Abstract: An imaging lens assembly includes a plastic barrel and a lens set, and the lens set is disposed in the plastic barrel. The plastic barrel includes an object-side outer surface, a first inner surface and a second inner surface. The lens set has an optical axis, and includes, in order from an object side to an image side thereof, at least one plastic lens element and a spacer. A light-absorbing coating is disposed on the plastic lens element. The spacer includes an object-side connecting surface and a relative surface. When the object-side connecting surface is connected with a neighboring object-side optical element, the relative surface is out of touch with the neighboring object-side optical element. There is an overlap between the second inner surface and the relative surface along a direction parallel to the optical axis.

Abstract: The present disclosure provides a voltage-controlled oscillator for a phase-lock loop circuit. The voltage-controlled oscillator is used to receive a control voltage and generate a clock signal, and includes a voltage-to-current device, a process compensation device, a subtraction unit and a clock signal generating module. The voltage-to-current device is used to generate a linear current according to the control voltage. The process compensation device is used to generate a compensation current according to the control voltage. The compensation current is proportional to a transistor operation speed corresponding to a process offset. The subtraction unit is electrically connected to the voltage-to-current device and the process compensation device, and is used to subtract the compensation current from the linear current to generate the control current.

Abstract: Various embodiments of the teachings herein include a simulation model calibration method. For example, a method may include: obtaining prior distributions of at least two model parameters in a to-be-calibrated simulation model; obtaining a constraint condition of the at least two model parameters, wherein the constraint condition is used for indicating an association relationship between the model parameters; and performing at least one round of iteration on the at least two model parameters according to the prior distributions and the constraint condition, to obtain at least one parameter group applicable to the simulation model, wherein the parameter group comprises parameter values corresponding to the model parameters, and at least one model parameter corresponds to different parameter values in different parameter groups.

Abstract: A light-folding element includes an object-side surface, an image-side surface, a reflection surface and a connection surface. The reflection surface is configured to reflect imaging light passing through the object-side surface to the image-side surface. The connection surface is connected to the object-side, image-side and reflection surfaces. The light-folding element has a recessed structure located at the connection surface. The recessed structure is recessed from the connection surface an includes a top end portion, a bottom end portion and a tapered portion located between the top end and bottom end portions. The top end portion is located at an edge of the connection surface. The tapered portion has two tapered edges located on the connection surface. The tapered edges are connected to the top end and bottom end portions. A width of the tapered portion decreases in a direction from the top end portion towards the bottom end portion.

Abstract: Embodiments of this application relate to control parameter optimization technologies. Various embodiments include methods and apparatus for optimizing control parameters. At least one group of initial control parameters within a preset range is randomly generated, to obtain a group of current control parameters; it is determined whether a number of updates has exceeded a preset threshold, referring to a total number of times that the current control parameters have been changed; the group of current control parameters is changed when the number of updates does not reach the preset threshold; and air conditioning control parameters are optimized according to control parameters corresponding to a comprehensive score of a combination when the number of updates reaches the preset threshold.

Abstract: A method for early warning a blind area of a vehicle. In the method, the electronic device obtains at least one target image acquired by at least one camera of the vehicle. The electronic device further determines parameters of at least one target object in each of the at least one target image and a three-dimensional detection frame for each of the at least one target object based on the parameters. The electronic device further obtains a target detection frame of each of the at least one target object in a top view image of a plane where the vehicle is located by projecting the three-dimensional detection frame into the top view image and outputs alert information in response that an overlapped area exists between the target detection frame and a preset blind area of the top view image.

Abstract: A method of identifying characters in images extracts features of a detection image including characters. Enhancement processing is performed on the detection image according to the features to obtain an enhanced image. Closed edges of the characters are detected in the enhanced image. First rectangular outlines of the characters are determined according to the closed edges. The first rectangular outlines are corrected to obtain second rectangular outlines. The characters are cropped from the detection image according to the second rectangular outlines. The method identifies characters in images accurately and rapidly.

Abstract: An imaging lens assembly includes a plastic barrel and a lens set, and the lens set is disposed in the plastic barrel. The plastic barrel includes an object-side outer surface, a first inner surface and a second inner surface. The lens set has an optical axis, and includes, in order from an object side to an image side thereof, at least one plastic lens element and a spacer. A light-absorbing coating is disposed on the plastic lens element. The spacer includes an object-side connecting surface and a relative surface. When the object-side connecting surface is connected with a neighboring object-side optical element, the relative surface is out of touch with the neighboring object-side optical element. There is an overlap between the second inner surface and the relative surface along a direction parallel to the optical axis.

Abstract: A concrete floor hardening agent includes an aluminate, a waterproofing agent, and water. The aluminate is selected from the group consisting of potassium aluminate and sodium aluminate, and is present in an amount ranging from 15 wt % to 65 wt % based on 100 wt % of the concrete floor hardening agent. The waterproofing agent is selected from the group consisting of potassium methyl silicate, sodium methyl silicate, silicone oil, and siloxane, and is present in an amount ranging from 5 wt % to 20 wt % based on 100 wt % of the concrete floor hardening agent.

Abstract: Systems and methods for pattern-based multi-stage deterministic data classification that may reduce processing and memory overhead while providing more accurate data classifications.

