Abstract: The present teachings provide a medical system for delivering and deploying a medical implant, and the method of using thereof. Specifically, one aspect of the present teachings provides a medical system having an implant with an engagement loop, and a delivery system having an engagement wire and an engagement mechanism. During implant delivery, the engagement wire engages the engagement loop of the implant. The engagement wire further interacts with the engagement mechanism in order to prevent unintended disengagement of the engagement loop from the engagement wire. The present teaching also provide an implant release mechanism that is configured to break away from the implant pusher shaft. Specially, one aspect of the present teaching provides that the implant release mechanism being of one unit with the implant pusher shaft. To release the implant, a clinician simply breaks away the implant release mechanism from the rest of the implant delivery system.

Abstract: Embodiments of this application relate to control parameter optimization technologies. Various embodiments include methods and apparatus for optimizing control parameters. At least one group of initial control parameters within a preset range is randomly generated, to obtain a group of current control parameters; it is determined whether a number of updates has exceeded a preset threshold, referring to a total number of times that the current control parameters have been changed; the group of current control parameters is changed when the number of updates does not reach the preset threshold; and air conditioning control parameters are optimized according to control parameters corresponding to a comprehensive score of a combination when the number of updates reaches the preset threshold.

Abstract: An electronic device including a die and a connection structure electrically connected to the die is disclosed. The connection structure includes a first insulating layer including an opening, a second insulating layer, a first metal element disposed between the first insulating layer and the second insulating layer, a second metal element disposed in the opening and electrically connected to the first metal element, and a conductive element. The second metal element is electrically connected between the conductive element and the first metal element. A first surface and a second surface of the first insulating layer are contacted with the first metal element and the conductive element respectively. The first insulating layer includes first filling elements, the second insulating layer includes second filling elements, and in a cross-sectional view, a second maximum size of the second filling elements is greater than a first maximum size of the first filling elements.

Abstract: A method for manufacturing a semiconductor structure is provided. The method includes the operations as follows. A first opening is formed at a surface of a semiconductor substrate to expose a portion of an isolation region embedded in the semiconductor substrate. A buffer layer is formed over the surface of the semiconductor substrate and lining the first opening. A second opening is formed at a bottom of the first opening. A barrier layer is formed over the surface of the semiconductor substrate. A conductive pad is formed in the first and the second openings. The barrier layer includes an upper portion in contact with the buffer layer in the first opening and a lower portion lining the second opening. The lower portion of the barrier layer is free from surrounded by the buffer layer. A method for manufacturing a BSI image sensor is also provided.

Abstract: A semiconductor structure includes a substrate and a word line. The substrate includes active regions and non-active regions that are alternately disposed in the first direction and extend in the second direction. The word line across the active regions and the non-active regions. The word line includes first conductive portions corresponding to the active regions, isolation pillars corresponding to the non-active regions, an inter-gate dielectric layer disposed on the first conductive portions and the isolation pillars, and a second conductive portion disposed on the inter-gate dielectric layer and extends in the first direction. The first conductive portions and the isolation pillars are disposed alternately in the first direction. Protruding parts of the second conductive portion correspond to the non-active regions, and the isolation pillars are on opposite sides of the corresponding protruding parts in a cross-section of the non-active region along the second direction.

Abstract: A fingerprint recognition module is disclosed, and including: a base substrate; a driving circuit layer disposed on a side of the base substrate, and including a plurality of driving transistors arranged in an array; a first insulating layer disposed on a side of the driving circuit layer facing away from the base substrate, and including a plurality of first via holes running through the first insulating layer in a thickness direction of the first insulating layer; a plurality of photoelectric converters disposed on a side of the first insulating layer facing away from the driving circuit layer, and in contact with first electrodes of the plurality of driving transistors through the plurality of first via holes in one-to-one correspondence; a second insulating layer disposed on a side of the first insulating layer facing away from the base substrate.

Abstract: A minimum IC operating voltage searching method includes acquiring a corner type of an IC, acquiring ring oscillator data of the IC, generating a first prediction voltage according to the corner type and the ring oscillator data by using a training model, generating a second prediction voltage according to the ring oscillator data by using a non-linear regression approach under an N-ordered polynomial, and generating a predicted minimum IC operating voltage according to the first prediction voltage and the second prediction voltage. N is a positive integer.

Abstract: A method for early warning a blind area of a vehicle. In the method, the electronic device obtains at least one target image acquired by at least one camera of the vehicle. The electronic device further determines parameters of at least one target object in each of the at least one target image and a three-dimensional detection frame for each of the at least one target object based on the parameters. The electronic device further obtains a target detection frame of each of the at least one target object in a top view image of a plane where the vehicle is located by projecting the three-dimensional detection frame into the top view image and outputs alert information in response that an overlapped area exists between the target detection frame and a preset blind area of the top view image.

Abstract: A display device, characterized in that the display device includes a first panel, having a first side and a first light shielding layer at a periphery of the first panel, wherein the first light shielding layer has a first edge departing away from the first side; and a second panel, disposed on the first panel, and having a second side adjacent to the first side; wherein the second panel includes a second light shielding layer at a periphery of the second panel; and the second light shielding layer has a second edge departing away from the second side. Wherein a first width is measured from the first side to the first edge along a direction, a second width is measured from the second side to the second edge along the direction, the second width is greater than the first width, and the direction is vertical to the first side.

