Abstract: The laminated A tandem solar cell includes a bottom cell and a top cell located on the bottom cell, wherein the bottom cell includes a first doping portion and a second doping portion, the first doping portion and the second doping portion form at least one PN junction, majority carriers in the first doping portion are a first type of carrier, and majority carriers in the second doping portion are a second type of carrier; the bottom cell is provided with a first electrode hole and a second electrode hole which penetrate the bottom cell, a first electrode is formed in the first electrode hole, and a second electrode is formed in the second electrode hole; the first electrode is in contact with the first doping portion; and the second electrode is in contact with the second doping portion.

Abstract: A data transmission method and apparatus are described. The method includes a receive end receiving a first parameter, where the first parameter includes a parameter of a probability distribution of a hidden variable. The hidden variable is obtained by encoding first data by using an encoder of a variational auto-encoder. The receive end determines the probability distribution based on the first parameter, and samples the probability distribution M times to obtain M pieces of sampled data, where M is a positive integer. The receive end reconstructs the first data based on the M pieces of sampled data. According to the described data transmission method and apparatus, the first parameter is transmitted, so that the receive end can support a plurality of times of sampling, thereby reducing an amount of data transmitted over an air interface, and reducing data transmission overhead.

Abstract: A data transmission method includes obtaining a data stream. The data stream includes a plurality of bit groups. The method also includes modulating the data stream into a modulated symbol stream according to a modulation rule, and generating a modulated signal based on the modulated symbol stream. The modulated symbol stream includes a plurality of modulated symbol. The modulation rule includes determining, in a symbol period of one modulated symbol based on a value of a first bit group, a zero time point corresponding to the first bit group. The zero time point is a zero crossing point of the modulated signal in the symbol period. The first bit group includes at least one bit. The first bit group is one of the plurality of bit groups. The method further includes sending the modulated signal.

Abstract: A display device includes: a display panel; a housing configured to support and protect the display panel; a bracket disposed between the display panel and the housing; a plurality of sensors fixed on the bracket; a window located in the display panel or in the housing, and configured to expose at least one of the plurality of sensors; and a driver configured to control the bracket to rotate in a plane parallel to the display panel, and to control the bracket to stop rotating when a required sensor rotates to a position of the window.

Abstract: Embodiments of this application disclose a neural network-based communication method and a related apparatus. Specifically, joint training optimization is performed on an encoding neural network used by a transmit end and a decoding neural network used by a receive end. A first neural network in the encoding neural network reuses the decoding neural network and a parameter of the decoding neural network.

Abstract: A pixel structure, an image sensor, an electronic device and a method for controlling an image sensor are provided.

Abstract: A data model training method and apparatus are provided. The method includes receiving data subsets from a plurality of subnodes and performing data convergence based on the plurality of data subsets to obtain a first data set. A first data model and at least one of the first data set or a subset of the first data set are sent to a first subnode, where an artificial intelligence (AI) algorithm is configured for the first subnode. A second data model is received from the first subnode, where the second data model is obtained by training the first data model based on the first data set or the subset of the first data set. The first data model is updated based on the second data model to obtain a target data model, the target data model is sent to the plurality of subnodes.

Abstract: The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes an interposer, chips, and warpage adjustment structures, wherein the interposer includes a first surface and a second surface opposite thereto, and the chips are electrically connected to the first surface of the interposer; the warpage adjustment structures are symmetrically distributed with respect to a center of the first surface; and each of the warpage adjustment structures include a warpage adjustment piece and/or a cavity filled with a plastic packaging material, the warpage adjustment piece is disposed on the first surface, and the cavity is located outside conducting structures and sinks inward along the first surface. By cooperation between the warpage adjustment pieces and the cavities filled with the plastic packaging material, the warpage of the interposer in horizontal and vertical directions can be reduced.

Abstract: The present application provides a pixel structure, an image sensor, a device, an image processing method and a control method.

Abstract: A display substrate is provided. The display substrate includes a base substrate including a display region and a peripheral region, and a first scan driving circuit, a second scan driving circuit and a first power line arranged in sequence, and a first shielding layer and a second shielding layer sequentially arranged on a side of the second scan driving circuit away from the base substrate; the first shielding layer covers at least one transistor in the second scan driving circuit, and the second shielding layer covers at least one transistor of transistors in the second scan driving circuit except the at least one transistor covered by the first shielding layer; and the second shielding layer is also on a side of the first scan driving circuit away from the base substrate, and the second shielding layer covers at least one transistor in the first scan driving circuit.

Abstract: A transmitter for inductive charging of a device comprising a receiver is provided. The transmitter includes a set of coils, including a first coil having a first turn and a second turn. The first turn and the second turn are adjacent. The first turn has the first sense and the second turn has the second sense, opposed to the first sense; whereby, in use, current flows through the first turn and the second turn in opposed senses.

