Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, a nonconductive support element, and an accessory element. The feeding radiation element has a feeding point. The first radiation element includes a branch portion and a widening portion. The feeding radiation element is coupled through the first radiation element to a ground voltage. The second radiation element is coupled to the feeding radiation element and the first radiation element. The nonconductive support element carries the feeding radiation element, the first radiation element, and the second radiation element. The accessory element includes a nonconductive housing and an internal metal element. The branch portion and widening portion of the first radiation element are disposed on the nonconductive housing of the accessory element.

Abstract: An antenna structure includes a feeding radiation element, a first radiation element, a second radiation element, a nonconductive support element, and an accessory element. The feeding radiation element has a feeding point. The first radiation element includes a branch portion and a widening portion. The feeding radiation element is coupled through the first radiation element to a ground voltage. The second radiation element is coupled to the feeding radiation element and the first radiation element. The nonconductive support element carries the feeding radiation element, the first radiation element, and the second radiation element. The accessory element includes a nonconductive housing and an internal metal element. The branch portion and widening portion of the first radiation element are disposed on the nonconductive housing of the accessory element.

Abstract: In various examples, surface profile estimation and bump detection may be performed based on a three-dimensional (3D) point cloud. The 3D point cloud may be filtered in view of a portion of an environment including drivable free-space, and within a threshold height to factor out other objects or obstacles other than a driving surface and protuberances thereon. The 3D point cloud may be analyzed—e.g., using a sliding window of bounding shapes along a longitudinal or other heading direction—to determine one-dimensional (1D) signal profiles corresponding to heights along the driving surface. The profile itself may be used by a vehicle—e.g.

Abstract: In various examples, a sequential deep neural network (DNN) may be trained using ground truth data generated by correlating (e.g., by cross-sensor fusion) sensor data with image data representative of a sequences of images. In deployment, the sequential DNN may leverage the sensor correlation to compute various predictions using image data alone. The predictions may include velocities, in world space, of objects in fields of view of an ego-vehicle, current and future locations of the objects in image space, and/or a time-to-collision (TTC) between the objects and the ego-vehicle. These predictions may be used as part of a perception system for understanding and reacting to a current physical environment of the ego-vehicle.

Abstract: A liquid crystal lens includes a liquid crystal layer and at least two driving electrode plates. The liquid crystal layer is arranged between the driving electrode plates. Each of the driving electrode plates includes a transparent substrate, a circuit layer, an insulating layer, an electrode layer, at least a conducting pillar and an alignment layer. The transparent substrate has a surface, and the circuit layer is atop the surface. The conducting pillar is arranged in the insulating layer and connected to the electrode layer and the circuit layer. The alignment layer contacts the liquid layer. The electrode layer is interposed between the alignment layer and the insulating layer. The electrode layer in at least one of the driving electrode plates includes at least two ring-shaped electrodes.

Abstract: A number of telephone devices relating to one user establish a communication connection with a server and receive rules for answering and usage information from the server. The server sequence the plurality of other telephone devices for call forwarding according to the rules for answering and usage information, and transfers an incoming call to one then another telephone device according to a sequencing.

Abstract: A liquid crystal lens includes a liquid crystal layer and at least two driving electrode plates. The liquid crystal layer is arranged between the driving electrode plates. Each of the driving electrode plates includes a transparent substrate, a circuit layer, an insulating layer, an electrode layer, at least a conducting pillar and an alignment layer. The transparent substrate has a surface, and the circuit layer is atop the surface. The conducting pillar is arranged in the insulating layer and connected to the electrode layer and the circuit layer. The alignment layer contacts the liquid layer. The electrode layer is interposed between the alignment layer and the insulating layer. The electrode layer in at least one of the driving electrode plates includes at least two ring-shaped electrodes.

Abstract: A liquid crystal panel includes a first substrate, a second substrate, a sealant layer, and a liquid crystal layer. The second substrate is disposed opposite to the first substrate. The sealant layer is disposed between the first substrate and the second substrate for combining the first substrate and the second substrate. A plurality of openings is defined by the first substrate, the second substrate, and the sealant layer. The liquid crystal layer is disposed between the first substrate and the second substrate. The openings are configured to inject a liquid crystal material into space between the first substrate and the second substrate to form the liquid crystal layer by capillarity.

Abstract: A film deposition apparatus is disclosed. The apparatus comprises: a reaction chamber, a susceptor, a heating module, a driving module, and a cooling module. The susceptor is used for bearing at least one wafer; the heating module is used for heating the wafer; the driving module is used for driving the susceptor to rotate. The cooling module is disposed between the heating module and the driving module. The cooling module is configured to make the temperature distribution between the heating module and the driving module discontinuous.

