Abstract: A semiconductor device comprises a metallization layer, a passivation layer disposed above the metallization layer, a copper redistribution layer disposed on the passivation layer, a second passivation layer disposed on the copper redistribution layer, and a polyimide layer disposed over the second passivation layer. The polyimide layer and the second passivation layer include a continuous gap there-through that exposes a portion of the copper redistribution layer.

Abstract: A camera module includes a unitary element, an optical image lens assembly, a fixed member and a driving member. The unitary element has an object-side opening. The optical image lens assembly is disposed in a containing space and has an optical axis. The fixed member is for accommodating the unitary element and includes a base and a cover, and the cover has a through hole and is connected with the base. The driving member is for driving the unitary element to move relative to the fixed member. The unitary element includes a reverse inclined structure including at least two annular concave structures. The at least two annular concave structures are arranged in order from the object-side opening to an image side, wherein a sectional surface of each of the annular concave structures passing through the optical axis includes a valley point and two concave ends.

Abstract: An imaging lens assembly module includes an imaging lens element set, a lens carrier and a light blocking structure. The imaging lens element set has an optical axis. At least one lens element of the lens elements is disposed in the lens carrier. The light blocking structure includes a light blocking opening. The optical axis passes through the light blocking opening, and the light blocking opening includes at least two arc portions and a shrinking portion. Each of the arc portions has a first curvature radius for defining a maximum diameter of the light blocking opening. The shrinking portion is connected to the arc portions for forming the light blocking opening into a non-circular shape. The shrinking portion includes at least one protruding arc which extends and shrinks gradually from the shrinking portion to the optical axis, and the protruding arc has a second curvature radius.

Abstract: A calculation method for an annual average loss of an external substructure reinforcement system based on interfacial shear stresses is provided. The calculation method includes: step 1: establishing a deterministic model for an external substructure reinforcement system, and generating seismic ground motion samples and structural samples by random sampling; establishing a probabilistic hazard model based on the seismic ground motion samples; generating a probabilistic vulnerability model based on interfacial shear stresses; establishing a total probabilistic loss expectation model by different seismic ground motion intensity levels; and using the total probabilistic loss expectation model to obtain an annual average probabilistic seismic loss of the external substructure reinforcement system based on the interfacial shear stresses. The calculation method can realize classified calculations of the seismic loss of the external substructure reinforcement system.

Abstract: A semiconductor device comprises a metallization layer, a passivation layer disposed above the metallization layer, a copper redistribution layer disposed on the passivation layer, a second passivation layer disposed on the copper redistribution layer, and a polyimide layer disposed over the second passivation layer. The polyimide layer and the second passivation layer include a continuous gap there-through that exposes a portion of the copper redistribution layer.

Abstract: An apparatus is provided. The apparatus includes a wafer storage device having an inlet through which a gas flows into a wafer storage chamber of the wafer storage device. A first portion of the gas exits the wafer storage chamber of the wafer storage device through an outlet of the wafer storage device. A second portion of the gas exits the wafer storage chamber of the wafer storage device through one or more discontinuities of the wafer storage device to a space external to the wafer storage device. The apparatus includes an exhaust device arranged relative to the wafer storage device to conduct a measure of the second portion of the gas away from the space.

Abstract: In a method, a wafer is bonded to a first carrier. The wafer includes a semiconductor substrate, and a first plurality of through-vias extending into the semiconductor substrate. The method further includes bonding a plurality of chips over the wafer, with gaps located between the plurality of chips, performing a gap-filling process to form gap-filling regions in the gaps, bonding a second carrier onto the plurality of chips and the gap-filling regions, de-bonding the first carrier from the wafer, and forming electrical connectors electrically connecting to conductive features in the wafer. The electrical connectors are electrically connected to the plurality of chips through the first plurality of through-vias.

Abstract: Disclosed is a method for manufacturing an image sensor module. The method comprises the steps of: disposing a glass cover on a substrate; sawing the glass cover into a plurality of glass units; forming an individual solidified interface filler between the adjacent glass units; sawing along the centerline of each solidified interface filler to form a plurality of independent electronic semi-finished products for complementary metal oxide semiconductor image sensor (CMOS Image Sensor, CIS) packaging; and performing an image sensor molded ball grid array (ImBGA) process to obtain the image sensor module.

Abstract: The present invention provides an image sensor module, including an integrated circuit substrate, an image sensing chip, a cover plate and an encapsulating material. The image sensing chip is disposed on the integrated circuit substrate. The image sensing chip includes an image sensing area and a non-image sensing area. A dam is disposed between the cover plate and the non-image sensing area of the image sensing chip. The cover plate includes a transparent material and a cushioning material. The encapsulating material covers the periphery of the image sensing chip, the periphery of the dam, part of the integrated circuit substrate and the periphery of the cover plate. The cushioning material is disposed between the transparent material and the dam and between the transparent material and the encapsulating material. The present invention reduces the possibility that the encapsulating material will peel off the cover plate.

Abstract: An image generation method obtains an original image. A character area, a background area, and a position of each flawless character in the original image are determined. The character area is segmented to obtain a first image of each flawless character. A background is removed from the first image to obtain a second image. First image processing is performed on the second image to obtain a third image. Second image processing is performed on the second image to obtain fourth images. Third image processing is performed on the fourth images respectively to obtain fifth images. A similarity between each fifth image and the third image is calculated. When the similarity is greater than a defect threshold, a background image is segmented. Brightness of the background image is adjusted. The target fourth image and adjusted background image are synthesized. The method can generate images with defective characters quickly.

