Abstract: This invention comprises a multi-functional loudspeaker including a loudspeaker body and a bluetooth transmission and reception device. It further includes at least one media player or a series of functional port(s), such as a DVD player, a three-in-one card reader, a FM/RDS radio receiver, a USB port, audio/visual outputs and SCART output. This novel system could transmit or receive audio signals via bluetooth technology and any bluetooth-enabled devices and is patentably distinct from previous bluetooth loudspeaker having only an audio play function.

Abstract: This invention comprises an integrated device using bluetooth transmission technology. It is composed of a case having a compartment for a music player and a compartment for an audio dongle with the audio input located on the audio dongle and a bluetooth transmitter and receiver located inside. Each of the compartments are also covered. The panel of the said case is also equipped with control buttons. This novel integrated device will effectively prevent a music player and audio dongle from damage caused by being accidentally hit or dropped against a hard surface while in use and the display of the music player can also be well protected from being shattered accidentally. This novel device is itself a remote control for the output terminal on the audio system, which can be used to remotely control the device at the other receiving end.

Abstract: The present invention provides a connecting module having at least one passive component including a substrate, a connecting wire layout, at least one passive component and a chip-setting area, wherein the connecting wire layout is formed on the substrate, the passive components are formed on the connecting wire layout to electrically connect to the connecting wire layout. The chip-setting areas are formed in the substrate locating at different areas from the connecting wire layout, wherein the size of the passive components can be adjusted to match the needed impedance, and the numbers and the location of the chip-setting areas can be adjusted dynamically for reducing the dimension of the module.

Abstract: The present invention provides a Wafer Level Chip Scale Packaging structure including a die, at least one passive component, a combining layer, an isolating layer, at least one connecting wire, an internal pad and a passivation layer. The die includes a shallow connecting pad, an internal pad and an electrical component. The passive component is formed on one side of the die. The combining layer increases the binding force between the passive component and the die. The part surface on the other side of the die is overlaid with the isolation layer. The part surface of the isolation layer and the internal pad is overlaid with the connecting wire to electrically connect to the internal pad, and the passivation layer is used for protecting the die.

Abstract: A method of performing a double-sided process is provided. First, a wafer having a structural pattern disposed on the front surface is provided. Following that, a plurality of front scribe lines are defined on the structural pattern, and a filling layer is filled into the front scribe lines. Subsequently, the structural pattern is bonded to a carrier wafer with a bonding layer, and a plurality of back scribe lines are defined on the back surface of the wafer. Finally, the filling layer filled in the front scribe lines is removed.

Abstract: A method for generating a surface profile of a microstructure. The profile is processed to determine positions of at least two edges and an approximate center point of the profiled surface. Segments of points on the determined profile are fit to a straight line centered at the approximate center point. A standard deviation of the fitted points is measured. The length and position of the segment are varied until a minimum standard deviation is determined and the process is repeated for segments having different lengths. The point is determined from the longest segment having a standard deviation approximately equal to the minimum standard deviation of all of the segment lengths.

Abstract: A method for generating a surface profile of a microstructure. The profile is processed to determine positions of at least two edges and an approximate center point of the profiled surface. Segments of points on the determined profile are fit to a straight line centered at the approximate center point. A standard deviation of the fitted points is measured. The length and position of the segment are varied until a minimum standard deviation is determined and the process is repeated for segments having different lengths. The point is determined from the longest segment having a standard deviation approximately equal to the minimum standard deviation of all of the segment lengths.

Abstract: A method of fabricating a pressure sensor. An SOI wafer having a single crystalline silicon layer, an insulating layer and a silicon substrate is provided. The single crystalline silicon layer has a pressure sensing device. The silicon substrate and the insulating layer corresponding to the pressure sensing device are removed to form a cavity. A bonding substrate is adhered to the silicon substrate with a bonding layer.

Abstract: A method for manufacturing a microstructure, which includes at least one fine feature on an existing feature, using an NSOM laser micromachining system. A microstructure device preform is provided. A portion of its top surface is profiled with the NSOM to produce a topographical image. This profiled portion is selected to include the existing feature. An image coordinate system is defined for the profiled portion of top surface based on the topographical image. Coordinates of a reference point and the orientation of the existing feature in the image coordinate system are determined using the topographical image. The probe tip of the NSOM is aligned over a portion of the existing feature using the determined coordinates of the reference point and the orientation of the existing feature. The top surface of the microstructure device preform is machined with the micro-machining laser to form the fine feature(s) on the existing feature.

Abstract: A chair frame for a folding chair in accordance with the present invention comprises at least two leg units and a seat support frame pivotally connected to an upper end of the two leg units. The seat support frame includes a first portion and a second portion, both free ends of the first portion and the second portions of the seat support frame are adjustably connected in such a manner that the first portion and the second portion can be adjusted to approach or move away from each other, so that the length of the frame can be substantially reduced after the folding chair is folded.

