Abstract: Tin oxide films are used as spacers and hardmasks in semiconductor device manufacturing. In one method, tin oxide layer (e.g., spacer footing) needs to be selectively etched in a presence of an exposed silicon-containing layer, such as SiOC, SiON, SiONC, amorphous silicon, SiC, or SiN. In order to reduce damage to the silicon-containing layer the process involves passivating the silicon-containing layer towards a tin oxide etch chemistry, etching the tin oxide, and repeating passivation and etch in an alternating fashion. For example, passivation and etch can be each performed between 2-50 times. In one implementation, passivation is performed by treating the substrate with an oxygen-containing reactant, activated in a plasma, and the tin oxide etching is performed by a chlorine-based chemistry, such as using a mixture of Cl2 and BCl3.

Abstract: A bidirectional power converter includes a first switch circuit coupled to a second switch circuit via a transformer, wherein the first switch circuit is configured to transfer power to the second switch circuit during a charging mode, the second switch circuit is configured to transfer power to the first switch circuit during a discharging mode, and the first switch circuit is configured to operate in a half bridge configuration during a first portion of the charging mode.

Abstract: A network control method is configured to control the transfer to stations connected to an access point or a router under an orthogonal frequency division multiple access (OFDMA) method. The network control method includes: obtaining first specification parameters of the stations; grouping the stations into a first group and a second group according to the first specification parameters; transferring with the stations belonging to the first group during a first period; and transferring with the stations belonging to the second group during a second period. The first period is different from the second period.

Abstract: A mechanical keyboard is provided, which includes a plurality of mechanical keys, a circuit board, a plurality of first magnetic elements, a lower casing and a plurality of second magnetic elements. The mechanical keyboard has a key region and an edge region surrounding the key region. The mechanical keys are located in the key region. The circuit board is disposed beneath the mechanical keys. The first magnetic elements are disposed beneath the circuit board and distributed in the key region. The lower casing is disposed beneath the mechanical keys, the circuit board and the first magnetic elements. The second magnetic elements are disposed over the lower casing, in which the second magnetic elements respectively correspond to the first magnetic elements and respectively repel the first magnetic elements.

Abstract: A method for handling a display control of a microprocessor in an electronic device includes: receiving a display trigger signal; and controlling a panel device in the electronic device to display a content, in response to the display trigger signal; wherein a central processing unit (CPU) in the electronic device is in a power off state, when controlling the panel device to display the content.

Abstract: A system may include a gimbal defining a plurality of pockets, where each pocket may include a first portion and a second portion that extends between the first portion and a base of the pocket. The second portion may have a greater diameter than the first portion. The system may include a plurality of conditioning disks, where each conditioning disk is seated within the first portion of a respective pocket. The system may include a plurality of gaskets, where each gasket is seated within the second portion of a respective pocket. The system may include a plurality o-rings, each o-ring disposed between a peripheral edge of one of the plurality of conditioning disks and a lateral wall of one of the plurality of pockets. The system may include a plurality of shoulder screws for coupling the gimbal with one of the plurality of gaskets and a conditioning disk.

Abstract: The present disclosure provides an underwater helicopter with cycloidal rim vector propulsion. The underwater helicopter includes a disc-shaped underwater helicopter hull, a rim driving mechanism, paddles and rotation adjusting mechanisms. The rim driving mechanism is annular, and the diameter size of the rim driving mechanism is matched with the circumference size of the disc-shaped underwater helicopter hull. The rim driving mechanism is fixedly installed in a cavity in the circumference of the disc-shaped underwater helicopter hull. The rotation adjusting mechanisms are uniformly and fixedly installed on the outer side of the rim driving mechanism. The paddle is fixedly connected with the rotation adjusting mechanism.

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid dispenser having a polishing liquid port positioned over the platen to deliver polishing liquid onto the polishing pad, a temperature control system including coolant liquid fluid reservoirs for containing coolant fluids, a thermal controller configured to control the temperature of the coolant fluid within the coolant fluid reservoirs, and a first dispenser having openings in fluid connection with the coolant fluid reservoirs, the openings positioned configured to spray an aerosolized coolant liquid directly onto the polishing pad, and a second dispenser having a coolant port in fluid connection with the coolant fluid reservoirs, the coolant port positioned over the platen and configured to flow a stream of coolant liquid directly onto the polishing pad.

Abstract: Exemplary carrier heads for a chemical mechanical polishing apparatus may include a carrier body. The carrier heads may include a flexible membrane coupled with the carrier body. The flexible membrane may include a substrate-receiving surface that faces away from the carrier body. The substrate-receiving surface may include a plurality of gripping elements that protrude away from the substrate-receiving surface. Each of the plurality of gripping elements may have a maximum lateral dimension that is no greater than 2 mm.

Abstract: A variable aperture module includes a blade assembly including movable blades, a positioning element including positioning structures and a driving part including a rotation element. The movable blades are disposed around an optical axis to form a light passable hole with adjustable size for different hole size states and each have an inner surface to define the contour of the light passable hole in each hole size state. The positioning structures correspond to the movable blades. The rotation element is rotatable with respect to the positioning element and is configured to rotate the movable blades to adjust a size of the light passable hole. There are matte structures disposed on each inner surface. Each matte structure is single structure extending towards the optical axis, such that at least part of the contour of the light passable hole has an undulating shape at least in several hole size states.

