Patents by Inventor Chen Wang

Chen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12242747
    Abstract: A data processing method in a storage system is provided. The method includes: when the storage system is under a first load, performing an inline deduplication operation; and when the storage system is under a second load, directly storing a received second data block without performing the inline deduplication operation, where the first load is less than the second load.
    Type: Grant
    Filed: June 1, 2022
    Date of Patent: March 4, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Ren Ren, Chen Wang, Haijun Dai, Fangfang Zhu
  • Patent number: 12242673
    Abstract: An information handling system keyboard illuminates key values in each of plural keycaps with a backlight located below the plural keys and directed upward through the plural keys and having illumination that adjusts color temperature under management of a controller. A light sensor detects ambient light color temperature and communicates the ambient light color temperature to the controller, which executes instructions in non-transitory memory to adjust the backlight color illumination based on the detected ambient light color temperature to increase color contrast of backlight illumination relative to ambient light and thereby better highlight the key values on the keycap upper surfaces.
    Type: Grant
    Filed: August 31, 2023
    Date of Patent: March 4, 2025
    Assignee: Dell Products L.P.
    Inventors: Wen-Pin Huang, Yao-Hsien Huang, Hsien-Tsan Chang, Yi-Chen Wang, Po-Chun Hou
  • Publication number: 20250068409
    Abstract: Systems and methods are disclosed that deploy software code from a dataset into a computing environment. The systems and method collect energy metrics of the software code while executing in the computing environment. The systems and methods determine a sustainability label for the software code based on the energy metrics. The systems and methods assign the sustainability label to the software code to produce a sustainability-based dataset.
    Type: Application
    Filed: August 24, 2023
    Publication date: February 27, 2025
    Inventors: Huamin Chen, Chen Wang
  • Publication number: 20250069785
    Abstract: The invention discloses a neodymium-iron-boron magnet material, a preparation method, and use thereof. The neodymium-iron-boron magnet material comprises following components of: R: 28.00-32.00 wt %, wherein the R is a rare earth element; Al: 0.00-1.00 wt %; Cu: 0.12-0.50 wt %; B: 0.85-1.10 wt %; and a balance of Fe, wherein wt % refers to a weight percentage of respective elements in the neodymium-iron-boron magnet material; a volume percentage of a Nd—O phase having a FCC type crystal structure in an intergranular triangular zone of the neodymium-iron-boron magnet material in a grain boundary phase of the neodymium-iron-boron magnet material is equal to or less than 20%. By reducing the proportion of the Nd—O phase having the FCC type crystal structure, the present invention enhances the demagnetizing coupling ability of the grain boundary phase and improves the consistency of the intrinsic coercivity of the magnet.
    Type: Application
    Filed: November 4, 2022
    Publication date: February 27, 2025
    Applicant: FUJIAN GOLDEN DRAGON RARE-EARTH Co., Ltd.
    Inventors: Weiguo MOU, Chen WANG, Zhigao HUANG, Gang FU, Deqin XU
  • Publication number: 20250064128
    Abstract: A resistive heater (30a) for use in an aerosol generation apparatus, and an aerosol generation apparatus are provided. The resistive heater (30a) for use in the aerosol generation apparatus includes conductive ceramic; and the resistivity of the conductive ceramic is between 1×10?4 ?·cm and 1.3×10?1 ?·cm.
    Type: Application
    Filed: December 23, 2022
    Publication date: February 27, 2025
    Inventors: Chen Wang, Zhongli Xu, Yonghai Li
  • Patent number: 12233159
    Abstract: The invention discloses an astaxanthin (AST) nanoemulsion and its manufacturing method. The manufacturing method comprising steps of: adding an AST material into a peanut oil and mixing them uniformly to obtain an AST oil; adding 0.25-1.5 (w/w) % of a surfactant into the AST oil and mixing them uniformly to obtain a mixed solution; and adding water into the mixed solution to obtain an AST emulsion precursor; and shaking the AST emulsion precursor to obtain the AST nanoemulsion.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: February 25, 2025
    Assignee: Trade Wind Biotech Co., Ltd.
