Abstract: The present disclosure provides a method for lithography patterning in accordance with some embodiments. The method includes forming a material layer on a substrate; forming a blocking layer on the material layer, wherein a bottom portion of the blocking layer reacts with the material layer, resulting in a capping layer that seals the material layer from an upper portion of the blocking layer. The method further includes forming a photoresist layer on the blocking layer; exposing the photoresist layer; and developing the photoresist layer, resulting in a patterned photoresist layer.

Abstract: An OLED touch display device includes an OLED display and a laminated package component. The laminated package component covers the OLED display and includes a quarter-wave plate, a liquid crystal polarizer and a touch sensor unit. The touch sensor unit is a single-layer electrode structure.

Abstract: A coating technique and a priming material are provided. In an exemplary embodiment, the coating technique includes receiving a substrate and identifying a material of the substrate upon which a layer is to be formed. A priming material is dispensed on the material of the substrate, and a film-forming material is applied to the priming material. The priming material includes a molecule containing a first group based on an attribute of the substrate material and a second group based on an attribute of the film-forming material. Suitable attributes of the substrate material and the film-forming material include water affinity and degree of polarity and the first and second groups may be selected to have a water affinity or degree of polarity that corresponds to that of the substrate material and the film-forming material, respectively.

Abstract: The present disclosure provides a method for lithography patterning in accordance with some embodiments. The method includes forming a material layer over a substrate, wherein the material layer is soluble in a solvent; forming a blocking layer on the material layer; and forming a photoresist layer on the blocking layer, wherein the photoresist layer includes a photosensitive material dissolved in the solvent. The method further includes exposing the photoresist layer; and developing the photoresist layer in a developer.

Abstract: The present disclosure relates to a touch circuit pattern and a manufacturing method thereof. A capacitive touch circuit pattern in the present disclosure comprises a substrate, wherein at least two adjacent transparent first-axis electrode blocks, a transparent first-axis conductive wire, and at least two adjacent transparent second-axis electrode blocks are formed on the substrate. The first-axis conductive wire is formed between the two adjacent first-axis electrode blocks to connect the two adjacent first-axis electrode blocks and the two adjacent second-axis electrode blocks, respectively, at two sides of the first-axis conductive wire. The capacitive touch circuit pattern further comprises of a metal second-axis conductive wire, which stretches across the first-axis conductive wire and connects the two adjacent second-axis electrode blocks.

Abstract: A touch module and a manufacturing method thereof are disclosed. The touch module includes a substrate, at least one bridge, an active layer, at least two first touch electrodes, at least two second touch electrodes, and at least one electrode channel. The bridge is disposed on the substrate. The active layer overlays the bridge and the substrate. The first touch electrodes are embedded in the active layer and electrically touch the bridge, so that the first touch electrodes are electrically connected to each other via the bridge. The electrode channel is embedded in the active layer, and is configured to allow the second touch electrodes to be electrically connected to each other. The first touch electrodes are electrically isolated from the second touch electrodes.

Abstract: A touch panel includes a substrate, a touch sensing electrode, a peripheral conductive trace, a protective layer, and a conductive layer. The substrate has a display area and a peripheral area. The touch sensing electrode is disposed in the display area. The peripheral conductive trace is disposed in the peripheral area. The touch sensing electrode is electrically connected to the peripheral conductive trace. The touch sensing electrode and the peripheral conductive trace at least include metal nanowires. The protective layer is disposed on the touch sensing electrode, and the conductive layer is disposed on the peripheral conductive trace.

Abstract: Present invention discloses a touch panel and a manufacturing method thereof, the touch panel comprises: a substrate; a silver nano-wire electrode layer provided on the substrate comprising a connecting area and a non-connecting area; a first protective layer provided on silver nano-wire electrode layer having a first hole corresponding to connecting area; a second protective layer provided on first protective layer having a second hole corresponding to position of first hole; and a connecting wire provided on second protective layer connected to silver nano-wire electrode layer in connecting area through second hole and first hole. With the touch panel, the problem that etching solution can't seep when a single protective layer is too thick and the problem that a silver nano-wire layer is easily oxidized and the adhesion of the silver nano-wire layer is poor when a single protective layer is too thin can be avoided.

Abstract: Methods and materials for making a semiconductor device are described. The method includes forming a surface preparation layer over the semiconductor substrate. The surface preparation material layer includes an aziridine structure. A coating layer may then be deposited on the surface preparation material layer.

Abstract: The present invention relates to a touch sensitive display, which includes an upper substrate with a mask layer placed thereon, a touch sensing layer, a lower substrate, and an organic light-emitting assembly. The touch sensing layer is disposed below the upper substrate, and the lower substrate is disposed by facing with the upper substrate. The organic light-emitting assembly is disposed above the lower substrate with facing to the touch sensing layer. Furthermore, a method for manufacturing the touch sensitive display is provided.

Abstract: The present disclosure provides a method for lithography patterning in accordance with some embodiments. The method includes forming a resist layer over a substrate and performing an exposing process to the resist layer. The resist layer includes a polymer backbone, an acid labile group (ALG) bonded to the polymer backbone, a sensitizer bonded to the polymer backbone, a photo-acid generator (PAG), and a thermo-base generator (TBG). The method further includes baking the resist layer at a first temperature and subsequently at a second temperature. The second temperature is higher than the first temperature. The method further includes developing the resist layer in a developer, thereby forming a patterned resist layer.