Abstract: A first wafer is provided, and a photosensitive masking-and-bonding pattern is formed on the surface of the first wafer. Then, an etching process using the photosensitive masking-and-bonding pattern as a hard mask is performed to form a wafer pattern on the surface of the first wafer. Finally, the first wafer is bonded to a second wafer with the photosensitive masking-and-bonding pattern.

Abstract: A method for red-tuning the resonance frequency of a photonic crystal structure that includes a plurality of holes, using a near-field scanning optical microscope (NSOM) system. Part of the photonic crystal structure is ablated using the NSOM system to form submicron scale debris on a top surface of the photonic crystal structure. The tip of the NSOM system is used to move a portion of the submicron scale debris across the top surface of the photonic crystal structure to partially fill at least one predetermined hole of the plurality of holes of the photonic crystal structure. The portion of the submicron scale debris partially filling the predetermined hole(s) may be annealed.

Abstract: This new utility model is a fixing support structure for portable visual electronic products. It is composed of the fixing base and the guide slot at the back of the portable visual electronic product. The said fixing base can be movably slid into the guide slot and is connected to the portable visual electronic product. At the back of the said portable visual electronic product is a support, which is pivoted at one end to the back of the portable visual electronic product. This fixing support structure can be used to fix the portable visual electronic product stably and reliably to enable the user to enjoy programs without holding it with hands. The user no longer has to worry about the electronic product falling out of hands. This fixing support structure works in various ways. It applies to various automobiles, still or moving. Applicable to fixing all existing portable visual electronic products, this fixing support structure promises bright market prospect.

Abstract: A portable DVD player with a built-in battery located in compartments disposed on opposite sides of the axle on which the DVD is located. The compartments contain the batteries and the closures for the compartments and are secured to the main body to positively locate the batteries in position.

Abstract: This new utility model is a portable DVD player with movable display screen consisting of a main body and a cover. The cover is connected to the main body, and on the upper side of the cover is the display screen that is flexibly connected to the cover. The cover has grooves in the upper side in which the display screen is movably embedded. The surface of the display screen is at the same level as that of the upper side of the cover. The display screen of this portable DVD player can be adjusted into desired angles, so you just need to place this player on a fixed surface and can easily adjust the visual angle between 0° and 99°, as desired, thus saving you the trouble to hold the DVD player with your hands or support it with something else.

Abstract: A method of thinning a wafer. A wafer having a front surface and a back surface is provided. Subsequently, a carrier wafer is provided, and the back surface of the wafer is bonded to the carrier wafer with a bonding medium. Following that, a wafer thinning process is performed to thin the wafer from the front surface. Finally, the bonding medium is removed so as to separate the wafer from the carrier wafer.

Abstract: A method for determining an improved alignment to couple a beam having a high power level into a waveguide. The power of the beam is reduced to a minimum test power level. The reduced-power beam is aligned in a test alignment such that it forms a beam spot on the coupling surface of the waveguide. The coupled power level of the coupled portion of the beam is measured. The power level of the reduced-power beam is increased in steps to a maximum test power level. Corresponding coupled power levels for each power level are measured. If the coupled power level does not saturate and the corresponding coupling efficiency is greater than or equal to the desired coupling efficiency, the current test alignment is determined to be the improved alignment. Otherwise, the test alignment is changed and the new test alignment is tested to see whether it meets the desired standards.

Abstract: A system for measuring radiation at a peak wavelength that is radiated from a probe tip of a near-field scanning optical microscope (NSOM) probe used for laser machining, including: a laser source; the NSOM probe; a coupling substrate that is substantially transmissive to the peak wavelength; an NSOM mount to controllably hold the probe and the coupling substrate; an NSOM probe monitor coupled to the mount; an NSOM controller; and a photodetector optically coupled to the substrate. Light is coupled into the probe. The mount includes a Z motion stage. The probe monitor determines the distance between the probe tip and the coupling substrate. The controller is coupled to the probe monitor and the motion stage. It controls the distance between the probe tip and the coupling substrate such that radiation is coupled from the probe tip into the coupling substrate. The photodetector measures the power of this radiation.

Abstract: A method of segmenting a wafer. A device wafer is provided, and a medium layer is formed on the upper surface of the device wafer. Then, a carrier wafer is provided, and the medium layer is mounted on the surface of the carrier wafer. Subsequently, a segment process is performed to form a plurality of dies, and meanwhile these dies are mounted on the medium layer. Thereafter, the carrier wafer is departed from the medium layer, the dies are bonded to an extendable film, and the medium layer is removed.