Abstract: A method of performing a double-sided process is provided. First, a wafer having a structural pattern disposed on the front surface is provided. Following that, a plurality of front scribe lines are defined on the structural pattern, and a filling layer is filled into the front scribe lines. Subsequently, the structural pattern is bonded to a carrier wafer with a bonding layer, and a plurality of back scribe lines are defined on the back surface of the wafer. Finally, the filling layer filled in the front scribe lines is removed.

Abstract: A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.

Abstract: A wafer carrier for carrying a wafer includes a transparent base and a conducting layer. The transparent base has dimensions similar to that of the wafer, and bonds the wafer with a bonding layer. The conducting layer is transparent, and can be attracted by an electrostatic chuck so that the electrostatic chuck can deliver the wafer.

Abstract: A method of forming a suspended structure is disclosed. Initially, a substrate is provided. A patterned first sacrificial layer and a patterned second sacrificial layer are formed on a front surface of the substrate. The second sacrificial layer has an opening exposing a part of the substrate and a part of the first sacrificial layer. A structural layer is formed covering the abovementioned sacrificial layers. Thereafter, a lift-off process is performed to remove the second sacrificial layer and define the pattern of the structural layer. A first etching process is performed on a back surface of the substrate utilizing the first sacrificial layer as an etching barrier and a through hole is formed under the first sacrificial layer. A second etching layer is performed to remove the first sacrificial layer and a suspended structure is thereby formed.

Abstract: The present invention is a method of selecting composite sheet materials for use in ultra-fast laser patterning of layers of organic thin film material such as OLEDs. The material is selected to accomplish patterning of upper layers without damaging underlying layers by using an ultra-fast laser programmed with the appropriate laser processing parameters. These parameters are derived by examining each layer's absorption spectra, thermal, and chemical characteristics. The method of the present invention includes measuring each layer's absorption spectrum, examining each layer's thermal and chemical characteristics, determining if the layer is ablatable, determining the laser setup, patterning the layer through laser ablation processing, and determining if more layers need to be ablated. Further, the method includes a sub-method of selecting an alternate material if a layer's material characteristics are not favorable for ablation without damaging underlying layers.

Abstract: An assemblable ladder comprises two upright first and second supports, and side plates, mounting members, and screwing elements severing to couple the two first supports together, and to connect the two second supports together. By using a cover piece and other screwing elements, the two coupled first supports and the two connected second supports are assembled together. By way of other screwing elements, pedals are attached between the parallel first and second supports, and connection members are disposed between the pedals and one of the two first supports, or between the pedals and one of the two second supports. Besides, fastening pieces are secured between another parallel first and second supports, and other connection members are fixed between the fastening pieces and the other of the two first supports, or between the fastening pieces and the other of the two second supports, thereby easily assembling the ladder in a DIY manner.

Abstract: A multi-section ladder comprises a first ladder and at least one second ladder which respectively includes two upper and lower stiles, two coupling members and a plurality of rung assemblies, the upper stiles provided at the upper ends thereof with two retaining members, the lower stiles provided at the lower ends thereof with two support seats, in specific directions of the support seats in response to the retaining members being individually formed two recesses, the coupling members covered onto the lower ends of the upper stiles and the upper ends of the lower stiles, and the rung assemblies which are equally spaced apart from each other mounted between the inner walls of the two upper or lower stiles, and each of the rung assemblies including two side plates and a rung, thereby disassembling the upper and lower stiles from each other so as to be small in the size of the present invention while in storage.

Abstract: A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at a peripheral position of the lead frame, allowing thickness-reduced portions of adjacent leads to be arranged in a stagger manner. This stagger arrangement significantly increases pitches between the neighboring thickness-reduced portions of leads. Therefore, during a singulation process as to cut through the leads, lead bridging and short-circuiting between adjacent leads caused by cut-side burrs can be prevented from occurrence, whereby singulation quality and product yield and reliability are effectively improved.

Abstract: A method of forming a suspended structure is disclosed. Initially, a substrate is provided. A patterned first sacrificial layer and a patterned second sacrificial layer are formed on a front surface of the substrate. The second sacrificial layer has an opening exposing a part of the substrate and a part of the first sacrificial layer. A structural layer is formed covering the abovementioned sacrificial layers. Thereafter, a lift-off process is performed to remove the second sacrificial layer and define the pattern of the structural layer. A first etching process is performed on a back surface of the substrate utilizing the first sacrificial layer as an etching barrier and a through hole is formed under the first sacrificial layer. A second etching layer is performed to remove the first sacrificial layer and a suspended structure is thereby formed.

Abstract: The invention is directed to a fixture assembly for connecting a portable electronic product to a stationary object. The fixture depends on suction for adhering the product in place. The fixture includes a flexible supporting rod connecting the electronic product to a suction device. The degree of suction is controlled by a toggle switch acting through a connecting rod connected to a suction piece that secures the product in place.