    Inventors: Hui-Min Wang, Jui-Jen Chang, Hsing-Yu Huang, Yi-Chen Wang
  • Patent number: 12238926
    Abstract: In an embodiment, a device includes: a first dielectric layer having a first sidewall; a second dielectric layer having a second sidewall; a word line between the first dielectric layer and the second dielectric layer, the word line having an outer sidewall and an inner sidewall, the inner sidewall recessed from the outer sidewall, the first sidewall, and the second sidewall; a memory layer extending along the outer sidewall of the word line, the inner sidewall of the word line, the first sidewall of the first dielectric layer, and the second sidewall of the second dielectric layer; and a semiconductor layer extending along the memory layer.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Bo-Feng Young, Sai-Hooi Yeong, Han-Jong Chia, Sheng-Chen Wang, Yu-Ming Lin
  • Publication number: 20250058437
    Abstract: An impact tool includes a motor including or connected to a drive shaft for outputting power and is rotatable about a first axis, an impact assembly including a main shaft and a spring sleeved on the main shaft, a transmission assembly for transmitting the power output by the drive shaft to the main shaft, a main shaft bearing for supporting the main shaft, and a second bearing for supporting the drive shaft. The projections of the second bearing, the main shaft bearing and the spring on a reference plane perpendicular to the up and down direction have an overlapping region.
    Type: Application
    Filed: November 1, 2024
    Publication date: February 20, 2025
    Inventors: Rui Xu, Yuyi Zheng, Chen Wang, Masatoshi Fukinuki, Biao Zhang, Hongtao Ke, Hengyong Hu, Chuan Geng, Xiaoyong Wang, Di Wu
  • Publication number: 20250063029
    Abstract: An embodiment for improved authentication of chatbot users for chat history recovery. The embodiment may record a first chat conversation between a first chat service operator and a first user, wherein the first chat conversation includes a first-step authentication and a chat history. The embodiment may detect a request to resume the first chat conversation. The embodiment may, in response to detecting the request to resume the first chat conversation, initiate a recovery process by sending a random-generated token to the first-step authentication. The embodiment may receive verification of the random-generated token. The embodiment may generate, by a large language model, one or more authentication questions based on content of the chat history. The embodiment may authenticate the first user based on one or more correct answers to the one or more authentication questions. The embodiment may resume the first chat conversation including the chat history.
    Type: Application
    Filed: August 17, 2023
    Publication date: February 20, 2025
    Inventors: Bo Wen, Chen Wang, Jeremy R. Fox, Fang Lu
  • Publication number: 20250063736
    Abstract: In an embodiment, a device includes: a first word line over a substrate, the first word line including a first conductive material; a first bit line intersecting the first word line; a first memory film between the first bit line and the first word line; and a first conductive spacer between the first memory film and the first word line, the first conductive spacer including a second conductive material, the second conductive material having a different work function than the first conductive material, the first conductive material having a lower resistivity than the second conductive material.
    Type: Application
    Filed: November 4, 2024
    Publication date: February 20, 2025
    Inventors: Sai-Hooi Yeong, Chi On Chui, Sheng-Chen Wang
  • Patent number: 12228829
    Abstract: Provided is a display substrate which includes a base substrate; a plurality of rectangular pixels; at least one irregularly-shaved pixel, disposed in the irregularly-shaved display region, wherein the at least one irregularly-shaped pixel is proximal to the peripheral region relative to the rectangular pixel, and a shape of a boundary line of a side, proximal to the peripheral region, of the each irregularly-shaved pixel matches with a shape of a boundary line of the irregularly-shaved display region; and a black matrix laver.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: February 18, 2025
    Assignees: Chongqing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Zhuo Xu, Yajie Bai, Xiaofeng Ma, Haigang Yang, Chen Wang
  • Patent number: 12232322
    Abstract: A 3D memory array includes a row of stacks, each stack having alternating gate strips and dielectric strips. Dielectric plugs are disposed between the stacks and define cell areas. A data storage film and a channel film are disposed adjacent the stacks on the sides of the cell areas. The middles of the cell areas are filled with an intracell dielectric. Source lines and drain lines form vias through the intracell dielectric. The source lines and the drain lines are each provided with a bulge toward the interior of the cell area. The bulges increase the areas of the source line and the drain line without reducing the channel lengths. In some of these teachings, the areas of the source lines and the drain lines are increased by restricting the data storage film or the channel layer to the sides of the cell areas adjacent the stacks.
    Type: Grant
    Filed: October 30, 2023
    Date of Patent: February 18, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Chen Wang, Feng-Cheng Yang, Meng-Han Lin, Han-Jong Chia
  • Publication number: 20250054851
    Abstract: The present disclosure relates to a multi-mode sensor based on wafer-level packaging and its manufacturing method. The sensor comprises a base for 3D packaging, a multi-mode sensor body, a cap layer, and multiple packaging structures. The base consists of a first substrate, a dielectric layer, a first insulating layer, and multiple through silicon vias (TSVs). The cap layer comprises a second substrate and a bonding ring, where the first surface of the second substrate is provided with a cavity for housing at least part of the multi-mode sensor body. This disclosure has the advantages of high integration, high performance, low cost, miniaturization, high reliability, process feasibility and compatibility, as well as high wafer-level uniformity, making it suitable for a wide range of applications.
