Abstract: The present invention relates to a method and system for correcting acquisition channel of merging unit in power system which belong to the technical field of simulation data collection of power system. The present invention performs data acquisition of each channel firstly, and the acquired data is continuous and effective frequency data, then the collected data is stored to their respective backup areas, and the data storage is stopped until the amount of stored data is up to a predetermined value required for correcting, the data is corrected finally within the respective backup areas of each channel which stops the data storage. The correction process is performed by using corresponding correction module. The method for the channel correction improves the efficiency of channel correction greatly, reduces the correction error, improves the correction precision, and has more simple and convenient operation in comparison to the conventional method for channel correction by modifying hardware parameters.

Abstract: An SSIC (SuperSpeed Inter-Chip) device comprises a detecting circuit operable to execute at least one of a first and a second detection processes and generate a detection result, wherein the first detection process is operable to detect an SSIC compatible object and the second detection process is operable to detect whether the SSIC compatible object satisfies at least one of a de-link state and a re-link state, a control circuit operable to generate a control signal according to the detection result, and a Mobile-Physical-Layer circuit operable to execute at least one of the following steps: if the control signal indicates that the SSIC compatible object is detected and satisfies the de-link state, disconnecting a normal connection between the SSIC device and the SSIC host; and if the control signal indicates that the SSIC compatible object is detected and satisfies the re-link state, connecting the SSIC device with the SSIC host.

Abstract: Methods of testing a semiconductor, and semiconductor testing apparatus, are described. In an example, a method for testing a semiconductor can include applying light on the semiconductor to induce photonic degradation. The method can also include receiving a photoluminescence measurement induced from the applied light from the semiconductor and monitoring the photonic degradation of the semiconductor from the photoluminescence measurement.

Abstract: The expandable power adaptor contains a first casing member, a second casing member, a circuit assembly, and at least a metallic connector. The first casing member has a first coupling element set. The second casing member has a second coupling element set. The first and second casing members are joined to form an enclosed accommodation space. The circuit assembly and the metallic connectors electrically connected to the circuit assembly are configured in the accommodation space. To assembly, the first lower piece and the second lower piece are joined to form a complete lower piece. Then the circuit assembly and the metallic connectors are configured on the complete lower piece, and the first and second upper pieces are vertically joined to the first and second lower pieces. Additional casing members can be integrated between the first and second casing members so as to achieve the desired number of outlets.

Abstract: A folding stool includes a pair of table surface sections, a pair of leg sections, and a pivot member. The pair of table surface sections is connected to each other by the pivot member, and the pair of leg sections supports the pair of table surface sections. Each leg section includes a bottom and a top, and the top resists against the table surface section. The folding stool is made of aluminum and magnesium alloy, further includes a plurality of first connecting members and a plurality of second connecting members. Each table surface section includes a first connecting hole and a second connecting hole, and each leg section includes a third connecting hole and a fourth connecting hole. The first connecting member is connected between first connecting hole and the third connecting hole, and the second connecting member is connected between second connecting hole and the fourth connecting hole.

Abstract: The expandable power adaptor contains a first casing member, a second casing member, a circuit assembly, and at least a metallic connector. The first casing member has a first coupling element set. The second casing member has a second coupling element set. The first and second casing members are joined to form an enclosed accommodation space. The circuit assembly and the metallic connectors electrically connected to the circuit assembly are configured in the accommodation space. To assembly, the first lower piece and the second lower piece are joined to form a complete lower piece. Then the circuit assembly and the metallic connectors are configured on the complete lower piece, and the first and second upper pieces are vertically joined to the first and second lower pieces. Additional casing members can be integrated between the first and second casing members so as to achieve the desired number of outlets.

Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold including a male die and a female die; positioning an outer frame in a cavity of the female die, the outer frame including a plurality of latching portions protruding from an inner surface inwardly and a plurality of latching grooves, each latching portion including at least one receiving groove; assembling the male die to the female die; casting pressured molten metal-alloy into the cavity to form an inner structural member embedded in the outer frame, the inner structural member including a plurality of engaging portions respectively embedded in the plurality of receiving grooves, and a plurality of matching portions respectively embedded in the plurality of latching grooves; dissembling the male die from the female die; and removing the outer frame and the inner structural member from the female die.

Abstract: A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate.

Abstract: A manufacturing method for a metallic housing of an electronic device is provided. The method includes providing a die-casting mold, including a male die and a female die engaging with the male die, the male die defining a pouring gate therein, and the female die defining a cavity therein corresponding to the pouring gate; positioning a metallic outer case in the cavity of the female die as an insert; assembling the male die to the female die to cover the cavity, thereby communicating the pouring gate with the cavity; casting pressured molten metal-alloy into the cavity via the pouring gate to form an inner structural member embedded in an inner side of the outer case; dissembling the male die from the female die to expose the cavity, and removing the outer case and the inner structural member from the female die.

Abstract: Sputter tools are described. In one embodiment, an apparatus to support a wafer includes a pallet having a depression to receive the wafer. The pallet includes an opening below the depression, and an edge in the depression is to support the wafer over the opening. A cover at least partially covers the opening. In one example, the cover may be a plate with one or more holes, and a pipe may be located below each of the holes in the cover. In one embodiment, a wafer-processing system includes a processing chamber and a pallet with a depression to receive a wafer. The pallet has an opening below the depression, and an edge in the depression supports the wafer over the opening. In one such embodiment, a cover at least partially covers the opening. According to one embodiment, an energy-absorbing material is disposed below the opening in the pallet.

