Abstract: A method of forming a semiconductor device includes providing a device having a gate stack with a metal gate layer and a spacer layer disposed on a sidewall of the gate stack. In some embodiments, the method further includes performing an etch-back process to the metal gate layer to form an opening over the gate stack. In various examples, the method further includes performing a plasma treatment process to modify a profile of the opening. In some cases, the method further includes forming a HM layer over the metal gate layer and within the opening having the modified profile.

Abstract: An electronic device includes a transparent element, an optical component and an anti-reflecting layer. The transparent element is configured to separate an inner side and an outer side of the electronic device, so that a light passes through the transparent element to enter or leave the electronic device, and the transparent element includes an inner side surface and an outer side surface. The inner side surface faces towards the inner side, and the outer side surface faces towards the outer side. The optical component is corresponding to the inner side surface of the transparent element. The anti-reflecting layer is disposed on at least one portion of the inner side surface of the transparent element.

Abstract: An electronic device includes a temporary memory, a non-volatile memory and a processor. The temporary memory includes at least one secure region. The non-volatile memory is configured to store at least one higher-level secure program and a plurality of commands. The processor is connected to the temporary memory and the non-volatile memory for executing the plurality of commands to: when receiving a wake-up command, initialize the at least one secure region; and through the at least one higher-level secure program, recover the at least one secure region, or decrypt encrypted data stored in the non-volatile memory to recover the at least one secure region. In addition, a hibernation recovery method is also disclosed herein.

Abstract: In a method of manufacturing a semiconductor device, a fin structure protruding from an isolation insulating layer disposed over a substrate is formed, a sacrificial gate dielectric layer is formed over the fin structure, a polysilicon layer is formed over the sacrificial gate dielectric layer, a mask pattern is formed over the polysilicon layer, and the polysilicon layer is patterned into a sacrificial gate electrode using the mask pattern as an etching mask. The sacrificial gate electrode has a narrow portion above a level of a top of the fin structure such that a width of the sacrificial gate electrode decreases, takes a local minimum, and then increases from the top of the fin structure.

Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing pad located on a top surface of a platen configured to rotate around a vertical axis passing through the platen, a wafer carrier configured to hold a substrate and facing the polishing pad, and an integrated slurry mixer-dispenser including at least two inlet ports configured to receive a respective slurry component, configured to generate slurry by mixing at least two slurry components provided through the at least two inlet ports, and including a dispensation port configured to dispense the slurry over the polishing pad.

Abstract: In a method of manufacturing a semiconductor device, a fin structure protruding from an isolation insulating layer disposed over a substrate is formed, a sacrificial gate dielectric layer is formed over the fin structure, a polysilicon layer is formed over the sacrificial gate dielectric layer, a mask pattern is formed over the polysilicon layer, and the polysilicon layer is patterned into a sacrificial gate electrode using the mask pattern as an etching mask. The sacrificial gate electrode has a narrow portion above a level of a top of the fin structure such that a width of the sacrificial gate electrode decreases, takes a local minimum, and then increases from the top of the fin structure.

Abstract: A pipe joint device includes a nut defining a threaded hole and including an inward flange that defines a through hole and that has a shoulder surface facing the threaded hole, a tube body having inner and outer end portions, and a stopper detachably sleeved on the tube body. The inner end portion extends through the through hole, has an inner end surface and an outer peripheral surface connected to the inner end surface and formed with an external thread. The stopper has opposite first and second abutment surfaces and an inner surface formed with an internal thread threadedly engaging the external thread. The inner end portion further extends through the stopper, such that the second abutment surface faces and abuts against the annular shoulder and the first abutment surface is disposed not farther away from the outer end portion than the inner end surface.

Abstract: A method includes providing medical images of a subject for selecting a target image from thereamong, building a 3D image model based on the medical images and the target image with a surgical target site assigned, performing image registration to superimpose the 3D image model on a real-time image of the subject so as to result in a combined image, determining a virtual entry site located on the combined image, connecting the surgical target site and the virtual entry site with a straight line, generating a guiding path extending from the virtual entry site, in a direction away from the surgical target site and along the straight line, and displaying the guiding path for guiding a surgical instrument.

Abstract: The AHU includes an air dehumidifying (AD) flow path, an air regeneration (AR) flow path, a first desiccant wheel and a second desiccant wheel each in the AD flow path and the AR flow path, a first cooler heat exchanger in the AD flow path, a second cooler in the AD flow path, and a heater disposed in the AR flow path. An HVACR system includes the AHU and a chiller configured to supply chiller liquid to the first cooler heat exchanger and the second cooler heat exchanger in the AHU. A method of conditioning air in an HVACR system includes directing air through the air dehumidifying (AD) flow path and directing air through an air regeneration (AR) flow path to regenerate the desiccant in a first desiccant wheel and the desiccant in a second desiccant wheel.

Abstract: An ultrasonic welding device includes a first component and a second component. The first component includes at least one first welding feature and at least one second welding feature which are arranged along a horizontal direction, and the first and second welding features have different sizes in a vertical direction. The second component has at least one welding structure which is configured to be in contact with the first and second welding features, so as to weld the first and second components.

Abstract: Disclosed are techniques for elevator control. In an aspect, a sensor senses time series data, wherein the time series data includes at least one image, and range of the image covers a plurality of buttons. A system module configured to determine whether the image contains a target object; determine a tip coordinate of a tip of the target object when the image contains the target object, wherein the tip refers to a point of the target object with the closest distance to the operation panel; and determine button information corresponding to the tip coordinate among a plurality of button information, and transmit a control signal at least according to the button information, wherein the plurality of button information is associated with the plurality of buttons. A controller receives the control signal and perform control operation according to the control signal.

