Patents by Inventor Chen-Ming Huang

Chen-Ming Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250081523
    Abstract: A semiconductor die and the method of forming the same are provided. The semiconductor die includes a first interconnect structure, a second interconnect structure including a conductive feature, and a device layer between the first interconnect structure and the second interconnect structure. The device layer includes a semiconductor fin, a first gate structure on the semiconductor fin, a source/drain region adjacent the first gate structure, and a shared contact extending through the semiconductor fin to be electrically connected to the source/drain region and the first gate structure. The conductive feature contacts the shared contact.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 6, 2025
    Inventors: Chen-Ming Lee, Shih-Chieh Wu, Po-Yu Huang, I-Wen Wu, Fu-Kai Yang, Mei-Yun Wang
  • Publication number: 20250068197
    Abstract: A power ground noise reduction system includes a bandgap circuit and a noise reduction circuit. The bandgap circuit includes an input terminal for receiving a working voltage, and an output terminal for outputting a bandgap reference voltage. The noise reduction circuit includes a first input terminal coupled to the output terminal of the bandgap circuit for receiving the bandgap reference voltage, a second input terminal for receiving the working voltage, a ground terminal coupled to a low voltage terminal, a first current source for receiving the working voltage received by the second input terminal and generating a first current, and a second current source for generating a second current to the low voltage terminal through the ground terminal.
    Type: Application
    Filed: August 21, 2023
    Publication date: February 27, 2025
    Applicant: Himax Imaging Limited
    Inventors: Puo-Tsang Huang, Zheng-Zhi Huang, Ya-Sen Chang, Chen-Cheng-Hung Hung, Ghia-Ming Hong
  • Publication number: 20250062194
    Abstract: A semiconductor device includes a first conductive layer, a second conductive layer, a third conductive layer, a first organic layer, a first inorganic layer and a first silicon-containing layer. The third conductive layer is disposed between and electrically isolated from the first conductive layer and the second conductive layer. The first organic layer continuously covers the first conductive layer and the third conductive layer. The first inorganic layer is disposed over the first organic layer. The first silicon-containing layer is inserted between the first organic layer and the first inorganic layer, wherein the second conductive layer is disposed on and disposed in the first organic layer, the first silicon-containing layer and the first inorganic layer, to electrically connect to the first conductive layer.
    Type: Application
    Filed: November 4, 2024
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Lung Yang, Chih-Hung Su, Chen-Shien Chen, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin
  • Patent number: 12224324
    Abstract: A semiconductor structure and a method of forming the same are provided. An exemplary method of forming the semiconductor structure includes receiving a workpiece including a fin structure over a front side of a substrate, recessing a source region of the fin structure to form a source opening, extending the source opening into the substrate to form a plug opening, forming a semiconductor plug in the plug opening, planarizing the substrate to expose the semiconductor plug from a back side of the substrate, performing a first wet etching process to remove a portion of the substrate, performing a pre-amorphous implantation (PAI) process to amorphize a rest portion of the substrate, performing a second wet etching process to remove the amorphized rest portion of the substrate to form a dielectric opening, depositing a dielectric layer in the dielectric opening, and replacing the semiconductor plug with a backside source contact.
    Type: Grant
    Filed: July 19, 2023
    Date of Patent: February 11, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Po-Yu Huang, Chen-Ming Lee, I-Wen Wu, Fu-Kai Yang, Mei-Yun Wang
  • Patent number: 12222748
    Abstract: A clock generating circuit includes an input terminal, configured to receive a clock signal; an output terminal, configured to output an output signal; a gray counter circuit, coupled to the input terminal, and configured to divide the clock signal to produce a first output signal; and a shielding circuit, coupled to the input terminal, the gray counter circuit and the output terminal, and configured to shield a glitch in the first output signal to generate the output signal according to the clock signal.
