Patents by Inventor Chen-Hsiu Lin

Chen-Hsiu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8319245
    Abstract: A light emitting diode (LED) module includes a lead frame having a number (N) of conducting arms spaced apart from each other, where N?3, and at least one LED die mounted on one of any two neighbor conducting arms. Any two neighbor conducting arms are electrically coupled each other.
    Type: Grant
    Filed: June 16, 2009
    Date of Patent: November 27, 2012
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Shih-Chung Huang, Chen-Hsiu Lin, Meng-Sung Chou
  • Patent number: 8303133
    Abstract: A light emitting diode includes: a base with a concave portion; a light emitting chip disposed in the concave portion; an encapsulating layer filled in the concave portion; and an optical adjusting element disposed on the light emitting chip. Herein, the light emitting diode has a batwing distribution in a horizontal view angle, and the light emitting diode has a Lambertian distribution in a vertical view angle thereof.
    Type: Grant
    Filed: March 31, 2010
    Date of Patent: November 6, 2012
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Hsiu-Tsu Wang, Chia-Hao Wu, Chih-Lung Liang, Chen-Hsiu Lin, Chih-Chiang Kao
  • Publication number: 20120074451
    Abstract: A lead frame structure, a packaging structure and a lighting unit are disclosed. The lead frame structure includes at least two first lead frame units having a space therebetween, and the two first lead frame units are arranged in an opposite manner. Each the first lead frame unit has a first conducting portion, a second conducting portion, and a first connection portion between the first and the second conducting portions. Moreover, the first connection portion has at least two grooves on a surface thereof.
    Type: Application
    Filed: May 13, 2011
    Publication date: March 29, 2012
    Applicants: LITE-ON TECHNOLOGY CORPRATION, SILITEK ELECTRONIC (GUANGZHOU) CO., LTD.
    Inventor: Chen-Hsiu LIN
  • Patent number: 8089140
    Abstract: A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction. The lead frame set further comprises at least two second lead frame units disposed between the first and second frame portions and spaced apart from each other along the second direction. Each of the second lead frame units cooperates with the first lead frame unit to define at least one first die-bonding area therebetween.
    Type: Grant
    Filed: September 23, 2009
    Date of Patent: January 3, 2012
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Shih-Chung Huang, Chen-Hsiu Lin, Meng-Sung Chou
  • Publication number: 20110175134
    Abstract: A package structure includes a base unit, a pin unit and a housing unit. The base unit has a carrier member and a through hole penetrating through the carrier member, and at least one annular structure is formed in the through hole. The pin unit has a plurality of conductive pins disposed beside the carrier member. The housing unit has an annular housing encircling the carrier member to envelop one part thereof and connecting to the pin unit, and the annular housing is partially filled into the through hole to cover the annular structure. Therefore, the instant disclosure can increase the bonding force between the carrier member and the annular housing and retard external moisture to permeate through slits between the carrier member and the annular housing to intrude into the chip-mounting region, thus the reliability and the usage life are increased.
    Type: Application
    Filed: September 24, 2010
    Publication date: July 21, 2011
    Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Chih-Chiang Kao
  • Patent number: 7919788
    Abstract: A light emitting diode packaging device includes: a heat dissipating base; a light emitting dice mounted on the heat dissipating base; a lead frame coupled electrically to the light emitting dice and having a protruding wall defining a confining space for extension of a protruding part of the heat dissipating base therethrough; at least one retaining member provided on one of the protruding part of the heat dissipating base and the protruding wall of the lead frame to retain the lead frame to the heat dissipating base; and a molding material molded on the heat dissipating base and the lead frame.
    Type: Grant
    Filed: November 16, 2007
    Date of Patent: April 5, 2011
    Assignee: Lite-On Technology Corp.
    Inventors: Chia-Hao Wu, Chen-Hsiu Lin
  • Publication number: 20110019397
    Abstract: A light emitting diode includes: a base with a concave portion; a light emitting chip disposed in the concave portion; an encapsulating layer filled in the concave portion; and an optical adjusting element disposed on the light emitting chip. Herein, the light emitting diode has a batwing distribution in a horizontal view angle, and the light emitting diode has a Lambertian distribution in a vertical view angle thereof.
    Type: Application
    Filed: March 31, 2010
    Publication date: January 27, 2011
    Applicants: SILITEK ELECTRONIC (GUANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsiu-Tsu WANG, Chia-Hao Wu, Chih-Lung Liang, Chen-Hsiu Lin, Chih-Chiang Kao
  • Publication number: 20100237360
    Abstract: A light emitting diode (LED) includes an LED chip, a substrate structure, a fluorescence layer, and a lens. The substrate structure includes a cavity. The fluorescence layer covers on the LED chip and is configured in the cavity and covering the LED chip. The lens is installed on the substrate structure. The lens includes a curved lateral wall, a plane at the top, and a conical concave portion at the top center.
    Type: Application
    Filed: July 16, 2009
    Publication date: September 23, 2010
    Inventors: Chih-Chiang Kao, Meng-Sung Chou, Hsu-Tsu Wang, Chen-Hsiu Lin, Chia-Hao Wu
  • Patent number: D622680
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: August 31, 2010
    Assignees: Silitek Electronic (Guangzhou) Go., Ltd., Lite-On Technology Corp.
    Inventors: Chen-Hsiu Lin, Yi-Fei Lee, Chang-Yen Lin
  • Patent number: D624885
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: October 5, 2010
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Chen-Hsiu Lin, Chih-Chiang Kao
  • Patent number: D627310
    Type: Grant
    Filed: March 2, 2010
    Date of Patent: November 16, 2010
    Assignee: Lite-On Technology Corp.
    Inventors: Chen-Hsiu Lin, Chia-Hao Wu
  • Patent number: D637565
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: May 10, 2011
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Chia-Hao Wu, Chen-Hsiu Lin
  • Patent number: D640994
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: July 5, 2011
    Assignee: Lite-On Technology Corporation
    Inventors: Chen-Hsiu Lin, Yi-Fei Lee, Wen-Nan Chen
  • Patent number: D640995
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: July 5, 2011
    Assignee: Lite-On Technology Corporation
    Inventors: Chen-Hsiu Lin, Yi-Fei Lee, Yi-Nan Chen
  • Patent number: D640996
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: July 5, 2011
    Assignee: Lite-On Technology Corporation
    Inventors: Yi-Fei Lee, Chen-Hsiu Lin, Chun-Chieh Chang
  • Patent number: D645424
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: September 20, 2011
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Yi-Fei Lee, Chen-Hsiu Lin, Yen-Chun Lee
  • Patent number: D645425
    Type: Grant
    Filed: February 1, 2011
    Date of Patent: September 20, 2011
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Chen-Hsiu Lin, Ya Ting Jhang, Yi-Fei Lee
  • Patent number: D646643
    Type: Grant
    Filed: November 2, 2010
    Date of Patent: October 11, 2011
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Chia-Hao Wu, Chen-Hsiu Lin
  • Patent number: D665365
    Type: Grant
    Filed: September 27, 2010
    Date of Patent: August 14, 2012
    Assignee: Lite-On Technology Corporation
    Inventors: Yi-Fei Lee, Chen-Hsiu Lin, Chun-Chieh Chang
  • Patent number: D674358
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: January 15, 2013
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Chen-Hsiu Lin, Yi-Chien Chang