Abstract: A system includes a video traffic information analysis module configured to acquire a traffic condition parameter of a road network from video traffic information; a traffic condition prediction module configured to predict a traffic condition in a future period of time according to the traffic condition parameter to obtain a traffic condition prediction result; an actual traffic condition assessment module configured to assess an actual traffic condition based on the traffic condition parameter and according to a traffic condition evaluation model to obtain an actual traffic condition assessment result; and a traffic control decision module configured to determine a control scheme for a controllable traffic element using an optimization algorithm according to the traffic condition prediction result and the actual traffic condition assessment result.

Abstract: A device may include a metal contact between a first isolation region and a second isolation region on a first surface of an epitaxial layer. The device may include a first sidewall and a second sidewall on a second surface of the epitaxial layer distal to the first isolation region and the second isolation region. The device may include a wavelength converting layer on the epitaxial layer between the first sidewall and the second sidewall.

Abstract: A device may include a wavelength converting layer on an epitaxial layer. The wavelength converting layer may include a first surface having a width that is equal to a width of the epitaxial layer, a second surface having a width that is less than the width of the first surface, and angled sidewalls. A conformal non-emission layer may be formed on the angled sidewalls and sidewalls of the epitaxial layer, such that the second surface of the wavelength converting layer is exposed.

Abstract: A wavelength converting layer is partially diced to generate a first and second wavelength converting layer segment and to allow partial isolation between the first segment and the second segment such that the wavelength converting layer segments are connected by a connecting wavelength converting layer. The first and second wavelength converting layer segments are attached to a first and second light emitting device, respectively to create a first and second pixel. The connecting wavelength converting layer segment is removed to allow complete isolation between the first pixel and the second pixel. An optical isolation material is applied to exposed surfaces of the first and second pixel and a sacrificial portion of the wavelength converting layer segments and optical isolation material attached to the sacrificial portion is removed from a surface facing away from the first light emitting device, to expose a emitting surface of the first wavelength converting layer segment.

Abstract: A light emitting diode (LED) array may include an epitaxial layer comprising a first pixel and a second pixel separated by an isolation region. A reflective layer may be formed on the epitaxial layer. A p-type contact layer may be formed on the reflective layer. The isolation region may have a width that is at least a width of a trench formed in a p-type contact layer.

Abstract: A device may include a substrate having a first embedded transistor in a first region and a second embedded transistor in a second region. The first region and the second region may be separated by trench extending through at least a portion of an epitaxial layer formed on the substrate. The first embedded transistor may be connected to a first light emitting diode (LED) and the second embedded transistor may be connected to a second LED. A first optical isolation layer may be between the epitaxial layer and the first region of the substrate. A second optical isolation layer may be between the epitaxial layer and the second region of the substrate.

Abstract: A first component with a first sidewall and a second component with a second sidewall may be mounted onto an expandable film such that an original distance X is the distance between the first sidewall and the second sidewall. The expandable film may be expanded such that an expanded distance Y is the distance between the first sidewall and the second sidewall and expanded distance Y is greater than original distance X. A first sidewall material may be applied within at least a part of a space between the first sidewall and the second sidewall. The expandable film may be expanded such that a contracted distance Z is the distance between the first sidewall and the second sidewall, and contracted distance Z is less than expanded distance Y.

Abstract: A method of extracting an image of a port wharf through multispectral interpretation includes: first, extracting a blurred coastline by assigning values to grayscale values; then, performing a smoothing and noise removal processing on a remote sensing image in a targeted area to extract edge information; sequentially, establishing a multispectral database of a targeted port wharf; and extracting a port wharf using a projected eigenvector, performing an MAF transformation on the regularized kernel function again, projecting multivariate observed values to original eigenvectors, and identifying a remote sensing image area corresponding to the original eigenvector smaller than a transformation variance as a port wharf to be extracted, and then carrying out a validation operation.

Abstract: A method of extracting an image of a port wharf through multispectral interpretation includes: first, extracting a blurred coastline by assigning values to grayscale values; then, performing a smoothing and noise removal processing on a remote sensing image in a targeted area to extract edge information; sequentially, establishing a multi spectral database of a targeted port wharf; and extracting a port wharf using a projected eigenvector, performing an MAF transformation on the regularized kernel function again, projecting multivariate observed values to original eigenvectors, and identifying a remote sensing image area corresponding to the original eigenvector smaller than a transformation variance as a port wharf to be extracted, and then carrying out a validation operation.

