Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method includes forming a first conductive structure over a substrate. A first intermediate sidewall spacer is formed to surround the first conductive structure. A masking material is formed over the substrate and around the first intermediate sidewall spacer. A part of the first intermediate sidewall spacer protrudes outward from the masking material. The part of the first intermediate sidewall spacer that protrudes outward from the masking material is etched to form a first sidewall spacer.

Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the gate structure, and a single diffusion break (SDB) structure in the ILD layer and the fin-shaped structure. Preferably, the SDB structure includes a bottom portion and a top portion on the bottom portion, in which the top portion and the bottom portion include different widths.

Abstract: A fingerprint sensing system is configured to receive an illumination beam which is reflected by a finger and then transmitted to the fingerprint sensing system to generate a fingerprint image. The fingerprint sensing system includes a plurality of microlenses, a sensor, a first light filter layer, and a second light filter layer. The microlenses are arranged in an array. The sensor has a plurality of sensing pixels arranged in an array. The first light filter layer is disposed between the microlenses and the sensor and has a plurality of first openings. The second light filter layer is disposed between the first light filter layer and the sensor and has a plurality of second openings. The illumination beam passes through the first openings or the second openings, so that the sensor receives the illumination beam.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first gate structure over a substrate and laterally surrounded by a first sidewall spacer. The first gate structure protrudes outward from a top of the first sidewall spacer. A second gate structure is over the substrate and is laterally surrounded by a second sidewall spacer. The first gate structure has a first height that is larger than a second height of the second gate structure. The first sidewall spacer has a first cross-sectional profile that is a different shape and a different size than a second cross-sectional profile of the second sidewall spacer.

Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.

Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.

Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the gate structure, and a single diffusion break (SDB) structure in the ILD layer and the fin-shaped structure. Preferably, the SDB structure includes a bottom portion and a top portion on the bottom portion, in which the top portion and the bottom portion include different widths.

Abstract: A memory device and method of making the same are disclosed. The memory device includes transistor devices located in both a memory region and a logic region of the device. Transistor devices in the memory region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, a second oxide layer over the first nitride layer, and a second nitride layer over the second oxide layer. Transistor devices in the logic region include sidewall spacers having a first oxide layer over a side surface of a gate structure, a first nitride layer over the first oxide layer, and a second nitride layer over the first nitride layer.

Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the gate structure, and a single diffusion break (SDB) structure in the ILD layer and the fin-shaped structure. Preferably, the SDB structure includes a bottom portion and a top portion on the bottom portion, in which the top portion and the bottom portion include different widths.

Abstract: A fingerprint sensing system is configured to receive an illumination beam which is reflected by a finger and then transmitted to the fingerprint sensing system to generate a fingerprint image. The fingerprint sensing system includes a plurality of microlenses, a sensor, a first light filter layer, and a second light filter layer. The microlenses are arranged in an array. The sensor has a plurality of sensing pixels arranged in an array. The first light filter layer is disposed between the microlenses and the sensor and has a plurality of first openings. The second light filter layer is disposed between the first light filter layer and the sensor and has a plurality of second openings. The illumination beam passes through the first openings or the second openings, so that the sensor receives the illumination beam.

Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first gate structure over a substrate and laterally surrounded by a first sidewall spacer. The first gate structure protrudes outward from a top of the first sidewall spacer. A second gate structure is over the substrate and is laterally surrounded by a second sidewall spacer. The first gate structure has a first height that is larger than a second height of the second gate structure. The first sidewall spacer has a first cross-sectional profile that is a different shape and a different size than a second cross-sectional profile of the second sidewall spacer.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip having a flash gate structure disposed over a substrate and including a control gate separated from a floating gate by an inter-electrode dielectric. One or more first sidewall spacers laterally surround the flash gate structure. The inter-electrode dielectric is directly between the one or more first sidewall spacers. A logic gate structure is disposed over the substrate and is laterally surrounded by one or more second sidewall spacers having a smaller height than the one or more first sidewall spacers.

Abstract: Disclosed herein is a sustained-release formulation that includes, based on the total weight of the sustained-release formulation, 5 wt % to 40 wt % of pregabalin, or a pharmaceutically acceptable salt, solvate or hydrate thereof, 0.1 wt % to 5 wt % of carbomer, and 20 wt % to 60 wt % of polyethylene oxide, wherein the formulation is free from polyvinyl acetate. The formulation can release pregabalin consistently over a time period of 24 hours, and is suitable for once-daily administration.

Abstract: A portable human exoskeleton system includes a pelvis module, a leg module and a foot module. The pelvis module includes a bendable member and a pelvis module connector. The foot module includes a foot module connector. The leg module includes: a femur module detachably coupled to the pelvis module connector; a tibia module detachably coupled to the foot module connector; and a knee joint component having at least two linkages with different lengths wherein each linkage is pivotally coupled to the femur module and the tibia module. Weight above the hip of the user is exerted on the pelvis module, and transferred to the leg module and the foot module. The exoskeleton system is easily disassembled and carried, and can be worn inside attire without affecting appearance of the user.

Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the gate structure, and a single diffusion break (SDB) structure in the ILD layer and the fin-shaped structure. Preferably, the SDB structure includes a bottom portion and a top portion on the bottom portion, in which the top portion and the bottom portion include different widths.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip having a flash gate structure disposed over a substrate and including a control gate separated from a floating gate by an inter-electrode dielectric. One or more first sidewall spacers laterally surround the flash gate structure. The inter-electrode dielectric is directly between the one or more first sidewall spacers. A logic gate structure is disposed over the substrate and is laterally surrounded by one or more second sidewall spacers having a smaller height than the one or more first sidewall spacers.

Abstract: A method for fabricating semiconductor device includes the steps of: forming a fin-shaped structure on a substrate; forming a first gate structure and a second gate structure on the fin-shaped structure and an interlayer dielectric (ILD) layer around the first gate structure and the second gate structure; transforming the first gate structure and the second gate structure into a first metal gate and a second metal gate; forming a hard mask on the first metal gate and the second metal gate; removing part of the hard mask, the second metal gate, and part of the fin-shaped structure to form a trench; and forming a dielectric layer into the trench to form a single diffusion break (SDB) structure.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first gate disposed over a substrate and having a first height measured between an upper surface of the substrate and a first uppermost surface of the first gate structure. A second gate structure is disposed over the substrate and has a second height measured between the upper surface of the substrate and a second uppermost surface of the second gate structure. The second height is smaller than the first height. A first sidewall spacer laterally surrounds the first gate structure and is recessed below the first uppermost surface. A second sidewall spacer laterally surrounds the second gate structure. A top of the first sidewall spacer is arranged along a horizontal plane that is vertically between the first uppermost surface and the second uppermost surface.

Abstract: A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.