Abstract: A back-contacting solar cell includes: a silicon substrate (1), wherein a shadow face of the silicon substrate (1) is delimited into a first region and a second region (2), and the second region (2) is doped to form a second-charge-carrier collecting end; a metal-chalcogen-compound layer (4), wherein the metal-chalcogen-compound layer (4) is deposited within at least the first region of the silicon substrate (1), and a region of the metal-chalcogen-compound layer (4) that corresponds to the first region forms a first-charge-carrier collecting end; a first electrode (5), wherein the first electrode (5) is correspondingly provided on the first-charge-carrier collecting end; and a second electrode (6), wherein the second electrode (6) is correspondingly provided within a region that corresponds to the second region (2). The collection and transferring of the first charge carrier are realized by using the first-charge-carrier collecting end.

Abstract: A shift register unit, a circuit structure, a gate drive circuit, a drive circuit and a display device are provided. A shift register unit includes a substrate and an input circuit, a reset circuit, a first output circuit, a first output terminal, a first connection conductive portion connecting both the input circuit and the reset circuit, a second connection conductive portion connecting both the reset circuit and the first output circuit, and a third connection conductive portion connecting both the first output circuit and the first output terminal, all of which are on the substrate.

Abstract: A tandem cell is provided in the present disclosure, which relates to the technical field of photovoltaics, so as to form a functional layer with high film ordering on a bottom cell, thereby improving photoelectric conversion efficiency of the tandem cell. The tandem cell includes: a bottom cell with a textured surface; a hole transport layer formed on the textured surface of the bottom cell; a second ordered induction layer and a perovskite absorption layer formed on the hole transport layer, the second ordered induction layer being located between the hole transport layer and the perovskite absorption layer; and a transparent conductive layer formed on the perovskite absorption layer. An inducing material contained in the second ordered induction layer is organic ammonium salt or inorganic lead compound. The tandem cell according to the present disclosure is a tandem cell with a perovskite solar cell as a top cell.

Abstract: The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes a lower package and an upper package; wherein the lower package includes a prefabricated interconnected silicon core stack structure which includes a silicon interconnection layer, and the silicon interconnection layer includes a first surface and a second surface; a back-end redistribution stack layer and a first prefabricated redistribution stack layer are stacked on the first surface and in electrical connection; a passivation layer is disposed on the second surface; the silicon interconnection layer includes a silicon substrate and several first prefabricated conductive pillars, each first prefabricated conductive pillar includes a first end and a second end, the first end is exposed from the first surface, and the second end is exposed from a side of the passivation layer; and the upper package is disposed above the first prefabricated redistribution stack layer.

Abstract: The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes a lower package, an upper package and a first redistribution stack layer disposed between the lower package and the upper package, wherein the first redistribution stack layer is electrically connected to the lower package and the upper package; the lower package includes a prefabricated substrate and a first plastic packaging layer surrounding the periphery of the prefabricated substrate; and the minimum line width/line spacing of the first redistribution stack layer is less than the minimum line width/line spacing of the prefabricated substrate. The lower package includes the prefabricated substrate and the first redistribution stack layer is disposed above the prefabricated substrate and has the minimum line width/line spacing less than that of the prefabricated substrate, so that more chips and/or device packages are integrated in the packaging structure.

Abstract: The present invention provides a packaging structure and a manufacturing method thereof. The packaging structure includes: a lower package, an upper package disposed above the lower package, and a first redistribution stack layer that is disposed between the lower package and the upper package and is electrically connected to the lower package and the upper package. The lower package includes a first prefabricated redistribution stack layer and a first plastic packaging layer surrounding the first prefabricated redistribution stack layer. A minimum line width and line spacing of at least one first prefabricated conductive layer in the first prefabricated redistribution stack layer is less than a minimum line width and line spacing of at least one first conductive layer in the first redistribution stack layer.

Abstract: The present invention relates to a magnetic recording medium including a substrate; an underlayer laminated upon the substrate; and a magnetic layer laminated upon the underlayer, wherein the underlayer includes a first underlayer containing a compound represented by a following general formula: MgO(1-X), where X is within a range of 0.07 to 0.25, the magnetic layer includes a first magnetic layer containing an alloy having a L10 structure, and the alloy having the L10 structure includes B, and the first underlayer is in contact with the first magnetic layer.

Abstract: A display panel is provided. The display panel has a display region and a peripheral region, the peripheral region includes a first peripheral region, a bending region, and a second peripheral region. The display panel includes a base substrate, a driving circuit layer, an organic structure, and an encapsulation layer; the organic structure includes a first organic structure and a second organic structure, the first organic structure is in the first peripheral region, and the second organic structure includes a first portion in the first peripheral region and a second portion in the bending region; the encapsulation layer partially overlaps with the second organic structure, a portion of the encapsulation layer which overlaps with the second organic structure includes a first encapsulation portion and a second encapsulation portion; an average thickness of the first encapsulation portion is greater than an average thickness of the second encapsulation portion.

Abstract: A display panel and a display device are provided, since a plurality of source ICs (01) are arranged, a large-sized display panel is driven, and since the plurality of source ICs (01) are scattered around a display area (A) along the tangential directions of the edge of the display area (A), that is, the source ICs (01) are distributed according to the shape of the display panel, a distance between the source ICs (01) and the display area (A) is shortened, and thus a narrow bezel design of the display panel is facilitated.