Abstract: A base station for wireless communication is provided. The base station transmits to a user equipment (UE) a first Radio Resource Control (RRC) configuration and the second RRC configuration. The first RRC configuration is for configuring a first semi-persistent scheduling (SPS) physical downlink shared channel (PDSCH) and includes a first parameter indicating its relative priority for when the first SPS PDSCH overlaps with another SPS PDSCH in a time domain The second RRC configuration, which overlaps the first SPS PDSCH, is for configuring a second SPS PDSCH and includes a second parameter indicating its relative priority for when the second SPS PDSCH overlaps with another SPS PDSCH in the time domain.

Abstract: A storage box includes an electronic device, a box body, and an electronic label module, wherein an edition application program of the electronic device sends product information. The electronic label module is disposed on the box body and includes an induction antenna receiving an information stream containing the product information and a current; a rectifier circuit collecting and stabilizing the current; a microprocessor receiving the information stream and converting a format of the product information; and an electronic ink screen receiving the current provided by the rectifier circuit, triggered by the current, and receiving the information stream from the microprocessor, and presenting the product information. The storage box of the present invention can update the picture on the screen and present the product information on the screen without using a power supply.

Abstract: A method for signal transmission and apparatus thereof are provided. Particularly, an uplink signal transmission method is provided, comprising: reporting parameters of signal transmission quality in a specific modulation mode; acquiring configuration parameters of an uplink physical channel and/or a physical signal; and transmitting an uplink signal according to the configuration parameters of the uplink physical channel and/or the physical signal.

Abstract: A magnetic random access memory structure includes a first dielectric layer; a bottom electrode layer disposed on the first dielectric layer; a spin orbit coupling layer disposed on the bottom electrode layer; a magnetic tunneling junction (MTJ) element disposed on the spin orbit coupling layer; a top electrode layer disposed on the MTJ element; a protective layer surrounding the MTJ element and the top electrode layer, and the protective layer masking the spin orbit coupling layer; and a spacer layer surrounding the protective layer.

Abstract: An electric motor includes a motor main body and an inverter. The inverter is axially stacked on one end of the motor main body, and the inverter includes a gate driver, a control circuit, a capacitor module, a DC bus bar, a plurality of power modules and a plurality of AC bus bars. The power module includes a plurality of AC output terminals, a plurality of DC input terminals and a plurality of signal terminals, and the AC bus bars are respectively connected to corresponding AC output terminals and extend downward to a motor coil of the motor main body. The power modules and the corresponding DC input terminals are annularly arranged around the capacitor module, the DC bus bar is extended and electrically connected to the corresponding DC input terminals and the capacitor module.

Abstract: A probe head structure is provided. The probe head structure includes a flexible substrate having a top surface and a bottom surface. The probe head structure includes a first probe pillar passing through the flexible substrate. The probe head structure includes a redistribution structure on the top surface of the flexible substrate and the first probe pillar. The probe head structure includes a wiring substrate over the redistribution structure. The probe head structure includes a first conductive bump connected between the wiring substrate and the redistribution structure.

Abstract: A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a buffer structure penetrating into the substrate. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The chip package structure includes a first wiring structure over the buffer structure and the substrate. The first wiring structure includes a first dielectric structure and a first wiring layer in the first dielectric structure. The chip package structure includes a chip package bonded to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.

Abstract: A biodegradable double-J stent and a method of manufacturing a biodegradable double-J stent are provided. The stent comprises a main tube, a first retaining tube, and a second retaining tube, each fabricated from a biodegradable material. The first and second retaining tubes are curl-shaped and are connected to two ends of the main tube, respectively. The method of manufacturing a biodegradable double-J stent comprises the steps of: (a) providing a tube made of a biodegradable material; and (b) bending two ends of the tube to render the two ends curl-shaped and keeping a middle segment between the two ends straight. The two curl-shaped ends define a first retaining tube and a second retaining tube, respectively, and the middle segment defines a main tube. The biodegradable double-J stent precludes a ureteral obstruction which might otherwise occur with conventional double-J stents not removed in a timely manner.

Abstract: A method for preparing a bisphenol phosphate hydroxyl aluminum salt nucleating agent is provided, which adopts organic aluminum alcoholate as raw materials to prepare bisphenol phosphate hydroxyl aluminum salt. In prior art, a neutralization reaction of bisphenol phosphate and sodium hydroxide is firstly performed, so as to prepare bisphenol phosphate sodium salt; then a double decomposition reaction of sodium salt and inorganic aluminum salt is performed to prepare the bisphenol phosphate hydroxyl aluminum salt. The present invention combines the two-step reaction in prior art into the one-step reaction of phosphate and organic aluminum alcoholate for synthesizing the bisphenol phosphate hydroxyl aluminum salt, thereby simplifying the production process, improving the production efficiency, shortening the reaction time, and improving the product quality.

