Patents by Inventor Chen Wang

Chen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240064984
    Abstract: A 3D memory array includes a row of stacks, each stack having alternating gate strips and dielectric strips. Dielectric plugs are disposed between the stacks and define cell areas. A data storage film and a channel film are disposed adjacent the stacks on the sides of the cell areas. The middles of the cell areas are filled with an intracell dielectric. Source lines and drain lines form vias through the intracell dielectric. The source lines and the drain lines are each provided with a bulge toward the interior of the cell area. The bulges increase the areas of the source line and the drain line without reducing the channel lengths. In some of these teachings, the areas of the source lines and the drain lines are increased by restricting the data storage film or the channel layer to the sides of the cell areas adjacent the stacks.
    Type: Application
    Filed: October 30, 2023
    Publication date: February 22, 2024
    Inventors: Sheng-Chen Wang, Feng-Cheng Yang, Meng-Han Lin, Han-Jong Chia
  • Publication number: 20240061463
    Abstract: A button structure and an electronic device are provided. The electronic device includes a housing and a button structure disposed at the housing. The button structure includes a button body and an elastic body. The button body includes a keycap and a pillar portion. The keycap is connected to one end of the pillar portion. The elastic body is sleeved on the pillar portion, and one end of the elastic body includes a first engaging portion. The first engaging portion is capable of being engaged with a part of the housing.
    Type: Application
    Filed: June 16, 2023
    Publication date: February 22, 2024
    Inventors: CHUAN-YUAN LIN, HUI-CHEN WANG, CHAN-WEI KUO, YU-PENG LAI
  • Patent number: 11910616
    Abstract: In an embodiment, a device includes: a word line extending in a first direction; a data storage layer on a sidewall of the word line; a channel layer on a sidewall of the data storage layer; a back gate isolator on a sidewall of the channel layer; and a bit line having a first main region and a first extension region, the first main region contacting the channel layer, the first extension region separated from the channel layer by the back gate isolator, the bit line extending in a second direction, the second direction perpendicular to the first direction.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: February 20, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Meng-Han Lin, Han-Jong Chia, Sheng-Chen Wang, Feng-Cheng Yang, Yu-Ming Lin, Chung-Te Lin
  • Publication number: 20240055801
    Abstract: A connecting device including a housing, a connector and an elastic element is provided. The housing comprises a connector base including a bottom plate and a side wall, the bottom plate and the side wall jointly surround a space. The connector is disposed at the connector base and located in the space. The connector includes a positioning element and a plug terminal element connected to the positioning element. The positioning element including a limit portion is connected with the plug terminal element. The elastic element abuts between the plug terminal element and the bottom plate. When the plug terminal element is moved to a skewed position by an external force, the limit portion is moved away from the bottom plate. When the external force is disappeared, the limit portion returns to abut against the bottom plate, such that the plug element is in an upright position.
    Type: Application
    Filed: May 29, 2023
    Publication date: February 15, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Ching-Yen Huang, Hsiang-Chi Hsu, Yi-Chun Tang, Hui-Chen Wang
  • Publication number: 20240055803
    Abstract: An elastic buckling element includes a base and an elastic buckling portion. The base includes a bearing surface, and the bearing surface defines a horizontal direction parallel to the bearing surface and a vertical direction perpendicular to the bearing surface, one end of the elastic buckling portion is fixed on the bearing surface of the base, and the elastic buckling portion and the base have a first height in the vertical direction, and the elastic buckling portion is arranged along the horizontal direction and has a horizontal extension length in the horizontal direction, wherein the horizontal extension length is greater than the first height.
    Type: Application
    Filed: May 30, 2023
    Publication date: February 15, 2024
    Inventors: Yu-Peng LAI, Hui-Chen WANG, Chan-Wei KUO, Chuan-Yuan LIN
  • Patent number: 11903216
    Abstract: In accordance with embodiments, a memory array is formed with a multiple patterning process. In embodiments a first trench is formed within a multiple layer stack and a first conductive material is deposited into the first trench. After the depositing the first conductive material, a second trench is formed within the multiple layer stack, and a second conductive material is deposited into the second trench. The first conductive material and the second conductive material are etched.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: February 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Feng-Cheng Yang, Meng-Han Lin, Sheng-Chen Wang, Han-Jong Chia, Chung-Te Lin
  • Patent number: 11891458
    Abstract: A preparation method of the starch-containing microsphere includes the steps of first reacting starch with a low concentration of epichlorohydrin, and then reacting the resultant product with a surfactant, followed by final crosslinking to give microspheres. The starch-containing microspheres thus prepared are polydisperse starch-containing microspheres with a uniform particle size distribution, with the particle size being in a range of 0.1-500 ?m.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: February 6, 2024
    Assignees: CHINA PETROLEUM & CHEMICAL CORPORATION, DALIAN RESEARCH INSTITUTE OF PETROLEUM AND PETROCHEMICALS, SINOPEC CORP.