    Type: Grant
    Filed: April 6, 2023
    Date of Patent: February 11, 2025
    Assignee: Himax Imaging Limited
    Inventors: Ghia-Ming Hong, Zheng-Zhi Huang, Puo-Tsang Huang, Ya-Sen Chang, Chen-Cheng-Hung Hung
  • Publication number: 20240381637
    Abstract: A field effect transistor includes a source region and a drain region embedded in a portion of a semiconductor substrate; a gate dielectric overlying a channel region located between the source region and the drain region; a gate electrode overlying the gate dielectric; a dielectric gate liner laterally surrounding the gate electrode; a inner gate spacer laterally surrounding the dielectric gate liner; a contoured gate capping dielectric including a vertically-extending portion that laterally surrounds the inner gate spacer and a horizontally-extending portion that overlies the gate electrode; and a outer gate spacer laterally surrounding the contoured gate capping dielectric.
    Type: Application
    Filed: May 9, 2023
    Publication date: November 14, 2024
    Inventors: Yu-Hsiang Yang, Chen-Ming Huang, Po-Wei Liu, Shih-Hsien Chen, Hung-Ling Shih, Chang Hung-Chang
  • Publication number: 20240296890
    Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.
    Type: Application
    Filed: May 13, 2024
    Publication date: September 5, 2024
    Inventors: Chen-Ming Huang, Wen-Tuo Huang, Yu-Hsiang Yang, Yu-Ling Hsu, Wei-Lin Chang, Chia-Sheng Lin, ShihKuang Yang, Yu-Chun Chang, Hung-Ling Shih, Po-Wei Liu, Shih-Hsien Chen
  • Publication number: 20240282637
    Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the gate structure, and a single diffusion break (SDB) structure in the ILD layer and the fin-shaped structure. Preferably, the SDB structure includes a bottom portion and a top portion on the bottom portion, in which the top portion and the bottom portion include different widths.
    Type: Application
    Filed: March 22, 2024
    Publication date: August 22, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Ling Lin, Wen-An Liang, Chen-Ming Huang
  • Patent number: 12009033
    Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: June 11, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Ming Huang, Wen-Tuo Huang, Yu-Hsiang Yang, Yu-Ling Hsu, Wei-Lin Chang, Chia-Sheng Lin, ShihKuang Yang, Yu-Chun Chang, Hung-Ling Shih, Po-Wei Liu, Shih-Hsien Chen
  • Publication number: 20240188289
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method includes forming a first conductive structure over a substrate. A first intermediate sidewall spacer is formed to surround the first conductive structure. A masking material is formed over the substrate and around the first intermediate sidewall spacer. A part of the first intermediate sidewall spacer protrudes outward from the masking material. The part of the first intermediate sidewall spacer that protrudes outward from the masking material is etched to form a first sidewall spacer.
    Type: Application
    Filed: January 4, 2024
    Publication date: June 6, 2024
    Inventors: Josh Lin, Chia-Ta Hsieh, Chen-Ming Huang, Chi-Wei Ho
  • Patent number: 11972984
    Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the gate structure, and a single diffusion break (SDB) structure in the ILD layer and the fin-shaped structure. Preferably, the SDB structure includes a bottom portion and a top portion on the bottom portion, in which the top portion and the bottom portion include different widths.
