of the support structure. The integrated board assembly may include a printed circuit board assembly formed of multiple layers that form a rigid structure and that include an inner, flexible layer. A first antenna is integrated at a proximal end of the flexible layer, and a second antenna is integrated at a distal end of the flexible layer.

Abstract: In some implementations, one or more semiconductor processing tools may form a metal cap on a metal gate. The one or more semiconductor processing tools may form one or more dielectric layers on the metal cap. The one or more semiconductor processing tools may form a recess to the metal cap within the one or more dielectric layers. The one or more semiconductor processing tools may perform a bottom-up deposition of metal material on the metal cap to form a metal plug within the recess and directly on the metal cap.

Abstract: A method includes transcoding a first block from a spatial region. The first block is associated with a first block tree pattern defining a structure of splitting a block into smaller blocks. A bit string of bits for the first block tree pattern is included in an encoded bitstream. The method determines a location of the first block in the spatial region when the first block tree pattern of the first block can be reused for a second block tree pattern of a second block. The spatial region includes blocks and the location is based on the first block being in the spatial region. Information for the second block is included in the encoded bitstream that indicates the location of the first block in the spatial region. The location allows the bit string for the first block tree pattern to be retrieved for use to decode the second block.

Abstract: The disclosure generally pertains to systems and methods for predicting energy consumption in vehicles. In an example method, a predicted energy consumption model associated with a vehicle may be determined. Sensor data associated with the vehicle may be received via a plurality of sensors associated with the vehicle. A driver-based energy consumption model associated with the vehicle may then be determined based at least in part on the sensor data. An estimated energy consumption model associated with the vehicle may then be determined based at least in part on the predicted energy consumption model and the driver-based energy consumption model. A vehicle charging prediction model may then be determined based at least in part on the estimated energy consumption model.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.