Abstract: A method of recognizing target objects in images obtains a detection image of a target object. A template image is generated according to the target object. The detection image is compared with the template image to obtain a comparison result. Candidate regions of the target object are determined in the detection image according to the comparison result. At least one target region of the target object is obtained from the candidate regions. The method detects target objects in images very rapidly.

Abstract: A semiconductor device comprises a metallization layer, a passivation layer disposed above the metallization layer, a copper redistribution layer disposed on the passivation layer, a second passivation layer disposed on the copper redistribution layer, and a polyimide layer disposed over the second passivation layer. The polyimide layer and the second passivation layer include a continuous gap there-through that exposes a portion of the copper redistribution layer.

Abstract: A camera module includes a unitary element, an optical image lens assembly, a fixed member and a driving member. The unitary element has an object-side opening. The optical image lens assembly is disposed in a containing space and has an optical axis. The fixed member is for accommodating the unitary element and includes a base and a cover, and the cover has a through hole and is connected with the base. The driving member is for driving the unitary element to move relative to the fixed member. The unitary element includes a reverse inclined structure including at least two annular concave structures. The at least two annular concave structures are arranged in order from the object-side opening to an image side, wherein a sectional surface of each of the annular concave structures passing through the optical axis includes a valley point and two concave ends.

Abstract: An imaging lens assembly module includes an imaging lens element set, a lens carrier and a light blocking structure. The imaging lens element set has an optical axis. At least one lens element of the lens elements is disposed in the lens carrier. The light blocking structure includes a light blocking opening. The optical axis passes through the light blocking opening, and the light blocking opening includes at least two arc portions and a shrinking portion. Each of the arc portions has a first curvature radius for defining a maximum diameter of the light blocking opening. The shrinking portion is connected to the arc portions for forming the light blocking opening into a non-circular shape. The shrinking portion includes at least one protruding arc which extends and shrinks gradually from the shrinking portion to the optical axis, and the protruding arc has a second curvature radius.

Abstract: A calculation method for an annual average loss of an external substructure reinforcement system based on interfacial shear stresses is provided. The calculation method includes: step 1: establishing a deterministic model for an external substructure reinforcement system, and generating seismic ground motion samples and structural samples by random sampling; establishing a probabilistic hazard model based on the seismic ground motion samples; generating a probabilistic vulnerability model based on interfacial shear stresses; establishing a total probabilistic loss expectation model by different seismic ground motion intensity levels; and using the total probabilistic loss expectation model to obtain an annual average probabilistic seismic loss of the external substructure reinforcement system based on the interfacial shear stresses. The calculation method can realize classified calculations of the seismic loss of the external substructure reinforcement system.

Abstract: A semiconductor device comprises a metallization layer, a passivation layer disposed above the metallization layer, a copper redistribution layer disposed on the passivation layer, a second passivation layer disposed on the copper redistribution layer, and a polyimide layer disposed over the second passivation layer. The polyimide layer and the second passivation layer include a continuous gap there-through that exposes a portion of the copper redistribution layer.

Abstract: An apparatus is provided. The apparatus includes a wafer storage device having an inlet through which a gas flows into a wafer storage chamber of the wafer storage device. A first portion of the gas exits the wafer storage chamber of the wafer storage device through an outlet of the wafer storage device. A second portion of the gas exits the wafer storage chamber of the wafer storage device through one or more discontinuities of the wafer storage device to a space external to the wafer storage device. The apparatus includes an exhaust device arranged relative to the wafer storage device to conduct a measure of the second portion of the gas away from the space.

Abstract: In a method, a wafer is bonded to a first carrier. The wafer includes a semiconductor substrate, and a first plurality of through-vias extending into the semiconductor substrate. The method further includes bonding a plurality of chips over the wafer, with gaps located between the plurality of chips, performing a gap-filling process to form gap-filling regions in the gaps, bonding a second carrier onto the plurality of chips and the gap-filling regions, de-bonding the first carrier from the wafer, and forming electrical connectors electrically connecting to conductive features in the wafer. The electrical connectors are electrically connected to the plurality of chips through the first plurality of through-vias.

Abstract: Disclosed is a method for manufacturing an image sensor module. The method comprises the steps of: disposing a glass cover on a substrate; sawing the glass cover into a plurality of glass units; forming an individual solidified interface filler between the adjacent glass units; sawing along the centerline of each solidified interface filler to form a plurality of independent electronic semi-finished products for complementary metal oxide semiconductor image sensor (CMOS Image Sensor, CIS) packaging; and performing an image sensor molded ball grid array (ImBGA) process to obtain the image sensor module.

Abstract: The present invention provides an image sensor module, including an integrated circuit substrate, an image sensing chip, a cover plate and an encapsulating material. The image sensing chip is disposed on the integrated circuit substrate. The image sensing chip includes an image sensing area and a non-image sensing area. A dam is disposed between the cover plate and the non-image sensing area of the image sensing chip. The cover plate includes a transparent material and a cushioning material. The encapsulating material covers the periphery of the image sensing chip, the periphery of the dam, part of the integrated circuit substrate and the periphery of the cover plate. The cushioning material is disposed between the transparent material and the dam and between the transparent material and the encapsulating material. The present invention reduces the possibility that the encapsulating material will peel off the cover plate.