Patents by Inventor Chen-Hsiu Lin

Chen-Hsiu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100213484
    Abstract: A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing having a top surface that is formed with a cavity, and a lead frame unit. The lead frame unit includes a first lead frame portion and a second lead frame portion. The first lead frame portion is covered by the insulating housing, and has a die-bonding area exposed within the cavity and adapted for mounting the LED die. The second lead frame portion is covered by the insulating housing, and has a conductive surface exposed outwardly of the top surface of the insulating housing and adapted for electrical connection with an end of a conductive wire.
    Type: Application
    Filed: January 11, 2010
    Publication date: August 26, 2010
    Inventor: Chen-Hsiu Lin
  • Publication number: 20100200879
    Abstract: A photoelectric semiconductor device has a metal wiring layer packed or embedded into a housing for enhancing package stability and electric connectivity. The housing has a cavity structure, and at least one LED chip and an encapsulating material are configured inside the cavity structure. The metal wiring layer locates inside the housing, or in other words, between the top surface and the bottom surface of the housing, and extends to the bottom of the cavity structure to electrically connect the LED chip. With fully wrapping around, the metal wiring layer has higher stability and more reliability from being harmed by outside changes in humidity and temperature.
    Type: Application
    Filed: August 27, 2009
    Publication date: August 12, 2010
    Inventors: Tien-Yu Lee, Chia-Hao Wu, Chen-Hsiu Lin
  • Patent number: 7764271
    Abstract: Manufacturing an optical module includes providing a frame, attaching a light-emitting diode chip and a sensor chip to the frame, and forming overcoats on the light-emitting diode chip and the sensor chip. Each of the overcoats includes a lens. The overcoats can prevent internal chips from being damaged and suffering dust contamination during manufacture.
    Type: Grant
    Filed: January 24, 2006
    Date of Patent: July 27, 2010
    Assignee: Lite-On Technology Corp.
    Inventors: Cheng-Chung Kuo, Ho-Feng Chiu, Jen-Chun Weng, Chen-Hsiu Lin
  • Patent number: 7750362
    Abstract: A semiconductor light-emitting device includes: a hollow body including a bottom wall and a surrounding wall cooperating with the bottom wall to define an encapsulant-receiving recess, the bottom wall being formed with a through-hole, the surrounding wall having a diffuse surface that surrounds the encapsulant-receiving recess; a heat-dissipating body provided on a bottom side of the bottom wall and covering the through-hole in the bottom wall; a light-emitting chip disposed in the through-hole in the bottom wall; a transparent encapsulant filling the encapsulant-receiving recess and the through-hole; and a wavelength-converting layer covering the transparent encapsulant.
    Type: Grant
    Filed: August 26, 2008
    Date of Patent: July 6, 2010
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corp.
    Inventors: Chien-Lin Chang Chien, Hung-Yuan Su, Chen-Hsiu Lin
  • Publication number: 20100102348
    Abstract: A package structure is adapted for mounting at least one light emitting diode (LED) die. The package structure includes an insulating housing, and a lead frame unit including two spaced-apart conductive bodies. Each of the conductive bodies has opposite first and second conductive terminals spaced-apart from each other along an axial direction. The first conductive terminals extend into the insulating housing. The second conductive terminals are exposed outwardly of the insulating housing. Each of the conductive bodies further has two side edges spaced-apart from each other along a transverse direction perpendicular to the axial direction, and a concave-convex structure disposed at the side edges and surrounded by the insulating housing.
    Type: Application
    Filed: October 21, 2009
    Publication date: April 29, 2010
    Inventor: Chen-Hsiu Lin
  • Publication number: 20100072507
    Abstract: A light emitting diode (LED) module includes a lead frame having a number (N) of conducting arms spaced apart from each other, where N?3, and at least one LED die mounted on one of any two neighbor conducting arms. Any two neighbor conducting arms are electrically coupled each other.
    Type: Application
    Filed: June 16, 2009
    Publication date: March 25, 2010
    Inventors: Shih-Chung Huang, Chen-Hsiu Lin, Meng-Sung Chou
  • Publication number: 20100072509
    Abstract: A unitary lead frame assembly having a plurality of lead frame sets each comprises a first lead frame unit. The first lead frame unit has a pair of first and second frame portions extending along a first direction and spaced apart from each other along a second direction different from the first direction. The lead frame set further comprises at least two second lead frame units disposed between the first and second frame portions and spaced apart from each other along the second direction. Each of the second lead frame units cooperates with the first lead frame unit to define at least one first die-bonding area therebetween.
