Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.

Abstract: A memory device includes a cross-point array of magnetoresistive memory cells. Each magnetoresistive memory cell includes a vertical stack of a selector-containing pillar structure and a magnetic tunnel junction pillar structure. The lateral spacing between neighboring pairs of magnetoresistive memory cells may be smaller along a first horizontal direction than along a second horizontal direction, and a dielectric spacer or a tapered etch process may be used to provide a pattern of an etch mask for patterning first electrically conductive lines underneath the magnetoresistive memory cells. Alternatively, a resist layer may be employed to pattern first electrically conductive lines underneath the cross-point array. Alternatively, a protective dielectric liner may be provided to protect selector-containing pillar structures during formation of the magnetic tunnel junction pillar structures.

Abstract: A semiconductor device package includes a carrier, an emitting device, a first building-up circuit and a first package body. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending from the first surface to the second surface. The emitting element is disposed on the first surface of carrier. The first building-up circuit is disposed on the second surface of the carrier. The first package body encapsulates the lateral surface of the carrier.

Abstract: A liquid crystal display panel defines a display area and a non-display surrounding the display area. The panel includes a color filter substrate and a thin film transistor array substrate opposite to the color filter substrate. The color filter substrate includes a first substrate and a black matrix on the first substrate. The black matrix is in the display area and extending to the non-display area. A gap is defined in the black matrix and in the non-display area. The gap extends to be a circle around the display area and divides the black matrix into two independent parts. The color filter substrate includes a second substrate and a metal ring on a side of the second substrate facing the thin film transistor array substrate. The metal ring surrounds the display area and aligns with the gap.

Abstract: A liquid crystal display panel defines a display area and a non-display surrounding the display area. The panel includes a color filter substrate and a thin film transistor array substrate opposite to the color filter substrate. The color filter substrate includes a first substrate and a black matrix on the first substrate. The black matrix is in the display area and extending to the non-display area. A gap is defined in the black matrix and in the non-display area. The gap extends to be a circle around the display area and divides the black matrix into two independent parts. The color filter substrate includes a second substrate and a metal ring on a side of the second substrate facing the thin film transistor array substrate. The metal ring surrounds the display area and aligns with the gap.

Abstract: A head-mounted display device includes a front assembly, a wearable assembly, and a cushion module. The wearable assembly is connected to the front assembly and is suitable for wearing the front assembly onto a face of a user. The cushion module includes a hard member, a soft member, and a fan. The hard member is connected to the wearable assembly. The soft member is connected to the hard member to contact skin of the user, and has a rear channel. The fan communicates with the rear channel. The soft member is connected to the hard member to contact the skin of the user, and the fan drives airflow to flow through the rear channel of the soft member to provide a heat dissipation effect.

Abstract: A method for monitoring host computers includes: providing a preset script that, when executed, implements the following steps including: acquiring node information of a target node and host computer information of a target host computer in the target node; calling a host computer template that matches the target host computer, and creating an instance of the target host computer in a monitoring system according to the host computer information and the host computer template; adding the created instance to a node tree corresponding to the node information; determining a to-be-monitored port of the created instance in the node tree based on the host computer information, calling a graph template that matches the port, and creating a port graph corresponding to the port for the created instance; and collecting real-time data of the port and drawing the collected real-time data into the port graph.

Abstract: Systems, methods, architectures, mechanisms and/or apparatus configured to provide a compressive spectral imager for estimating a spectral image of a rotating scene such as a target scene as viewed from a spinning munition.

Abstract: The present disclosure provides a method for executing a query in a database, the method comprising receiving the query that comprises a query key; searching a data structure of the database to determine whether the query key includes a portion that corresponds to an entry in the database, wherein the data structure comprises a first sequence of values comprising information that indicates whether the database comprises data that corresponds to a portion of a key, and a second sequence of values comprising pointers pointing to data that corresponds to the key; in response to the query key including a portion that corresponds to an entry in the database, determining a location of a value in the first sequence, wherein the value corresponds to the portion of the query key; and determining a pointer in the second sequence of values according to the location, wherein the pointer points to data that corresponds to the query key.