Abstract: A photosensitive detection unit has a composite dielectric gate MOS-C portion and a composite dielectric gate MOSFET portion. The two portions are formed above a same P-type semiconductor substrate, and share a charge coupled layer. A plurality of the photosensitive detection units are arranged on a same P-type semiconductor substrate in form of an array to obtain a detector. Adjacent unit pixels in the detector are isolated by deep trench isolation regions and P+-type injection regions below the isolation regions. During the detection, the P-type semiconductor substrate in the composite dielectric gate MOS-C portion senses light and then couples photoelectrons to the charge coupled layer, and photoelectronic signals are read by the composite dielectric gate MOSFET portion.

Abstract: Solar cells having emitter regions composed of wide bandgap semiconductor material are described. In an example, a method includes forming, in a process tool having a controlled atmosphere, a thin dielectric layer on a surface of a semiconductor substrate of the solar cell. The semiconductor substrate has a bandgap. Without removing the semiconductor substrate from the controlled atmosphere of the process tool, a semiconductor layer is formed on the thin dielectric layer. The semiconductor layer has a bandgap at least approximately 0.2 electron Volts (eV) above the bandgap of the semiconductor substrate.

Abstract: A processor comprises an array of computing elements, with each computing element comprising an arithmetic logic circuit (ALC) and at least one three-dimensional memory (3D-M) array. The 3D-M array stores at least a portion of a look-up table (LUT) for a non-arithmetic function, while the ALC performs arithmetic operations on the LUT data.

Abstract: A processor comprises an array of computing elements, with each computing element comprising an arithmetic logic circuit (ALC) and at least one three-dimensional memory (3D-M) array. The 3D-M array stores at least a portion of a look-up table (LUT) for a non-arithmetic function, while the ALC performs arithmetic operations on the LUT data. Because they include more operations than the basic arithmetic operations (i.e. addition, subtraction and multiplication), the non-arithmetic functions cannot be implemented by the conventional logic circuits alone.

Abstract: An SSIC (SuperSpeed Inter-Chip) device comprises a detecting circuit operable to execute at least one of a first and a second detection processes and generate a detection result, wherein the first detection process is operable to detect an SSIC compatible object and the second detection process is operable to detect whether the SSIC compatible object satisfies at least one of a de-link state and a re-link state, a control circuit operable to generate a control signal according to the detection result, and a Mobile-Physical-Layer circuit operable to execute at least one of the following steps: if the control signal indicates that the SSIC compatible object is detected and satisfies the de-link state, disconnecting a normal connection between the SSIC device and the SSIC host; and if the control signal indicates that the SSIC compatible object is detected and satisfies the re-link state, connecting the SSIC device with the SSIC host.

Abstract: Methods of testing a semiconductor, and semiconductor testing apparatus, are described. In an example, a method for testing a semiconductor can include applying light on the semiconductor to induce photonic degradation. The method can also include receiving a photoluminescence measurement induced from the applied light from the semiconductor and monitoring the photonic degradation of the semiconductor from the photoluminescence measurement.

Abstract: An ostomy pouching device for the removal of biological waste from a patient. An embodiment of an ostomy pouching device includes an outer container housing an inner bag for receiving waste from a patient's bowel. The device includes a bowel connector to connect the bowel to the inner bag. The outer container includes an air exit aperture through which air may exit the container as it is displaced as the inner bag expands, and a gas tunnel for removing gas from the inner bag.

Abstract: Solar cells having emitter regions composed of wide bandgap semiconductor material are described. In an example, a method includes forming, in a process tool having a controlled atmosphere, a thin dielectric layer on a surface of a semiconductor substrate of the solar cell. The semiconductor substrate has a bandgap. Without removing the semiconductor substrate from the controlled atmosphere of the process tool, a semiconductor layer is formed on the thin dielectric layer. The semiconductor layer has a bandgap at least approximately 0.2 electron Volts (eV) above the bandgap of the semiconductor substrate.

Abstract: A test signal transmission apparatus used in a multi-chassis test device is provided. The test signal transmission apparatus includes global buses and test signal transmission modules each including an I/O port coupled to a test controller, a test bus coupled to an in-circuit-tester system and a bridge matrix including an output unit and an input unit. The output unit either routes a first output signal from the I/O port to the test bus, or routes the first output signal to one of the global buses and routes a second output signal from another one of the global buses to the test bus. The input unit either routes a first input signal from the test bus to the I/O port, or routes the first input signal to one of the global buses and routes a second input signal from another one of the global buses to the I/O port.

Abstract: A system includes a video traffic information analysis module configured to acquire a traffic condition parameter of a road network from video traffic information; a traffic condition prediction module configured to predict a traffic condition in a future period of time according to the traffic condition parameter to obtain a traffic condition prediction result; an actual traffic condition assessment module configured to assess an actual traffic condition based on the traffic condition parameter and according to a traffic condition evaluation model to obtain an actual traffic condition assessment result; and a traffic control decision module configured to determine a control scheme for a controllable traffic element using an optimization algorithm according to the traffic condition prediction result and the actual traffic condition assessment result.

Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.