Abstract: Impurities in a liquefied solid fuel utilized in a droplet generator of an extreme ultraviolet photolithography system are removed from vessels containing the liquefied solid fuel. Removal of the impurities increases the stability and predictability of droplet formation which positively impacts wafer yield and droplet generator lifetime.

Abstract: An electronic device is provided. The electronic device includes a substrate structure, a control unit, a first circuit structure, and an electronic unit. The substrate structure has a conductive via pattern and a dummy via pattern. The control unit is electrically connected to the conductive via pattern. The first circuit structure is electrically connected to the conductive via pattern. The electronic unit is electrically connected to the control unit through the first circuit structure. The dummy via pattern is electrically insulated from the first circuit structure.

Abstract: A method of identifying characters in images extracts features of a detection image including characters. Enhancement processing is performed on the detection image according to the features to obtain an enhanced image. Closed edges of the characters are detected in the enhanced image. First rectangular outlines of the characters are determined according to the closed edges. The first rectangular outlines are corrected to obtain second rectangular outlines. The characters are cropped from the detection image according to the second rectangular outlines. The method identifies characters in images accurately and rapidly.

Abstract: A titanium precursor is used to selectively form a titanium silicide (TiSix) layer in a semiconductor device. A plasma-based deposition operation is performed in which the titanium precursor is provided into an opening, and a reactant gas and a plasma are used to cause silicon to diffuse to a top surface of a transistor structure. The diffusion of silicon results in the formation of a silicon-rich surface of the transistor structure, which increases the selectivity of the titanium silicide formation relative to other materials of the semiconductor device. The titanium precursor reacts with the silicon-rich surface to form the titanium silicide layer. The selective titanium silicide layer formation results in the formation of a titanium silicon nitride (TiSixNy) on the sidewalls in the opening, which enables a conductive structure such as a metal source/drain contact to be formed in the opening without the addition of another barrier layer.

Abstract: An imaging lens assembly includes a plastic barrel and a lens set, and the lens set is disposed in the plastic barrel. The plastic barrel includes an object-side outer surface, a first inner surface and a second inner surface. The lens set has an optical axis, and includes, in order from an object side to an image side thereof, at least one plastic lens element and a spacer. A light-absorbing coating is disposed on the plastic lens element. The spacer includes an object-side connecting surface and a relative surface. When the object-side connecting surface is connected with a neighboring object-side optical element, the relative surface is out of touch with the neighboring object-side optical element. There is an overlap between the second inner surface and the relative surface along a direction parallel to the optical axis.

Abstract: A concrete floor hardening agent includes an aluminate, a waterproofing agent, and water. The aluminate is selected from the group consisting of potassium aluminate and sodium aluminate, and is present in an amount ranging from 15 wt % to 65 wt % based on 100 wt % of the concrete floor hardening agent. The waterproofing agent is selected from the group consisting of potassium methyl silicate, sodium methyl silicate, silicone oil, and siloxane, and is present in an amount ranging from 5 wt % to 20 wt % based on 100 wt % of the concrete floor hardening agent.

Abstract: Systems and methods for pattern-based multi-stage deterministic data classification that may reduce processing and memory overhead while providing more accurate data classifications.

Abstract: The present disclosure relates to a compound containing cycloalkyl or haloalkyl, and specifically discloses a compound represented by formula I?, a stereoisomer or a pharmaceutically acceptable salt thereof, a preparation method therefor, a pharmaceutical composition containing the compound, and a use thereof in treating tumors.

Abstract: A semiconductor device includes a first set of nanostructures stacked over a substrate in a vertical direction, and each of the first set of nanostructures includes a first end portion and a second end portion, and a first middle portion laterally between the first end portion and the second end portion. The first end portion and the second end portion are thicker than the first middle portion. The semiconductor device also includes a first plurality of semiconductor capping layers around the first middle portions of the first set of nanostructures, and a gate structure around the first plurality of semiconductor capping layers.

Abstract: The re is provided a fingerprint identification module, including a substrate having a fingerprint identification area and a peripheral area; a photoelectric sensing structure in the fingerprint identification area, and including pixel units; each pixel unit includes a thin film transistor having a gate electrode coupled to a corresponding gate line and a first electrode coupled to a corresponding signal sensing line; the fingerprint identification area includes a photosensitive region, the pixel unit in the photosensitive region further includes a photoelectric sensor including a third electrode, a photosensitive pattern and a fourth electrode which are sequentially stacked along a direction away from the substrate, and the third electrode is coupled to a second electrode of the thin film transistor in the same pixel unit as that where the photoelectric sensor is located; an area ratio of the photoelectric sensor to the pixel unit corresponding thereto ranges from 40% to 90%.

Abstract: A method of recognizing target objects in images obtains a detection image of a target object. A template image is generated according to the target object. The detection image is compared with the template image to obtain a comparison result. Candidate regions of the target object are determined in the detection image according to the comparison result. At least one target region of the target object is obtained from the candidate regions. The method detects target objects in images very rapidly.