    Inventors: Chao Yang, Chen Wang, Zequn Yin, Quanjie Liu
  • Patent number: 11890794
    Abstract: A mold for manufacturing an artificial shuttlecock from a semi-finished shuttlecock includes a male mold and a female mold. The male mold includes a cone frustum and a plurality of first annular grooves. The semi-finished shuttlecock is placed on an outside of the cone frustum. The first annular grooves are disposed apart on the outside of the cone frustum. The female mold includes a tapered slot, a plurality of second annular grooves and an injection channel. The second annular grooves are disposed apart on an inner surface of the tapered slot. When the semi-finished shuttlecock and the male mold are placed into the female mold, each of the first annular grooves corresponds to each of the second annular grooves to form a plurality of molded grooves. The injection channel communicates with the second annular grooves, and the molded grooves communicate with the injection channel through the second annular grooves.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: February 6, 2024
    Assignee: Victor Rackets Industrial Corp.
    Inventors: Shu-Jung Chen, Chao-Ming Chen, Tzu-Wei Wang, Hsin-Chen Wang, Yi-Ling Hou
  • Publication number: 20240036735
    Abstract: An embodiment of the present disclosure discloses a memory device. The memory device comprises a memory controller, a buffer and a memory array. The buffer is coupled to the memory controller or embedded in the memory controller. A storage space of the buffer is configured by the memory controller to include a plurality of groups. The memory array is coupled to the memory controller, and comprising a plurality of tiles. The groups are one-to-one corresponding to the tiles. Each of the groups is configured to store data to be written into the corresponding tile. The memory controller performs one or more write operations based on the groups.
    Type: Application
    Filed: July 26, 2022
    Publication date: February 1, 2024
    Inventors: Wei-Chen WANG, Tse-Yuan WANG, Yuan-Hao CHANG, Tei-Wei KUO
  • Patent number: 11889096
    Abstract: Techniques related to accelerated video enhancement using deep learning selectively applied based on video codec information are discussed. Such techniques include applying a deep learning video enhancement network selectively to decoded non-skip blocks that are in low quantization parameter frames, bypassing the deep learning network for decoded skip blocks in low quantization parameter frames, and applying non-deep learning video enhancement to high quantization parameter frames.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: January 30, 2024
    Assignee: Intel Corporation
    Inventors: Chen Wang, Ximin Zhang, Huan Dou, Yi-Jen Chiu, Sang-Hee Lee
  • Publication number: 20240025039
    Abstract: Physical features of an object from tactile robotic exploration, including by manipulation of the object with an effector having a tactile sensor that provides measurements representative of physical interaction of the effector and the object. This exploration may include performing a predetermined set of manipulations of the object using the effector. Measurements made during the manipulations are used to form a data representation of physical characteristics of the object, and this data representation is used to control further motion of the object.
    Type: Application
    Filed: October 22, 2021
    Publication date: January 25, 2024
    Inventors: Edward Adelson, Branden Romero, Filipe Fernandes Veiga, Shaoxiong Wang, Chen Wang
  • Publication number: 20240023887
    Abstract: The present disclosure discloses an ultrasound pupil change-based anesthesia depth monitoring system, including: an ultrasound monitoring apparatus, which includes a head-mounted mounting member and two miniature ultrasonic probes, the two miniature ultrasonic probes being symmetrically arranged at both sides of the head-mounted mounting member, and the miniature ultrasonic probes abutting against the face and obtaining ultrasonic pupil images by means of ultrasonic waves; an ultrasound host, which includes a display, the ultrasonic pupil images obtained by the miniature ultrasonic probes being transmitted to the ultrasound host, and the ultrasound host processing the ultrasonic pupil images and displaying pupil images, real-time change values of diameters of pupils, and the like by means of the display; and a shading patch, which is applied to the eyelids. The present disclosure further discloses a detection method of an ultrasound pupil change-based anesthesia depth monitoring system.
    Type: Application
    Filed: May 9, 2022
    Publication date: January 25, 2024
    Inventors: Chen WANG, Yanjun DENG
  • Publication number: 20240032304
    Abstract: A memory device, a semiconductor device and a manufacturing method of the memory device are provided. The memory device includes first, second and third stacking structures, first and second channel structures, a gate dielectric layer, a switching layer, and first and second gate structures. The first, second and third stacking structures are laterally spaced apart from one another, and respectively comprise a conductive layer, an isolation layer and a channel layer. The third stacking structure is located between the first and second stacking structures. The first channel structure extends between the channel layers in the first and third stacking structures. The second channel structure extends between the channel layers in the second and third stacking structures. The gate dielectric layer and the first gate structure wrap around the first channel structure. The switching layer and the second gate structure wrap around the second channel structure.
    Type: Application
    Filed: April 26, 2023
    Publication date: January 25, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Meng-Han Lin, Feng-Cheng Yang, Sheng-Chen Wang, Han-Jong Chia
  • Publication number: 20240027185
    Abstract: A method for measuring a thickness of a thin film layer disposed on a piece of glass is implemented using a computer device that stores a thin film image of the thin film layer, a surface dataset associated with a surface of the thin film layer, and a plurality of reference parameter sets each being associated with a specific thickness of the thin film layer, the method including: generating a spectral image dataset that includes spectral data associated with different pixels of the thin film image using a spectral transformation matrix; performing regression analysis on the surface dataset and the spectral image dataset, so as to obtain a thickness parameter set including a plurality of thickness parameters; and determining a thickness of the thin film layer using the thickness parameter set and the plurality of reference parameter sets.
