Patents by Inventor Chen Fu

Chen Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230207373
    Abstract: A mass transfer device includes at least one transfer cavity. Each transfer cavity is configured to accommodate a plurality of micro light-emitting diodes. Each transfer cavity includes a bottom plate and a cavity wall connecting the bottom plate. The bottom plate defines a plurality of through holes spaced apart from each other. The transfer cavity is used to transfer the plurality of micro light-emitting diodes to the array substrate of a display panel through the plurality of through holes.
    Type: Application
    Filed: April 15, 2022
    Publication date: June 29, 2023
    Inventors: CHEN-FU MAI, PING LIU, JIE XIAO, ZE-YUAN LI, MENG-CHIEH TAI
  • Patent number: 11681370
    Abstract: A handheld controller is suitable for controlling a virtual reality system. The handheld controller has a pointer direction corresponding to the virtual reality system. The handheld controller includes a holding portion, a knob, and a positioning module. The holding portion is suitable to be held by a hand of a user. The knob is pivotally connected to the holding portion on a rotation axis. The rotation axis is coaxial with or parallel to the pointer direction. The positioning module is connected to the holding portion and is configured to provide a position of the holding portion in a three-dimensional space. In addition, a control method is also provided here.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: June 20, 2023
    Assignee: HTC Corporation
    Inventors: Yu-Hsun Chung, Chen-Fu Chang
  • Publication number: 20230178697
    Abstract: A packaged LED device comprising: a pad-extended LED chip comprising: at least one LED chip having a substrate, a first semiconductor layer, an active layer and a second semiconductor layer; a first pad electrically connected to the first type semiconductor layer and a second pad electrically connected to the second type semiconductor layer; and a first extended metal layer connected to the first pad and a second extended metal layer connected to the second pad.
    Type: Application
    Filed: December 8, 2021
    Publication date: June 8, 2023
    Inventors: Chen-Fu CHU, Trung Tri Doan
  • Publication number: 20230176988
    Abstract: There is provided a detection system including a detection device and a post processor. The detection device and the post processor exchange data therebetween using a predetermined communication protocol. The detection device outputs at least one of calculated data and raw data to the post processor in response to each polling according to a request from the post processor. The raw data is provided to the post processor for the machine learning.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 8, 2023
    Inventors: Yao-Hsuan LIN, Bo-Yi CHANG, Sheng-Hung WANG, Yu-Chen FU
  • Publication number: 20230166604
    Abstract: An auxiliary force control system and a method for a power-assisted bicycle are disclosed. The system has a sensing device, a mobile computing device, a first controller, and a second controller. The sensing device receives a riding torque and a riding speed. The mobile computing device generates a tuning factor via a first and a second ANN model. Personal data and historical riding data are input data of the first ANN model. Predicted grade outputted by the first ANN model, the personal data, and environment data are input data of the second ANN model. The first controller generates a final factor according to the tuning factor, a mode factor, and a gap-range factor. The second controller outputs a motor driver current according to a parameter of target output of the motor, which is generated based on the final factor, to the motor to drive the motor.
    Type: Application
    Filed: January 26, 2022
    Publication date: June 1, 2023
    Inventors: Ping-Chen FU, Tsai-Huan LIN, Pawat Chunhachatrachai
  • Publication number: 20230152623
    Abstract: A liquid crystal display panel which is viewable from a greater range of oblique viewing angles without apparent loss of contrast or color intensity includes a thin film transistor substrate, a color filter substrate, a liquid crystal layer between the color filter substrate and the thin film transistor substrate. The color filter substrate includes a glass substrate, a black matrix, and a color filter layer on the glass substrate. A surface of the glass substrate defines a plurality of grooves having different depths. Both the black matrix and the color filter layer are in the grooves. A thickness of the liquid crystal layer changes with depths of the plurality of grooves. A display device and a method for making the liquid crystal display panel are also provided.
    Type: Application
    Filed: July 19, 2022
    Publication date: May 18, 2023
    Inventors: CHEN-FU MAI, YU ZHANG, LAN-QING XIAO, MIN HU, MENG-CHIEH TAI
  • Publication number: 20230101190
    Abstract: Disclosed is a color emissive LED array having a substantially flat backplane which has circuitry. The color emissive LED array includes a plurality of multi thickness color emissive LED units disposed in an array on the substantially flat backplane; The plurality of multi thickness color emissive LED units have a thickness of the first color emissive LED unit is less than a thickness of the second color emissive LED unit and less than a thickness of the third color emissive LED unit. Meanwhile, the substantially flat backplane having circuitry has one or more anode and one or more cathode. Further, the array is attached to the substantially flat backplane having circuitry by using a jointing layer.