    Type: Grant
    Filed: December 26, 2022
    Date of Patent: April 30, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Ling Lin, Wen-An Liang, Chen-Ming Huang
  • Patent number: 11954937
    Abstract: A fingerprint sensing system is configured to receive an illumination beam which is reflected by a finger and then transmitted to the fingerprint sensing system to generate a fingerprint image. The fingerprint sensing system includes a plurality of microlenses, a sensor, a first light filter layer, and a second light filter layer. The microlenses are arranged in an array. The sensor has a plurality of sensing pixels arranged in an array. The first light filter layer is disposed between the microlenses and the sensor and has a plurality of first openings. The second light filter layer is disposed between the first light filter layer and the sensor and has a plurality of second openings. The illumination beam passes through the first openings or the second openings, so that the sensor receives the illumination beam.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: April 9, 2024
    Assignee: Powerchip Semiconductor Manufacturing Corporation
    Inventor: Chen-Ming Huang
  • Patent number: 11903192
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first gate structure over a substrate and laterally surrounded by a first sidewall spacer. The first gate structure protrudes outward from a top of the first sidewall spacer. A second gate structure is over the substrate and is laterally surrounded by a second sidewall spacer. The first gate structure has a first height that is larger than a second height of the second gate structure. The first sidewall spacer has a first cross-sectional profile that is a different shape and a different size than a second cross-sectional profile of the second sidewall spacer.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: February 13, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Josh Lin, Chia-Ta Hsieh, Chen-Ming Huang, Chi-Wei Ho
  • Patent number: 11854621
    Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Chen-Ming Huang, Wen-Tuo Huang, ShihKuang Yang, Yu-Chun Chang, Shih-Hsien Chen, Yu-Hsiang Yang, Yu-Ling Hsu, Chia-Sheng Lin, Po-Wei Liu, Hung-Ling Shih, Wei-Lin Chang
  • Publication number: 20230335196
    Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Inventors: Chen-Ming Huang, Wen-Tuo Huang, Yu-Hsiang Yang, Yu-Ling Hsu, Wei-Lin Chang, Chia-Sheng Lin, ShihKuang Yang, Yu-Chun Chang, Hung-Ling Shih, Po-Wei Liu, Shih-Hsien Chen
  • Publication number: 20230135742
    Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the gate structure, and a single diffusion break (SDB) structure in the ILD layer and the fin-shaped structure. Preferably, the SDB structure includes a bottom portion and a top portion on the bottom portion, in which the top portion and the bottom portion include different widths.
    Type: Application
    Filed: December 26, 2022
    Publication date: May 4, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Ling Lin, Wen-An Liang, Chen-Ming Huang
  • Publication number: 20230062874
    Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Chen-Ming HUANG, Wen-Tuo HUANG, ShihKuang YANG, Yu-Chun CHANG, Shih-Hsien CHEN, Yu-Hsiang YANG, Yu-Ling HSU, Chia-Sheng LIN, Po-Wei LIU, Hung-Ling SHIH, Wei-Lin CHANG
  • Patent number: 11569133
    Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the gate structure, and a single diffusion break (SDB) structure in the ILD layer and the fin-shaped structure. Preferably, the SDB structure includes a bottom portion and a top portion on the bottom portion, in which the top portion and the bottom portion include different widths.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: January 31, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Ching-Ling Lin, Wen-An Liang, Chen-Ming Huang
  • Publication number: 20220245374
    Abstract: A fingerprint sensing system is configured to receive an illumination beam which is reflected by a finger and then transmitted to the fingerprint sensing system to generate a fingerprint image. The fingerprint sensing system includes a plurality of microlenses, a sensor, a first light filter layer, and a second light filter layer. The microlenses are arranged in an array. The sensor has a plurality of sensing pixels arranged in an array. The first light filter layer is disposed between the microlenses and the sensor and has a plurality of first openings. The second light filter layer is disposed between the first light filter layer and the sensor and has a plurality of second openings. The illumination beam passes through the first openings or the second openings, so that the sensor receives the illumination beam.
    Type: Application
    Filed: March 16, 2021
    Publication date: August 4, 2022
    Applicant: Powerchip Semiconductor Manufacturing Corporation
    Inventor: Chen-Ming Huang
  • Patent number: 11358252
    Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: June 14, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shih-Chi Lin, Kun-Tai Wu, You-Hua Chou, Chih-Tsung Lee, Min Hao Hong, Chih-Jen Wu, Chen-Ming Huang, Soon-Kang Huang, Chin-Hsiang Chang, Chih-Yuan Yang