Abstract: A method and system for optimizing optical flow for images based on a residual field and a displacement field are provided. The method includes: obtaining reference images; estimating an initial optical flow field from the reference images by using an optical flow estimation method; obtaining an optical flow optimization model, where the optical flow optimization model includes an image encoder, an optical flow encoder, a first decoder, and a sub-decoder; inputting any image of the reference images and the initial optical flow field into the optical flow optimization model to output the residual field and the displacement field; superimposing the initial optical flow field and the residual field to obtain a preliminarily optimized optical flow field; and resampling the preliminarily optimized optical flow field by using the displacement field to obtain an optimized optical flow field.

Abstract: An imaging lens assembly has an optical axis, and includes a plurality of optical elements. The optical axis passes through the optical elements, and the optical elements include a radial reduction lens element and a radial reduction light blocking element. The radial reduction lens element includes an optical effective portion and a peripheral portion. The peripheral portion is disposed around the optical effective portion along a circumferential direction of the optical axis. The radial reduction light blocking element includes a central opening and a radial reduction part. The optical axis passes through the central opening. The radial reduction part is reduced towards the optical axis along a direction vertical to the optical axis, so that the central opening is non-circular. The radial reduction part includes a plurality of light blocking structures. The light blocking structures are arranged along the direction vertical to the optical axis.

Abstract: An online pairing method and a computer-readable storage medium are proposed. The online pairing method may be applied to a signal source device and a display device. The signal source device may output a display signal to the display device for display. The method may include dual-channel connection, transmitter sending identity identification information, receiver entering pairing mode, transmitter entering pairing mode, receiver sending online information, and communication connection. Various embodiments can make online pairing and its usage easy, and can improve user experience.

Abstract: A lumbar support assembly, a backrest assembly, and a method for manufacturing a lumbar support assembly are provided. The lumbar support assembly includes a plate member configured to flex and conform to a lumbar region of a user, the plate member includes a mesh structure including a plurality of interconnected elements. The interconnected elements define a plurality of Y-shaped voids therebetween, and each interconnected element includes an edge portion thinner than a center portion. The lumbar support assembly also includes a frame member supporting the plate member.

Abstract: An integral reinforcement design method of an external frame-brace based on a random capability spectrum is provided, and the reinforcement design method includes: evaluating an original structure before reinforcement by using a random capability spectrum method; performing a reinforcement analysis on an external frame-brace sub structure by using the random capability spectrum method to obtain a reinforced structure; and performing a reinforcement verification on the reinforced structure by using the random capability spectrum method. A performance based integral reinforcement design of the external frame-brace sub structure is achieved through considering uncertain factors, as well as capability spectrums and demand spectrums before and after the reinforcement, and converting the integral structure to equivalent single degree of freedom to obtain performance points.

Abstract: A two-stage filter is provided. A first stage filter performs a first stage filtering operation on an initial signal to adjust a frequency of the initial signal to output a first filtered signal. A second stage filter is connected to the first stage filter. The second stage filter performs a second stage filtering operation on the first filtered signal to filter an interference component that is generated during the first stage filtering operation from the first filtered signal to output a second filtered signal.

Abstract: An optical imaging module includes an imaging lens assembly, an optical path folding element, and a light-blocking element. The imaging lens assembly includes at least one optical lens element. The optical path folding element is disposed at an image side of the imaging lens assembly, and the optical path folding element has a light incident surface, a light exiting surface, and at least one optical reflective surface. The light-blocking element is disposed opposite to the at least one optical reflective surface, and the light-blocking element includes an interval area that maintains a distance from the optical path folding element. The at least one optical reflective surface is an optical total reflection surface configured to totally internally reflect imaging light of the optical imaging module in the optical path folding element. The interval area of the light-blocking element and the optical total reflection surface form an air slit therebetween.

Abstract: An imaging lens assembly module includes an imaging lens element set, a lens carrier and a light blocking structure. The imaging lens element set has an optical axis. At least one lens element of the lens elements is disposed in the lens carrier. The light blocking structure includes a light blocking opening. The optical axis passes through the light blocking opening, and the light blocking opening includes at least two arc portions and a shrinking portion. Each of the arc portions has a first curvature radius for defining a maximum diameter of the light blocking opening. The shrinking portion is connected to the arc portions for forming the light blocking opening into a non-circular shape. The shrinking portion includes at least one protruding arc which extends and shrinks gradually from the shrinking portion to the optical axis, and the protruding arc has a second curvature radius.

Abstract: An imaging lens element assembly includes a dual molded lens element. The dual molded lens element includes a transparent portion, a light absorbing portion and a step structure. The transparent portion, in order from a center to a peripheral region, includes an optical effective area and a transparent peripheral area, wherein an optical axis of the imaging lens element assembly passes through the optical effective area, and the transparent peripheral area surrounds the optical effective area. The light absorbing portion surrounds the optical effective area and is disposed on an object side of the transparent peripheral area and includes an object-end surface and an outer inclined surface. The object-end surface faces towards an object side of the light absorbing portion, and the outer inclined surface extends from the object-end surface to an image side of the light absorbing portion and is gradually far away from the optical axis.

Abstract: Provided are a concrete pouring guiding device and a construction method for pouring a concrete tank wall of a sewage treatment tank, wherein the concrete pouring guiding device includes a guiding element and a mounting seat configured to be fixed on an external mounting position; the guiding element is threadedly engaged with the mounting seat, so as to enable the guiding element to move in a first direction with respect to the mounting seat; in the first direction, one end of the guiding element is configured to allow concrete to flow into the guiding element, and the other end of the guiding element is configured to extend to a target position; and the first direction is a length direction of the guiding element.