    Type: Application
    Filed: October 29, 2024
    Publication date: February 13, 2025
    Applicant: Tsinghua University
    Inventors: Chen Wang, Simian Zhang, Xiaonan Deng, Shengxian Ke, Yifei Wu, Zhengcao Li
  • Publication number: 20250050923
    Abstract: The present invention relates to a safety check method and device for coupling of multiple train units in rail transit, and medium, the method including: determining train formation information to obtain the length, weight and traction braking characteristics of the whole train, so as to automatically protect the running of the train on a route and realize automatic driving. Compared with the prior art, the present invention can detect the coupling states of more than 2 marshalled trains.
    Type: Application
    Filed: November 30, 2022
    Publication date: February 13, 2025
    Inventors: Ye XU, Haigang CUI, Zhichen HUA, Haiping CHU, Chen WANG
  • Publication number: 20250053467
    Abstract: Computer-implemented methods for managing instances of serverless functions in a cloud computing system are provided. Aspects include obtaining a service level objective for a serverless function, obtaining a command queue length for a graphical processing unit disposed on each of a plurality of compute nodes in the cloud computing system, and obtaining a request queue length of the serverless function. Aspects also include calculating a number of instances of the serverless function to deploy in the cloud computing system, wherein the number of instances is determined based on the service level objective and the request queue length of the serverless function, identifying compute nodes from the plurality of compute nodes to deploy each of the number of instances of the serverless function, and creating an instance of the serverless function on each of the identified compute nodes.
    Type: Application
    Filed: August 11, 2023
    Publication date: February 13, 2025
    Inventors: Eun Kyung LEE, Huamin Chen, Chen Wang
  • Patent number: 12223171
    Abstract: A metadata processing method includes a network interface card in a storage device that receives an input/output (I/O) request, where the I/O request includes a data read request or a data write request; the network interface card executes a metadata processing task corresponding to the I/O request; and when determining that the metadata processing task fails to be executed, the network interface card requests a CPU in the storage device to execute the metadata processing task.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: February 11, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chen Wang, Meng Gao, Wenlin Cui, Siwei Luo, Ren Ren
  • Publication number: 20250045087
    Abstract: Computer-implemented methods for identifying a configuration of a virtual machine and performance selecting an application for execution on the virtual machine are provided. Aspects include executing a plurality of calibration programs on a virtual machine having an unknown configuration and collecting a plurality of performance metrics from the virtual machine during execution of the plurality of calibration programs. Aspects also include inputting the plurality of metrics into a trained machine learning model, receiving, from the trained machine learning model, a predicted configuration of the virtual machine, and executing a version of an application on the virtual machine, wherein the version is determined based at least in part on the predicted configuration.
    Type: Application
    Filed: August 3, 2023
    Publication date: February 6, 2025
    Inventors: Sunyanan Choochotkaew, Chen Wang, William Caban, Huamin Chen, Marcelo Carneiro Do Amaral
  • Publication number: 20250045623
    Abstract: Systems and methods are presented to provide a first machine learning model to a collaboration platform. The systems and methods receive a second machine learning model from the collaboration platform that indicates the second machine learning model is based on the first machine learning model. The systems and methods test the second machine learning model using criteria corresponding to the first machine learning model to determine whether the second machine learning model is valid. In turn, the systems and methods publish the second machine learning model to a repository in response to determining that the second machine learning model is valid.
    Type: Application
    Filed: July 31, 2023
    Publication date: February 6, 2025
    Inventors: Huamin Chen, Marcelo Amaral, Chen Wang, Sunyanan Choochotkaew, Eun Kyung Lee, Parul Singh, Kaiyi Liu
  • Patent number: 12219775
    Abstract: A semiconductor structure and method of forming the same are provided. The semiconductor structure includes a circuit structure, an interlayer structure and a memory structure. The circuit structure includes a substrate having semiconductor devices formed thereon; a dielectric structure disposed over the semiconductor devices; and an interconnect layer embedded in the dielectric structure and connected to the semiconductor devices. The interlayer structure is disposed over the circuit structure. The memory structure is disposed over the interlayer structure and physically separated from the circuit structure by the interlayer structure.
    Type: Grant
    Filed: January 18, 2022
    Date of Patent: February 4, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Chen Wang, Meng-Han Lin, Han-Jong Chia, Feng-Cheng Yang
  • Patent number: 12216928
    Abstract: A computing node in a storage system is configured to send an instruction of migration of a parity fragment of a plurality of data fragments from a first-level storage medium to a second-level storage medium, where performance of the second-level storage medium is lower than the first-level storage medium.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: February 4, 2025
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chen Wang, Tangren Yao, Feng Wang