    Type: Application
    Filed: September 23, 2009
    Publication date: March 25, 2010
    Inventors: Shih-Chung Huang, Chen-Hsiu Lin, Meng-Sung Chou
  • Publication number: 20090242915
    Abstract: A semiconductor light-emitting device includes: a hollow body including a bottom wall and a surrounding wall cooperating with the bottom wall to define an encapsulant-receiving recess, the bottom wall being formed with a through-hole, the surrounding wall having a diffuse surface that surrounds the encapsulant-receiving recess; a heat-dissipating body provided on a bottom side of the bottom wall and covering the through-hole in the bottom wall; a light-emitting chip disposed in the through-hole in the bottom wall; a transparent encapsulant filling the encapsulant-receiving recess and the through-hole; and a wavelength-converting layer covering the transparent encapsulant.
    Type: Application
    Filed: August 26, 2008
    Publication date: October 1, 2009
    Inventors: Chien-Lin Chang Chien, Hung-Yuan Su, Chen-Hsiu Lin
  • Publication number: 20090078958
    Abstract: A light emitting diode packaging device includes: a heat dissipating base; a light emitting dice mounted on the heat dissipating base; a lead frame coupled electrically to the light emitting dice and having a protruding wall defining a confining space for extension of a protruding part of the heat dissipating base therethrough; at least one retaining member provided on one of the protruding part of the heat dissipating base and the protruding wall of the lead frame to retain the lead frame to the heat dissipating base; and a molding material molded on the heat dissipating base and the lead frame.
    Type: Application
    Filed: November 16, 2007
    Publication date: March 26, 2009
    Inventors: Chia-Hao Wu, Chen-Hsiu Lin
  • Publication number: 20080277684
    Abstract: A surface light emitting diode module includes a conductive substrate including a first electrode section. A first hole is formed on the first electrode section. The surface light emitting diode module further includes a surface light emitting diode installed on the conductive substrate. The surface light emitting diode includes a first electrode pin for contacting with the first electrode section. A second hole is formed on the first electrode pin and disposed in a position corresponding to the first hole. The surface light emitting diode module further includes a first fixing component passing through the second hole and the first hole so as to fix the conductive substrate and the surface light emitting diode.
    Type: Application
    Filed: October 5, 2007
    Publication date: November 13, 2008
    Inventors: Chen-Hsiu Lin, Ming-Yen Chen
  • Publication number: 20070057166
    Abstract: An optical module includes a frame, a light source module positioned at a first end of the frame, and a sensor module positioned on the frame for sensing light emitted from the light source module and reflected from a surface. The light source module includes a light source covered by a first protection element, part of the first protection element forming a lens. The sensor module includes a sensor covered by a second protection element, part of the second protection element forming a lens for focusing light reflected from the surface.
    Type: Application
    Filed: January 23, 2006
    Publication date: March 15, 2007
    Inventors: Cheng-Chung Kuo, Ho-Feng Chiu, Jen-Chun Weng, Chen-Hsiu Lin
  • Publication number: 20070059867
    Abstract: Manufacturing an optical module includes providing a frame, attaching a light-emitting diode chip and a sensor chip to the frame, and forming overcoats on the light-emitting diode chip and the sensor chip. Each of the overcoats includes a lens. The overcoats can prevent internal chips from being damaged and suffering dust contamination during manufacture.
    Type: Application
    Filed: January 24, 2006
    Publication date: March 15, 2007
    Inventors: Cheng-Chung Kuo, Ho-Feng Chiu, Jen-Chun Weng, Chen-Hsiu Lin
  • Publication number: 20060289812
    Abstract: An optoelectronic semiconductor component includes a housing including a light exit opening, a first semiconductor chip installed inside the housing for emitting light, and a second semiconductor chip located at a position inside the housing. A distance between the second semiconductor chip and the light exit opening is greater than a distance between the first semiconductor chip and the light exit opening.
    Type: Application
    Filed: February 7, 2006
    Publication date: December 28, 2006
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D527352
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: August 29, 2006
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D533146
    Type: Grant
    Filed: September 8, 2005
    Date of Patent: December 5, 2006
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D541760
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: May 1, 2007
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D550169
    Type: Grant
    Filed: August 14, 2006
    Date of Patent: September 4, 2007
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D551383
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: September 18, 2007
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D562269
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: February 19, 2008
    Assignee: Lite-On Technology Corp.
    Inventors: Chung-Chan Wu, Chen-Hsiu Lin
  • Patent number: D619110
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: July 6, 2010
    Assignees: Silitek Electronic (Guangzhou) Co., Ltd., Lite-On Technology Corporation
    Inventors: Chen-Hsiu Lin, Tai-Wen Tsai, Chia-Hao Wu