    Type: Application
    Filed: December 8, 2022
    Publication date: March 30, 2023
    Inventor: Chen-Fu CHU
  • Publication number: 20230094428
    Abstract: A microphone includes a base, at least one sound receiving element, and a flexible circuit board. The base has a plurality of supporting portions, a plurality of damping portions, and a bearing portion. The plurality of supporting portions are spaced apart from each other. Each of the plurality of damping portions is disposed on an inner surface of the corresponding supporting portion. The bearing portion is connected to the plurality of damping portions and is suspended between the plurality of supporting portions. The at least one sound receiving element is disposed on the base. The flexible circuit board is disposed on the base and has a first transmission segment. The first transmission segment is electrically coupled to the at least one sound receiving element, and the first transmission segment has a plurality of bending sections.
    Type: Application
    Filed: September 29, 2021
    Publication date: March 30, 2023
    Applicant: HTC Corporation
    Inventors: Li-Hsun Chang, Chen-Fu Chang, I-Chung Wu, Pei-Wen Wang
  • Publication number: 20230081768
    Abstract: A handheld controller is suitable for controlling a virtual reality system. The handheld controller has a pointer direction corresponding to the virtual reality system. The handheld controller includes a holding portion, a knob, and a positioning module. The holding portion is suitable to be held by a hand of a user. The knob is pivotally connected to the holding portion on a rotation axis. The rotation axis is coaxial with or parallel to the pointer direction. The positioning module is connected to the holding portion and is configured to provide a position of the holding portion in a three-dimensional space. In addition, a control method is also provided here.
    Type: Application
    Filed: March 23, 2022
    Publication date: March 16, 2023
    Applicant: HTC Corporation
    Inventors: Yu-Hsun Chung, Chen-Fu Chang
  • Publication number: 20230070153
    Abstract: A display panel includes a color filter (CF) substrate including first support structures, a thin film transistor (TFT) substrate including second support structures, and a liquid crystal layer. Each of the first support structures resists against the TFT substrate, and each of the second support structures resists against the CF substrate to form a receiving space between the CF substrate and the TFT substrate, the receiving space contains the liquid crystal layer. The TFT substrate applies driving signals to the liquid crystal layer to modulate backlight received by the liquid crystal layer from a backlight source. The CF substrate allows light to be emitted as images by filtering the modulated backlight.
    Type: Application
    Filed: January 24, 2022
    Publication date: March 9, 2023
    Inventors: CHEN-FU MAI, MENG-CHIEH TAI, YU ZHANG, MIN HU, LAN-QING XIAO
  • Publication number: 20230018855
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate [30], and forming a plurality of die sized semiconductor structures [32] on the substrate [30]. The method also includes the steps of providing a receiving plate [42] having an elastomeric polymer layer [44], placing the substrate [30] and the receiving plate [42] in close proximity with a gap [101] therebetween, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate [30] to the semiconductor layer [50] at an interface with the substrate [30] to lift off the semiconductor structures [32] through the gap [101] onto the elastomeric polymer layer [44]. During the laser lift-off (LLO) process the elastomeric polymer layer [44] functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures [32] in place on the receiving plate [42].
    Type: Application
    Filed: August 3, 2022
    Publication date: January 19, 2023
    Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEI OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAI, SHUHEI UEDA, JUNYA ISHIZAKI
  • Publication number: 20220392141
    Abstract: A system and method for three-dimensional (3D) microgeometry and reflectance modeling is provided. The system receives images comprising a first set of images of a face and a second set of images of the face. The faces in the first set of images and the second set of images are exposed to omni-directional lighting and directional lighting, respectively. The system generates a 3D face mesh based on the received images and executes a set of skin-reflectance modeling operations by using the generated 3D face mesh and the second set of images, to estimate a set of texture maps for the face. Based on the estimated set of texture maps, the system texturizes the generated 3D face mesh. The texturization includes an operation in which texture information, including microgeometry skin details and skin reflectance details, of the estimated set of texture maps is mapped onto the generated 3D face mesh.