Abstract: The present disclosure provides NTD developers and corresponding lithography techniques that can overcome resolution, line edge roughness (LER), and sensitivity (RLS) tradeoff barriers particular to extreme ultraviolet (EUV) technologies, thereby achieving high patterning fidelity for advanced technology nodes. An exemplary lithography method includes forming a negative tone resist layer over a workpiece; exposing the negative tone resist layer to EUV radiation; and removing an unexposed portion of the negative tone resist layer in a negative tone developer, thereby forming a patterned negative tone resist layer. The negative tone developer includes an organic solvent having a log P value greater than 1.82. The organic solvent is an ester acetate derivative represented by R1COOR2. R1 and R2 are hydrocarbon chains having four or less carbon atoms. In some implementations, R1, R2, or both R1 and R2 are propyl functional groups, such as n-propyl, isopropyl, or 2-methylpropyl.

Abstract: The present disclosure provides a method for lithography patterning in accordance with some embodiments. The method includes forming a material layer over a substrate, wherein the material layer is soluble in a solvent; forming a blocking layer on the material layer; and forming a photoresist layer on the blocking layer, wherein the photoresist layer includes a photosensitive material dissolved in the solvent. The method further includes exposing the photoresist layer; and developing the photoresist layer in a developer.

Abstract: A lithography method is provided in accordance with some embodiments. The lithography method includes forming an under layer on a substrate; forming a silicon-containing middle layer on the under layer, wherein the silicon-containing middle layer has a thermal base generator (TBG) composite; forming a photosensitive layer on the silicon-containing middle layer; performing an exposing process to the photosensitive layer; and developing the photosensitive layer, thereby forming a patterned photosensitive layer.

Abstract: Provided is a material composition and method for that includes forming a silicon-based resin over a substrate. In various embodiments, the silicon-based resin includes a nitrobenzyl functional group. In some embodiments, a baking process is performed to cross-link the silicon-based resin. Thereafter, the cross-linked silicon-based resin is patterned and an underlying layer is etched using the patterned cross-linked silicon-based resin as an etch mask. In various examples, the cross-linked silicon-based resin is exposed to a radiation source, thereby de-cross-linking the silicon-based resin. In some embodiments, the de-cross-linked silicon-based resin is removed using an organic solution.

Abstract: Under layer composition and methods of manufacturing semiconductor devices are disclosed. The method of manufacturing semiconductor device includes the following steps. A layer of an under layer composition is formed, wherein the under layer composition includes a polymeric material and a cross-linker, and the cross-linker includes at least one decomposable functional group. A curing process is performed on the layer of the under layer composition to form an under layer, wherein the cross-linker is crosslinked with the polymeric material to form a crosslinked polymeric material having the at least one decomposable functional group. A patterned photoresist layer is formed over the under layer. An etching process is performed to transfer a pattern of the patterned photoresist layer to the under layer. The under layer is removed by decomposing the decomposable functional group.

Abstract: An OLED display device includes a substrate, an active element array, at least one OLED, a light absorption layer or an optical scattering layer, and an encapsulation plate. The active element array and the OLED are disposed over an upper surface of the substrate. The OLED includes a first electrode, a second electrode, and an organic light-emitting layer. The first electrode is disposed on a side adjacent to the active element array, and the second electrode is opposite to the first electrode. Both the first and second electrodes have a high transmittance and a low reflection in a wavelength range of visible light. The organic light-emitting layer is interposed between the first and second electrodes. The light absorption layer or optical scattering layer is disposed between the OLED and the substrate. The encapsulation plate is disposed over the second electrode.

Abstract: Under layer composition and methods of manufacturing semiconductor devices are disclosed. The method of manufacturing semiconductor device includes the following steps. A layer of an under layer composition is formed, wherein the under layer composition includes a polymeric material and a cross-linker, and the cross-linker includes at least one decomposable functional group. A curing process is performed on the layer of the under layer composition to form an under layer, wherein the cross-linker is crosslinked with the polymeric material to form a crosslinked polymeric material having the at least one decomposable functional group. A patterned photoresist layer is formed over the under layer. An etching process is performed to transfer a pattern of the patterned photoresist layer to the under layer. The under layer is removed by decomposing the decomposable functional group.

Abstract: A touch panel stackup comprises a substrate, a first conductive element having a first refractive index and forming a plurality of patterns with on or more gaps on the substrate having an address for sensing tactile signals in a first direction and a second direction, a second conductive element having a second refractive index coupled with said plurality of patterns an insulator disposed among said one or more gaps, the second refractive index being substantially the same as said first refractive index.

Abstract: Nucleic acid analogue-guided chemical nuclease systems, methods and compositions, which can manipulate the genome DNA sequence in a sequence-specific manner. The core components that together make up the architecture of the system are: nucleic acid analogues (e.g. Peptide nucleic acids) and bleomycin or its derivatives. Generally speaking, these components are structured such that nucleic acid analogues which recognize specific DNA sequences are conjugated ( covalently) to bleomycin or its derivatives which can cleave the target DNA. This architecture allows the method to sequence-specifically insert or remove DNA sequence from the target DNAs.