Abstract: An air conditioner indoor unit includes: a shell having an air inlet and an air outlet, the air outlet is located at the bottom of the shell; and at least one heat exchanger group. The air flows through the air inlet and is subjected to heat exchange via the at least one heat exchanger group, and then flows out from the air outlet. The heat exchanger group includes: a first heat exchanger; a second heat exchanger arranged to be inclined with respect to a first direction, a lower end portion of the second heat exchanger being connected to an upper end portion of the first heat exchanger; a third heat exchanger spaced apart from the first heat exchanger; and a fourth heat exchanger arranged to be inclined with respect to the first direction.

Abstract: A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.

Abstract: A method of leak detection for oil and gas pipeline based on excitation response and system thereof includes: applying an active excitation signal (a pressure pulse directly input by human) or a passive excitation signal (a pressure fluctuation caused by opening and closing valves, etc.) to an oil and gas pipeline with existing leakage points, the excitation signal is reflected at the pipeline boundary and the leakage, and the reflected pressure wave continues to propagate to upstream and downstream, and finally is collected by the dynamic pressure transducer, then the existing leakage of the pipeline is detected and positioned by analyzing the transient response signal and the reflected pressure wave of leakage signal.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The method includes forming an isolation structure in a substrate to define an isolating region and forming a capacitor structure on an upper surface of the isolation structure and comprising a first semiconductor structure and a second semiconductor structure separated by an insulator pattern. The first semiconductor structure and the second semiconductor structure are formed with upper surfaces aligned with one another.

Abstract: A reality image reconstruction system includes: a sensing device for sensing an outdoor environment and objects therein to generate environmental parameters of the outdoor environment and object parameters of said objects; a cloud server for receiving the environmental parameters of the outdoor environment, the object parameters of said objects, and movement parameters of the sensing device to establish prediction parameters and physical parameters of said objects in the outdoor environment; a simulation device for establishing a virtual environment synchronized with the outdoor environment according to the environmental parameters of the outdoor environment, the object parameters, the prediction parameters and the physical parameters of said objects; and an interactive device for interacting with said objects realistically in the virtual environment according to the environmental parameters of the outdoor environment, the object parameters, the prediction parameters and the physical parameters of said object

Abstract: A package structure is provided. The package structure includes a substrate and a chip-containing structure bonded to the substrate. The package structure also includes a warpage-control element attached to the substrate. The warpage-control element has a protruding portion extending into the substrate.

Abstract: Disclosed is a light-emitting diode which includes a light-emitting epitaxial layered unit, an insulation layer, a transparent conductive layer, a protective layer, a first electrode, and a second electrode. The light-emitting epitaxial layered unit includes a first semiconductor layer, a second semiconductor layer, and a light-emitting layer sandwiched between the first and second semiconductor layers, and has a first electrode region which includes a pad area and an extension area. The insulation layer is disposed on the first semiconductor layer and at the extension area of the first electrode region. Also disclosed is a method for manufacturing the light-emitting diode.

Abstract: The present disclosure discloses a micro-flow valve control mechanism, which comprises an electromagnetic coil, a base, a ring seat, a moving plate and an elastic plate; wherein the elastic plate is positioned above the base, the ring seat and the moving plate are positioned between the base and the clastic plate, the moving plate is positioned at the inner side of the ring seat. In this scheme, the structure of valve air intake control is optimized, and the ring seat plays the guiding role in the lifting of the moving plate to a certain extent, which ensures that the moving plate will not deflect in the air intake process, so that the outer ring at the lower side of the moving plate can allow air to enter uniformly, thus ensuring the working stability of the electromagnetic valve.

Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.

Abstract: A package structure is provided. The package structure includes a package component over a redistribution structure, a substrate under the redistribution structure, and an underfill material over the redistribution structure and including a first extending portion in the structure. The package component has a first sidewall and a second sidewall connected to the first sidewall at a first corner. In a plan view, the first extending portion has a first sidewall passing through the first sidewall of the package component and a second sidewall opposite to the first sidewall of the first extending portion and passing through the second sidewall of the package component.

Abstract: A magnetic random access memory structure includes a first dielectric layer, a bottom electrode layer disposed on the first dielectric layer; a spin orbit coupling layer disposed on the bottom electrode layer; a magnetic tunneling junction (MTJ) element disposed on the spin orbit coupling layer; a top electrode layer disposed on the MTJ element; a protective layer surrounding the MTJ element and the top electrode layer, and the protective layer masking the spin orbit coupling layer; a mask layer surrounding the protective layer, and a spacer layer surrounding the mask layer and the protective layer.