LED package

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Description

FIG. 1 is a perspective view of a “LED package” showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken line showing of structural features is included for the purpose of illustrating non-claimed subject matter and forms no part of the claimed design.

Claims

The ornamental design for a “LED package,” as shown and described.

Referenced Cited
U.S. Patent Documents
D563333 March 4, 2008 Kim et al.
D570796 June 10, 2008 Kim
D573114 July 15, 2008 Min et al.
D576573 September 9, 2008 Kobayakawa
D592160 May 12, 2009 Kang et al.
D599750 September 8, 2009 Kim et al.
20090236618 September 24, 2009 Yasuda
20100059782 March 11, 2010 Fujitomo et al.
Patent History
Patent number: D619110
Type: Grant
Filed: Nov 20, 2009
Date of Patent: Jul 6, 2010
Assignees: Silitek Electronic (Guangzhou) Co., Ltd. (Guangzhou), Lite-On Technology Corporation (Taipei)
Inventors: Chen-Hsiu Lin (Tucheng), Tai-Wen Tsai (Taipei), Chia-Hao Wu (Taipei)
Primary Examiner: Selina Sikder
Attorney: Rabin & Berdo, P.C.
Application Number: 29/350,629
Classifications