    Type: Application
    Filed: June 8, 2021
    Publication date: December 8, 2022
    Inventors: CHEN FU, MOHAMMAD GHARAVI-ALKHANSARI
  • Publication number: 20220359785
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Application
    Filed: July 20, 2022
    Publication date: November 10, 2022
    Applicants: SemiLEDS Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Patent number: 11488376
    Abstract: An electronic device and method for human skin detection based on a human body-prior is provided. A color image of a person is acquired, and a 3D body model of the person is estimated based on the color image. One or more unclothed parts of the 3D body model are identified. The one or more unclothed parts correspond to one or more body parts, of which at least a portion of skin remains uncovered by clothes. From the color image, pixel information corresponding to the one or more unclothed parts is extracted and classification information is determined based on the pixel information. The classification information includes a set of values, each indicating a likelihood of whether a corresponding pixel of the color image is part of an unclothed skin portion of the person. The unclothed skin portion is detected in the color image based on the classification information.
    Type: Grant
    Filed: February 15, 2021
    Date of Patent: November 1, 2022
    Assignee: SONY GROUP CORPORATION
    Inventors: Chen Fu, Mohammad Gharavi Alkhansari
  • Patent number: 11474301
    Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: October 18, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang-Feng You, Jr-Wei Lin, Chieh-Chen Fu, Kao-Ming Su, Chen Yuan Weng
  • Publication number: 20220320366
    Abstract: A method for fabricating semiconductor light emitting devices (LEDs) includes forming a plurality of light emitting diode (LED) structures having sidewall P-N junctions on a growth substrate, and forming an isolation layer on the light emitting diode (LED) structures having corners at intersections of the epitaxial structures with the growth substrate. The method also includes forming an etchable covering channel layer on the isolation layer, forming a patterning protection layer on the covering channel layer, forming etching channels in the covering channel layer using a first etching process, and removing the corners of the isolation layer by etching the isolation layer using a second etching process. Following the second etching process the isolation layer covers the sidewall P-N junctions. The method can also include bonding the growth substrate to a carrier and separating the growth substrate from the light emitting diode (LED) structures using a laser lift off (LLO) process.
    Type: Application
    Filed: February 16, 2022
    Publication date: October 6, 2022
    Applicants: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: CHEN-FU CHU, SHIH-KAI CHAN, YI-FENG SHIH, TRUNG TRI DOAN, DAVID TRUNG DOAN, YOSHINORI OGAWA, KAZUNORI KONDO, TOSHIYUKI OZAI, NOBUAKI MATSUMOTO, TAICHI KITAGAWA
  • Publication number: 20220270337
    Abstract: An electronic device and method for 3D human modeling under a specific body-fitting of clothes is disclosed. A set of depth images of a person wearing clothes is acquired and an initial body model is generated based on a first shape-fitting of a human body prior with at least a first depth scan. A posed-body model is obtained based on a pose-fitting of the initial body model with at least one depth scan. In each depth scan, clothed scan points and unclothed scan points are determined. A final body model is determined based on a second shape-fitting of vertices which belong to the posed-body model and correspond to an under-cloth skin portion of the body of the person. The second shape-fitting is based on the clothed scan points and the unclothed scan points. The final body model is textured based on a skin texture map for the body.
    Type: Application
    Filed: February 24, 2021
    Publication date: August 25, 2022
    Inventors: CHEN FU, MOHAMMAD GHARAVI-ALKHANSARI
  • Publication number: 20220269897
    Abstract: An electronic device and method for human skin detection based on a human body-prior is provided. A color image of a person is acquired, and a 3D body model of the person is estimated based on the color image. One or more unclothed parts of the 3D body model are identified. The one or more unclothed parts correspond to one or more body parts, of which at least a portion of skin remains uncovered by clothes. From the color image, pixel information corresponding to the one or more unclothed parts is extracted and classification information is determined based on the pixel information. The classification information includes a set of values, each indicating a likelihood of whether a corresponding pixel of the color image is part of an unclothed skin portion of the person. The unclothed skin portion is detected in the color image based on the classification information.
    Type: Application
    Filed: February 15, 2021
    Publication date: August 25, 2022
    Inventors: CHEN FU, MOHAMMAD GHARAVI ALKHANSARI
  • Publication number: 20220271198
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Application
    Filed: May 10, 2022
    Publication date: August 25, 2022
    Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Chen-Fu Chu, SHIH-KAI CHAN, YI-FENG SHIH, DAVID TRUNG DOAN, TRUNG TRI DOAN, YOSHINORI OGAWA, KOHEl OTAKE, KAZUNORI KONDO, KEIJI OHORI, TAICHI KITAGAWA, NOBUAKI MATSUMOTO, TOSHIYUKI OZAi, SHUHEI UEDA
  • Patent number: 11417799
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: August 16, 2022
    Assignees: SemiLEDs Corporation, Shin-Etsu Chemical Co., Ltd.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda