Abstract: A method for fabricating metal bonding for a semiconductor circuit component employing prescribed feed of metal ball is disclosed. The method comprises the steps of, first, placing a metal ball at the metallization site on the surface of the circuit die of the component; then, melting the metal ball on the site; and subsequently solidifying the molten metal and forming a metal bump at the site. A circuit die having formed with one or more metal bumps can then be made into a circuit component featuring stable and reliable electrical leads and suitable to be utilized as large power rating yet with reduced component size in electronic equipment.

Abstract: The present invention provides a solar photoelectric module having the two-sided light-absorbing characteristic to converse light energy source into electric energy source. The present solar photoelectric module comprises a solar cell module and a backlight module which is arranged at a backlight position of the photoelectric module so as to the present solar photoelectric module can directly absorb the solar light by the solar plate and utilizes the light-condensing effect of a backlight module and the two-sided light-absorbing effect to improve the output efficiency of the light source. The present invention further provides with advantages of high absorbing efficiency, small volume, and saving more space and it can apply to many related solar products.

Abstract: A heat pipe has a tube with an open end and a closed end. Copper powder is sintered onto an inner surface of the tube to form a porous lining. Air is then evacuated to form a substantially vacuum state in the tube from the open end. Working fluid is added into the tube and the open end is sealed afterwards. In operation, heat generated by an electronic component is absorbed by the heat pipe and forms a heated region in the tube. Working fluid in the heated region evaporates and travels to a cool region and condenses. The working fluid is then driven by capillary force to circulate back to the heat region through the porous lining. This thermodynamic cycle continues as the heat is transferred and dissipated throughout the heat pipe in an extremely high efficiency.