Abstract: Provided are a precursor solution, and a modified layer and a lithium-based battery prepared by using the same. The modified layer is formed on the negative electrode, the positive electrode and/or the separator of the lithium-based battery by using the precursor solution through photo-polymerization reaction or thermal curing. The lithium-based battery comprising the modified layer effectively promotes the charge and discharge capability, cycling life, and safety. The modified layer can be applied to a roll-to-roll process. The formation of lithium dendrites in the lithium-based battery comprising the modified layer is significantly suppressed or reduced during the charge-discharge cycles. The shuttle effect is effectively suppressed or reduced in lithium sulfur batteries and lithium iodine batteries. All the above effects are beneficial to increasing the product value of lithium ion batteries, lithium metal batteries, anode-free lithium batteries, lithium sulfur batteries, and lithium iodine batteries.

Abstract: A method for reducing a color edge phenomenon of a display panel is provided. The method is applicable to a display panel including a plurality of pixel units. The method includes: performing pixel adjustment on the pixel units at edges of the display panel. Each pixel unit includes at least three sub-pixels: a first sub-pixel, a second sub-pixel, and a third sub-pixel. By adjusting positions, areas, or brightness of the sub-pixels, the color edge phenomenon of the display panel is effectively reduced or avoided.

Abstract: Provided are automatic cleaning devices for a monocrystalline silicon bar, which include a base frame, a sprayer, a scrubber, and an air-jetter. Bottom of an inner side of the base frame is configured to place a monocrystalline silicon bar. A plurality of groups of the sprayers, a plurality of groups of the scrubbers, and a plurality of groups of the air-jetters are all disposed on side walls and a top surface of the base frame whose bottom of an inner side is removed. The sprayer is configured to spray the monocrystalline silicon bar. The scrubber is configured to scrub the monocrystalline silicon bar. The air-jetter is configured to purge the monocrystalline silicon bar.

Abstract: Embodiments of the present disclosure are directed to a system for monitoring moving and stepping silicon wafers and a method adopts the system. The system includes a first sensing element to monitor whether a gap between adjacent silicon wafers exists, and a second sensing element to monitor whether two silicon wafers are laminated. The first sensing element and the second sensing element are both disposed in a slot where the silicon wafers are turned over, and suspended on a front side of a sorting wheel in the slot and obliquely arranged towards one side of the sorting wheel. The system installed in the narrow space between the cleaning tank and the sorting tank has simple structure and is capable of quickly and accurately monitoring the silicon wafer turnover, and accurately determining whether there is a continuous or laminated silicon wafer during the silicon wafer turnover process.

Abstract: A memory circuit includes a memory array, and a peripheral circuit. The peripheral circuit includes an internal clock generating circuit, and a first access signal generating circuit. The internal clock generating circuit is configured to, in response to a control signal pulse, generate a series of internal clock pulses at an internal clock period corresponding to a pulse width of the control signal pulse. The first access signal generating circuit is configured to, in response to a first edge of the control signal pulse, generate a first access signal. The peripheral circuit is configured to control an access operation in the memory array, based on at least one internal clock pulse in the series of internal clock pulses, and the first access signal.

Abstract: A silicon wafer transfer auxiliary device includes blowpipes disposed on a side of a sorting wheel. Nozzles of the blowpipes are inclined towards the side of the sorting wheel. The blowpipes are capable of spraying liquid or gas towards a silicon wafer during transfer to increase an adsorption force between the silicon wafer and the sorting wheel and to successfully complete a turning of the silicon wafer from a vertical direction to a side close to the sorting wheel.

Abstract: A method for forming a semiconductor device structure is described. In some embodiments, the method includes forming a gate electrode, forming a mask structure over the gate electrode, patterning the mask structure to form an opening, and performing a first etch process on the gate electrode by applying a first source power and a first bias power with a first pulsing scheme. The first bias power has a first frequency to control etching along a lateral direction. The method further includes performing a second etch process on the mask structure exposed within the opening by applying a second source power and a second bias power with a second pulsing scheme, and the second bias power has a second frequency to control etching along a vertical direction. The first and second frequencies are substantially different.

Abstract: An electronic device including a device housing, a cable, a cable positioning structure, and a housing restriction structure is provided. The device housing includes a through hole. The through hole includes a central region, a first channel region, and a second channel region. The cable passes through the device housing. The cable positioning structure is disposed on the cable. The cable positioning structure includes a first protrusion and a second protrusion. The cable positioning structure is adapted to be rotated between a first orientation and a second orientation relative to the device housing. The housing restriction structure is disposed on the device housing. The housing restriction structure includes a first restrain member and a first stopper. In a positioned state, the cable positioning structure is in the second orientation. The first restrain member and the first stopper restrict the cable positioning structure.

Abstract: An embossed PVC tape has a first surface and a second surface that are opposite to each other. The embossed PVC tape has an embossed texture formed on the first surface. The embossed texture includes a plurality of repeating patterns, and each of the repeating patterns includes a bottom portion arranged on the first surface and a side portion recessed in the first surface. The side portion has a tapered shape, and an end of the side portion away from the first surface is defined as an end point. On the first surface, a quantity of the end point formed per 3,000 square microns is one or more. A maximum static friction coefficient between the first surface and the second surface is within a range from 0.72 to 0.78.

Abstract: An imaging lens assembly includes a plurality of lens elements, a light path folding element and a sheet-like light blocking element. An optical axis is defined via the lens elements. The light path folding element includes an optical surface, and a total reflection of an imaging light of the imaging lens assembly occurs at least once on the optical surface. The sheet-like light blocking element is corresponding to the light path folding element, and the sheet-like light blocking element includes a first surface, a second surface and a microstructure layer. The first surface faces towards the optical surface. The second surface is disposed relatively to the first surface. The microstructure layer is at least disposed on the first surface, and protrusions are formed on the first surface via the microstructure layer. At least partial area between the microstructure layer and the optical surface has an air slit.