    Type: Application
    Filed: October 27, 2022
    Publication date: January 25, 2024
    Applicant: National Chung Cheng University
    Inventors: Hsiang-Chen Wang, Yu-Yang Chen, Yu-Ming Tsao, Yu-Lin Liu, Ching-Yi Huang
  • Publication number: 20240019908
    Abstract: A quick-release cover structure includes a casing and a cover. The casing includes a through slot, a protrusion and an engagement hole. The protrusion protrudes from a first slot wall of the through slot. The engagement hole is arranged on a second slot wall of the through slot. The cover is assembled to cover the through slot, and includes a plate, an engagement member, an elastic hook and a handle. The engagement member and the elastic hook respectively protrudes from the plate and are adjacent to different side edges, the protrusion is adapted to extend through the engagement member, and the elastic hook is adapted to be engaged with the engagement hole. When the handle is moved away from the through slot by an acting force, the elastic hook is deformed and disengaged from the engagement hole, so that the cover is separated from the casing.
    Type: Application
    Filed: May 29, 2023
    Publication date: January 18, 2024
    Inventors: Chuan-Yuan LIN, Hui-Chen WANG, Chan-Wei KUO, Yu-Peng LAI
  • Publication number: 20240018334
    Abstract: Polyesters formed from epoxy and anhydride monomers, where both the epoxy and anhydride monomers include a single, e.g., cyclic backbone, so that upon depolymerization degradation, a singular monomer results, both from the epoxy and anhydride portions of the polymer. In an embodiment, such backbone may include a phthalic or other aromatic structure having dicarboxylate groups or a cycloaliphatic structure having dicarboxylate groups. The polyesters can be degraded under mild conditions with an alkali metal carbonate or alkaline earth metal catalyst. Upon such depolymerization (e.g., transesterification), the single resulting phthalic, other aromatic, or cycloaliphatic monomer can be repolymerized to produce a new polymer. Where degradation is carried out in an unsaturated alcohol, the resulting depolymerization product may be photopolymerizable.
    Type: Application
    Filed: July 13, 2023
    Publication date: January 18, 2024
    Inventors: Chen WANG, Grant M. MUSGRAVE
  • Patent number: 11873639
    Abstract: A beam-column joint structure is provided. The beam-column joint structure comprises: a hollow rectangular steel frame consisting of a first sidewall, a second sidewall, a third sidewall and a fourth sidewall and a plurality of H-beams, each of the H-beams being fixedly attached to an outer surface of at least some of these sidewalls. Some of the H-beams may be eccentric with respect to the sidewalls to which they are attached.
    Type: Grant
    Filed: December 28, 2021
    Date of Patent: January 16, 2024
    Assignee: RUENTEX ENGINEERING & CONSTRUCTION CO., LTD.
    Inventors: Samuel Yin, Jui-Chen Wang, Jhih-Syuan Chen
  • Patent number: 11874754
    Abstract: Computer-implemented methods for mitigating temperature induced performance variation in a cloud computing system are provided. Aspects include distributing a plurality of microservices among a plurality of compute nodes in a cloud computing system and monitoring a temperature of processors executing each of the plurality of microservices on each of the plurality of compute nodes. Aspects also include calculating a distribution of the temperatures of the processors including a mean temperature and identifying a first group of computing nodes from the plurality of compute nodes having temperatures within a threshold deviation from the mean temperature. Aspects further include controlling an operation of a cooling system of each of the first group of computing nodes and redistributing one or more of the plurality of microservices disposed on a remaining group of computing nodes that are not part of the first group of computing nodes.
    Type: Grant
    Filed: June 1, 2023
    Date of Patent: January 16, 2024
    Assignee: International Business Machines Corporation
    Inventors: Chen Wang, Huamin Chen
  • Publication number: 20240006803
    Abstract: A connector module is adapted to be disposed in a casing including a casing opening. The connector module includes a connector shell, an elastic rib, a connection terminal, a first and a second conductive layer. The connector shell includes a front side and a first opening. The first opening is aligned with the casing opening. The elastic rib is disposed and protrudes from the front side. The elastic rib surrounds the first opening. The connection terminal is disposed in the connector shell and exposed to the first opening. The first conductive layer is coated on the front side and the elastic rib, and contacts with the casing. The second conductive layer is laid on a side of the first conductive layer opposite to the front side and includes a second opening. The first opening and the elastic rib coated with the first conductive layer are exposed to the second opening.
    Type: Application
    Filed: April 25, 2023
    Publication date: January 4, 2024
    Applicant: PEGATRON CORPORATION
    Inventors: Hsiang-Chi Hsu, Ching-Yen Huang, Yi-Chun Tang, Hui-Chen Wang
  • Patent number: D1011514
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: January 16, 2024
    Assignee: GALEMED CORPORATION
    Inventors: Po-Chang Chen, Hsin-Chen Wang, Chia-Chin Yang, Hao-Hsiang Chen, Chun-Wei Hsu