Abstract: The present disclosure provides a method comprising receiving an instruction to partition a trie in a database, wherein the trie comprises a first sequence of values comprising information that indicates labels of keys in the trie, a second sequence of values comprising information that indicates whether the labels in the first sequence have one or more child nodes, a third sequence of values comprising information that indicates whether the labels in the first sequence are first child nodes under a parent node, and a fourth sequence of values comprising information that indicates values that corresponds to the labels in the first sequence; separating a sub-trie from the trie by removing entries corresponding to the sub-trie from the first, the second, the third, and the fourth sequences; and updating an entry in the fourth sequence corresponding to a parent node of the sub-trie using a memory address of the sub-trie.

Abstract: A color emissive LED array comprising a backplane and a plurality of color emissive LED units disposed in an array on the backplane, whereas the thickness of a first color emissive LED unit is less than the thickness of a second color emissive LED unit and less than the thickness of the third color emissive LED unit; wherein the color emissive LED units is formed by at least one of vertical configuration structure or flip chip configuration LED structure.

Abstract: A semiconductor device package includes a carrier, an emitting device, a first building-up circuit and a first package body. The carrier has a first surface, a second surface opposite to the first surface and a lateral surface extending from the first surface to the second surface. The emitting element is disposed on the first surface of carrier. The first building-up circuit is disposed on the second surface of the carrier. The first package body encapsulates the lateral surface of the carrier.

Abstract: Mechanisms for constructing and querying a database are described. Constructing the database includes accessing the database comprising multi-component data and constructing an augmented succinct trie (AST) as an index of the database. The database includes sorted data blocks. Construction of the AST is based on the multi-component data. The AST includes indications of boundaries of the data components of the multi-component data. Querying the database includes accessing a key comprising multiple data components and augmenting the key data with data component boundary information. The AST is searched using the augmented key and a search result provided as a value corresponding to the key in the database.

Abstract: A display method is implemented in a vehicle comprising multiple display devices. The multiple display devices comprise a master display device and at least one slave display device. The multiple display devices establish a communication network, by which the multiple display devices communicate with each other. The master display device sends cross screen display message to the at least one slave display device, and the cross screen display message comprises target device information and display information. The target device information identifies at least one target display device, and the display information comprises a storage path that stores display contents. The at least one target display device displays the display contents asynchronously.

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

Abstract: A head-mounted display device includes a wearable assembly, an adjusting module and a control module. The wearable assembly is suitable for wearing to a user's head. The adjusting module is movably coupled to the wearable assembly, and includes a transmission mechanism and a driving element. The transmission mechanism is movably coupled to the wearable assembly, and the driving element is coupled to the transmission mechanism. The control module is electrically connected to the driving element. When the control module outputs a control signal to the driving element, the driving element drives the transmission mechanism to actuate, such that the transmission mechanism drives the wearable assembly along with driving of the driving element to change a girth of the wearable assembly to fit heads of different users.

Abstract: A semiconductor continuous array layer comprising: an array of multiple semiconductor units; a sidewall of each semiconductor unit is surrounded by a semi-cured material or a cured material connecting the semiconductor units together to form a semiconductor continuous array; wherein multiple voids or air gaps are enclosed by the semi-cured material or the cured material within the semiconductor continuous array or around the edge of the semiconductor continuous array.

Abstract: A computer-implement operating method includes periodically generating sensing data by determining a triggered area of each of the sensors of a surface on which each of the sensors disposed; grouping effective sensors among the sensors into a plurality of sensor groups respectively corresponding to the fingers; obtaining a bending angle of one finger among the fingers according to the sensing values of the sensing data of all effective sensors in one sensor group corresponding to the said one finger among the sensor groups; and bending one virtual finger corresponding to the said one finger among virtual fingers of a virtual hand rendered in a virtual space corresponding to the electronic system according to the obtained bending angle of the said one finger, so as to render the virtual hand having a gesture matching to a gesture of the hand sensed by the controller.

Abstract: A structure of a semiconductor array comprises multiple a backplane driver, wherein the backplane driver having a first surface and a second surface; a plurality of compound semiconductor light emitting unit disposed in an array on the first surface of the backplane driver having a gap between any two adjacent ones, wherein the each compound semiconductor light emitting unit having a first surface and a second surface, wherein the second surface of the each compound semiconductor light emitting unit having a cathode and an anode, wherein the cathode and the anode of the each compound semiconductor light emitting unit electrically connected to the first surface of the backplane driver, and wherein the cathode and the anode of the each compound semiconductor light emitting unit are separated from each other from the adjacent electrodes of the adjacent compound semiconductor light emitting units; and a polymer layer disposed above the first surface of the each compound semiconductor light emitting unit.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.