Abstract: A manufacturing method of an artificial strip for imitated rattan furniture is completed by steps of: inputting polyester plastic material with one color or two colors into at least one plastic extruder; thermal-melting the polyester plastic material to pour into a shaping molds, extruding the melted polyester plastic material in form of a continuous geometry strip so that the strip has at least one color on its surface; cooling the strip; twisting the strip to perform spiral wavy surface to enhance vivid appearance. Lastly, the strip is reeled up to achieve an annular bundle. Thereby, the artificial strip has a verisimilitude texture approximately like the natural willow or rattan strips to make the manufactured imitated rattan/willow furniture have excellent appearance. A device system carries out the manufacturing method is also disclosed in this invention.

Abstract: A method for manufacturing a microstructure device using a near field scanning optical microscope (NSOM) laser micromachining system. A microstructure device preform, including an existing feature, is provided. The NSOM probe tip is scanned over a portion of the preform selected such that a plurality of scan lines cross the existing feature. Scanned locations of the existing feature in at least two scan lines are determined. The orientation of the existing feature is determined based on the scanned locations and the shape of the existing feature. At least one expected machining location in a subsequent scan line is determined based on the shape and orientation of the existing feature. The micro-machining laser is pulsed as the NSOM probe is scanned through the expected machining location(s) during the subsequent scan lines to form at least one fine feature on the microstructure device preform, thus, completing the microstructure device.

Abstract: A method of performing a double-sided process is provided. First, a wafer having a structural pattern disposed on the front surface is provided. Following that, a plurality of front scribe lines are defined on the structural pattern, and a filling layer is filled into the front scribe lines. Subsequently, the structural pattern is bonded to a carrier wafer with a bonding layer, and a plurality of back scribe lines are defined on the back surface of the wafer. Finally, the filling layer filled in the front scribe lines is removed.

Abstract: A method of fabricating a suspended structure. First, a substrate including a photoresist layer hardened by heat is provided. Subsequently, the hardened photoresist layer is etched so as to turn the photoresist layer into a predetermined edge profile. Thereafter, a structure layer is formed on parts of the substrate and parts of the photoresist layer. Next, a dry etching process is performed so as to remove the photoresist layer, and to turn the structure layer into a suspended structure.

Abstract: A method of performing a double-sided process is provided. First, a wafer having a structural pattern disposed on the front surface is provided. Following that, a plurality of front scribe lines are defined on the structural pattern, and a filling layer is filled into the front scribe lines. Subsequently, the structural pattern is bonded to a carrier wafer with a bonding layer, and a plurality of back scribe lines are defined on the back surface of the wafer. Finally, the filling layer filled in the front scribe lines is removed.

Abstract: First, a device wafer having a substrate layer and a device layer is provided. Then, a first mask pattern is utilized to remove the device layer uncovered by the first mask pattern. Subsequently, a medium layer is formed on the surface of the device wafer, and the medium layer is then bonded to a carrier wafer. Thereafter, a second mask pattern is utilized to remove the substrate layer uncovered by the second mask pattern. Finally, the medium layer is separated from the carrier wafer, the substrate layer is bonded to an extendable film, and the medium layer is then removed.

Abstract: A method and apparatus for determining the distance between the tip of a machining tool formed of a substantially transmissive material and a surface. A beam of narrow bandwidth light is diffracted by directing the beam of narrow bandwidth light between the surface and the tip of the machining tool such that a portion of the diffracted beam is optically coupled into the machining tool via near-field optically coupling. The power of the portion of the diffracted beam optically coupled into the machining tool is measured. The distance between the tip of the machining tool and the surface is then determined based on the measured power.

Abstract: A method for determining an improved alignment to couple a beam having a high power level into a waveguide. The power of the beam is reduced to a minimum test power level. The reduced-power beam is aligned in a test alignment such that it forms a beam spot on the coupling surface of the waveguide. The coupled power level of the coupled portion of the beam is measured. The power level of the reduced-power beam is increased in steps to a maximum test power level. Corresponding coupled power levels for each power level are measured. If the coupled power level does not saturate and the corresponding coupling efficiency is greater than or equal to the desired coupling efficiency, the current test alignment is determined to be the improved alignment. Otherwise, the test alignment is changed and the new test alignment is tested to see whether it meets the desired standards.

Abstract: A wafer, having at least a spindle region and at least two through regions alongside the spindle region, is provided. The wafer in the spindle region is partially removed from the bottom surface. Thereafter, the bottom surface is bonded to a carrier with a bonding layer, and the wafer in the through regions is completely removed from the top surface.

Abstract: A wafer is provided and a front scribe line pattern is defined on a front surface of the wafer. A back scribe line pattern corresponding to the front scribe line pattern is defined on a back surface of the wafer. Then the wafer is attached to an extendable film and a wafer breaking process is performed to form a plurality of dies by virtue by extending the extendable film.