Abstract: A system for forming one or more layers of material on one or more substrates is described. The system includes a vacuum chamber and a showerhead located in the vacuum chamber. A door in a wall of the vacuum chamber allows for loading and unloading of the one or more substrates in the vacuum chamber while under vacuum. A drive mechanism coupled to the showerhead moves the showerhead between a first position and a second position while under vacuum. In the first position, the showerhead is positioned to allow access to the door for loading and unloading of the one or more substrates through the door. In the second position, the showerhead is positioned to inhibit access to the door inside the vacuum chamber.

Abstract: A system for forming one or more layers of material on one or more substrates is disclosed. The system includes a susceptor that rotates around a central susceptor axis. One or more holder gears are located on the susceptor. The holder gears may rotate around the central susceptor axis with the susceptor. A central gear engaged to the holder gears may cause the holder gears to rotate around holder axes of the respective holder gears while the holder gears rotate around the central susceptor axis. The susceptor and the central gear may rotate independently.

Abstract: System and method for forming one or more layers of one or more materials on one or more substrates. The system includes a rotating shell, a susceptor component supported by the rotating shell, and a driving component below the susceptor component and configured to drive the rotating shell and the susceptor component to rotate around a susceptor axis. Additionally, the system includes one or more holder gears located on the susceptor component and configured to rotate around the susceptor axis with the susceptor component and support the one or more substrates, and a central gear engaged to the one or more holder gears and configured to cause the one or more holder gears to rotate around one or more holder axes respectively if the one or more holder gears rotate around the susceptor axis. The susceptor axis is different from the one or more holder axes.

Abstract: A system for forming one or more layers of material on one or more substrates is disclosed. The system includes a susceptor that rotates around a central susceptor axis. One or more holder gears are located on the susceptor. The holder gears may rotate around the central susceptor axis with the susceptor. Teeth of at least two adjacent holder gears at least partially overlap without touching. A central gear engaged to the holder gears may cause the holder gears to rotate around holder axes of the respective holder gears while the holder gears rotate around the central susceptor axis.

Abstract: A gas-exhausting module for a multichamber thin-film deposition apparatus, which has one or more reactor chambers, includes a collecting chamber and a plurality of gas pipes. The collecting chamber includes an upper portion and a lower portion. The cross-sectional area of the lower portion is less than the cross-sectional area of the upper portion. One end of each gas pipe communicates with one of the reactor chambers. The other end of each gas pipe communicates with the upper portion in a tangential direction. During operation, a cyclonic airflow is provided within the collecting chamber to uniformly extract the exhaust gas from each reactor chamber.

Abstract: A wire spool with color identification includes an axial tube, a first flange extending from a first end of the axial tube, and a second flange extending from a second end of the axial tube. The wire spool is characterized in that the first flange has at least one depression coated with a color layer. Thus, the color layer is not easy to peel and the cost of manufacturing the wire spool can be reduced.

Abstract: An image sensing module includes an image sensor chip. The image sensor chip has a first surface and an image sensing area on the first surface, where the image sensing area is utilized for sensing light rays illuminating thereon. The image sensor chip includes a plurality of input/output (I/O) terminals and a plurality of power/ground terminals outside the image sensing area on the first surface, where the I/O terminals are utilized for inputting/outputting signals. The image sensing module further includes a printed circuit board (PCB) having a first surface opposite the first surface of the image sensor chip and having an opening corresponding to the image sensing area, where the image sensing area is aligned within the opening. The image sensing module further includes a light transmissible cover bonded to a second surface of the PCB for covering the opening to protect the image sensing area.

Abstract: A discrete circuit component is made from a substrate with the first and second surfaces thereof each having a corresponding matrix of electrically conductive segments. A plated through-hole connects each of the conductive segments of each the first and second conductive segments electrically. The through-hole is first clogged and then subsequently cleared of clogging in the fabrication stages.

Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.

Abstract: process for fabricating a discrete circuit component on a substrate having fabrication stage clogged through-holes is disclosed. The first surface of the substrate has a matrix of dice surface trace sets each having a first and a second electrically conductive segments. The second surface of the substrate has a corresponding matrix of soldering surface trace sets each having a first and a second electrically conductive segments. A plated through-hole electrically connects each of the first and second conductive segments of each of the dice surface trace sets respectively to the first and second conductive segments of the corresponding soldering surface trace set.

Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.