Abstract: A metallic housing of an electronic device, includes a metallic outer frame and an inner structural member. The metallic outer frame comprises a plurality of latching portions protruding, and a plurality of latching grooves. The inner structural member is made from metal-alloy and embedded in the outer frame by die-casting. The inner structural member comprises a peripheral sidewall, a plurality of engaging portions, and a plurality of matching portions. The plurality of engaging portions and the plurality of matching portions protrude from the peripheral sidewall outwardly. Each latching portion comprises at least two parallel latching ribs, and forms a receiving groove between two adjacent latching ribs. The plurality of engaging portions is respectively embedded in the plurality of receiving grooves, and the plurality of matching portions is respectively embedded in the plurality of latching grooves. The present disclosure further provides a manufacturing method for the metallic housing.

Abstract: A metallic housing of an electronic device includes a metallic outer case and an inner structural member embedded in the inner side of the outer case by die-casting. The outer case includes a bottom plate and a peripheral sidewall. The bottom plate is equipped with a number of latching hooks. The latching hooks are spaced from each other. The peripheral sidewall defines a receiving groove at an inner side along the peripheral sidewall. The inner structural member is made of metal alloy, and includes a base plate and a frame sidewall surrounding a periphery of the base plate, a protruding flange protruding from the frame sidewall, and a plurality of combining grooves on the base plate. The protruding flange is received in the receiving grooves, and the number of latching hooks is respectively received in the number of combining grooves.

Abstract: A safety socket includes hot/neutral slots formed in a bottom of the safety socket, a movable shielding member arranged in the safety socket to correspond to the hot/neutral slots, and an elastic element having two ends respectively fixed to the movable shielding member and a top of the safety socket. With such an arrangement, when the hot/neutral slots simultaneously receive plug prongs to insert therein, the movable shielding member is caused to move toward the top of the safety socket and when the plug prongs are withdrawn, the movable shielding member is returned by elasticity of the elastic element to shield the hot/neutral slots. Through such an operation, the moving direction of the movable shielding member is changeable so that unnecessary space of the safety socket can be eliminate to overcome the problem that a conventional safety socket has a bulky size.

Abstract: A III-nitride light emitting layer is disposed between an n-type region and a p-type region in a double heterostructure. At least a portion of the III-nitride light emitting layer has a graded composition.

Abstract: Solar cells having emitter regions composed of wide bandgap semiconductor material are described. In an example, a method includes forming, in a process tool having a controlled atmosphere, a thin dielectric layer on a surface of a semiconductor substrate of the solar cell. The semiconductor substrate has a bandgap. Without removing the semiconductor substrate from the controlled atmosphere of the process tool, a semiconductor layer is formed on the thin dielectric layer. The semiconductor layer has a bandgap at least approximately 0.2 electron Volts (eV) above the bandgap of the semiconductor substrate.

Abstract: A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate.

Abstract: A safety socket includes hot/neutral slots formed in a bottom of the safety socket, a movable shielding member arranged in the safety socket to correspond to the hot/neutral slots, and an elastic element having two ends respectively fixed to the movable shielding member and a top of the safety socket. With such an arrangement, when the hot/neutral slots simultaneously receive plug prongs to insert therein, the movable shielding member is caused to move toward the top of the safety socket and when the plug prongs are withdrawn, the movable shielding member is returned by elasticity of the elastic element to shield the hot/neutral slots. Through such an operation, the moving direction of the movable shielding member is changeable so that unnecessary space of the safety socket can be eliminate to overcome the problem that a conventional safety socket has a bulky size.

Abstract: The subject technology pertains to an herbal vaporization apparatus including an electric heat base comprising a glass pass-through tube, and a hydratube having a first end a second end, wherein the hydratube is configured to be removably coupled with the electric heat base at the second end to place the hydratube in fluidic communication with the glass pass-through tube. The electric heat base can be configured to be coupled to the hydratube such that the hydratube is vertically mounted on top of the electric heat base. The electric heat base can include a glass pass-through tube including a plurality of chambers separated by constrictions and configured to receive and transmit a volume of gas, and a heating element disposed adjacent to the glass pass-through tube to heat the volume of gas received by the glass pass-through tube. Furthermore, the herbal vaporization apparatus can also include an herbal containment unit.

Abstract: Solar cells having emitter regions composed of wide bandgap semiconductor material are described. In an example, a method includes forming, in a process tool having a controlled atmosphere, a thin dielectric layer on a surface of a semiconductor substrate of the solar cell. The semiconductor substrate has a bandgap. Without removing the semiconductor substrate from the controlled atmosphere of the process tool, a semiconductor layer is formed on the thin dielectric layer. The semiconductor layer has a bandgap at least approximately 0.2 electron Volts (eV) above the bandgap of the semiconductor substrate.

Abstract: A twisting exerciser device includes a platform rotatably disposed on a base, a bearing device disposed between the base and the platform, and a curved member having two end studs engageable with the base and the platform for securing the curved member to the platform and the base, and the curved member is contactable with a supporting surface for allowing the user to step on the platform and to conduct a balancing exercise. The platform includes a pivot axle rotatably engaged with the base, and the base includes a number of seats for supporting bearing members which are engaged between the platform and the base for rotatably supporting the platform on the base.