Abstract: An electrical device includes a container, a conversion unit, an outer cover and an inner cover. The container is provided with an inner bottom surface and an inner which define an accommodating channel together. An inlet of the accommodating channel is opposite to the inner bottom surface. The conversion unit is disposed within the accommodating channel. The outer cover covers the inlet of the accommodating channel. The inner cover is disposed within the accommodating channel, and located between the conversion unit and the outer cover. One part of the conversion unit extends to the opening, and at least one outer edge of the inner cover is connected to an inner wall of the container.

Abstract: A dual-pulse excitation method for ultra-fast, super-resolution all-optical magnetic recording includes the steps of: providing a first excitation pulse and a second modulation pulse; and focusing the first excitation pulse and the second modulation pulse, and then radiating the two pulses in sequence to a magneto-optical recording medium, so that an area of the magneto-optical recording medium irradiated undergoes opto-magnetic reversal. By controlling the time delay, spatial overlapping area, and energy density ratio between the dual femtosecond laser pulses, it can induce a second reversal of the magnetization field in the spatial overlapping area of the two pulses on the magneto-optical material that can achieve single-pulse opto-magnetic reversal to obtain all-optical magnetic recording beyond the diffraction limit. This process takes place within several hundred picoseconds, thus providing an effective technical means for ultra-high density and ultra-fast magnetic storage.

Abstract: An imaging lens module includes an optical element holder being one-piece formed, a lens element and a light folding component corresponding to the lens element. Each of two side surfaces of the optical element holder has a light through hole, and light passes through the optical element holder via the light through holes. The optical element holder includes a lens element accommodation portion and a folding component accommodation portion respectively for the lens element and the light folding component to be disposed therein. The light folding component includes a light receive surface, a first reflection surface and a light exit surface. The light enters the light folding component from the light receive surface, the first reflection surface is configured to reflect the light coming from the light receive surface so as to redirect the light, and the light exits the light folding component from the light exit surface.

Abstract: An illumination system including an excitation light source, a wavelength converting element, and a region-based light splitter is provided. The excitation light source provides an excitation beam. The wavelength converting element is disposed on a transmission path of the excitation beam to convert the excitation beam into an excited beam. The region-based light splitter is disposed on the transmission path of the excitation beam and includes at least one first region and at least one second region. The first region reflects the excitation beam and allows the excited beam to pass through. The second region allows the excitation beam and the excited beam to pass through. The excitation beam reflected by the region-based light splitter is transmitted toward the wavelength converting element. A projection apparatus including the illumination system is also provided.

Abstract: Some embodiments provide a process of tunning sidewall profiles of gate openings prior to filling a replacement gate electrode layer therein to improve etching rate uniformity and stability during a subsequent gate electrode etch back process. Particularly, the profile sacrificial gate electrode is adjusted to be more straight profile rather than a bowl type profile, which reduces the seam void created in the replacement gate electrode during the replacement gate process. In some embodiments, tuning the profile of gate opening further includes performing a pullback etching process of the sidewall spacers prior to depositing gate dielectric layer and work function metal layer to achieve a wider opening for metal gate filling in the replacement gate process.

Abstract: A distance sensing module includes a first substrate, an upper cover, a light-emitting unit, and at least one sensing pixel. The upper cover is disposed on the first substrate to form an accommodating space. The light-emitting unit is disposed at an emitting end in the accommodating space. The sensing pixel is disposed at a receiving end in the accommodating space and includes a second substrate disposed in the accommodating space and having a top surface, sensing areas disposed in the second substrate and exposed on the top surface, a light guide layer including light guide structures having first sides connected to a light transmission layer and second sides coupled to the sensing areas, a lens layer including at least one lens, and the light transmission layer between the light guide layer and the lens layer. The light guide layer is between the second substrate and the light transmission layer.

Abstract: This document describes techniques and apparatuses directed at antenna designs with structurally integrated composite antenna components. In aspects, an electronic device includes a mechanical frame having housing components configured to house electronic components. The electronic device further includes a composite antenna having at least one set of co-located antenna patches forming two resonance frequencies. The set of antenna patches includes an upper patch and a lower patch. The upper patch is formed integral to a housing component and operably connected to a feedline and an electrical ground. The lower patch is implemented in a flexible printed circuit board positioned proximately beneath the upper patch and operably connected to the upper patch through the feedline, as well as the electrical ground.

Abstract: A polyurethane adhesive and a mixture used for manufacturing a plastic athletic track are provided. The polyurethane adhesive includes a urethane pre-polymer which is formed by a reaction between an isocyanate and a polyol. The polyol is selected from the group consisting of polyether polyol and polybutadiene polyol, and a number average molecular weight of the polyol is between 1,000 g/mole and 6,000 g/mole. Based on the total weight of the polyurethane adhesive, a content of the urethane pre-polymer is between 80 wt % and 99.5 wt %, and a viscosity of the polyurethane adhesive is between 1,000 cps and 3,000 cps under an environmental temperature of between 15° C. and 40° C.

Abstract: A laser processing method and a laser processing system are provided. The laser processing method includes: irradiating a processing area of a workpiece with an electromagnetic wave; and after irradiating the processing area of the workpiece with the electromagnetic wave, irradiating the processing area of the workpiece with a processing pulse.