Abstract: The disclosure provides a method of and an imaging system for clinical sign detection. The method uses an imaging system having an RGB image sensor and the processing device disclosed herein. An image of a patient or examinee is captured by the RGB image sensor to generate an RGB image. Clinical signs of the patient or examinee are detected by the processing device based on the RGB images.

Abstract: A charging system utilizing energy storage multiplication is provided. An energy storage battery pack of the charging system is directly connected to a DC power transmission bus. When the charging request is initiated by the charging device, the charging device takes the power from the DC bus, the AC-DC converter and DC-DC converter connected to the energy generation device work as the energy source to deliver power to the DC bus, the power goes through the DC bus to the charging device, and the rest of the power goes to the energy storage device or goes out form the energy storage device when the charring power is higher than total energy from all other converters. The high C rate discharging of the energy storage device means high power capacity during discharging, this can provide much high power than AC-DC converter to fulfill the requirement of charging device.

Abstract: A method and a system for automatically loading parameters, and a client-end server thereof are provided, and the method and the system, by a reversible information hiding technology, entrain various required parameters in an engineering drawing hiddenly to generate an encrypted file; and then, after decrypting the encrypted file by a pre-stored cipher key, obtain and automatically load the required parameters. Therefore, the parameters can be automatically loaded quickly, accurately and safely.

Abstract: A method of forming a package structure includes an etching step, a laser step, a plating step and a singulation step. In the etching step, a plurality of cutting streets of a leadframe are etched. In the laser step, a plastic package material covering on each of the cutting streets is removed via a laser beam. In the plating step, a plurality of plating surfaces are disposed on a plurality of areas of the leadframe without the plastic package material. In the singulation step, the cutting streets of the leadframe are cut to form the package structure.

Abstract: A synapse system is provided which includes three transistors and a resistance-switching element arranged between two neurons. The resistance-switching element has a resistance value and it is arranged between two neurons. A first transistor is connected between the resistance-switching element and one of the neurons. A second transistor and a third transistor are arranged between the two neurons, and are connected in series which interconnects with the gate of the first transistor. A first input signal is transmitted from one of the neurons to the other neuron through the first transistor. A second input signal is transmitted from one of the neurons to the other neuron through the second transistor and the third transistor. The resistance value of the resistance-switching element is changed based on the time difference between the first input signal and the second input signal.

Abstract: A method of forming a package structure includes an etching step, a laser step, a plating step and a singulation step. In the etching step, a plurality of cutting streets of a leadframe are etched. In the laser step, a plastic package material covering on each of the cutting streets is removed via a laser beam. In the plating step, a plurality of plating surfaces are disposed on a plurality of areas of the leadframe without the plastic package material. In the singulation step, the cutting streets of the leadframe are cut to form the package structure.

Abstract: A charging system utilizing energy storage multiplication is provided. An energy storage battery pack of the charging system is directly connected to a DC power transmission bus. When the charging request is initiated by the charging device, the charging device takes the power from the DC bus, the AC-DC converter and DC-DC converter connected to the energy generation device work as the energy source to deliver power to the DC bus, the power goes through the DC bus to the charging device, and the rest of the power goes to the energy storage device or goes out form the energy storage device when the charring power is higher than total energy from all other converters. The high C rate discharging of the energy storage device means high power capacity during discharging, this can provide much high power than AC-DC converter to fulfill the requirement of charging device.

Abstract: The present disclosure relates to an aerosol delivery device and system, e.g., a smoking substitute device and system. In particular an aerosol delivery device, comprising: a source of power, for providing power to a heater; a first charging connection, for charging the source of power, located at a first end of the aerosol delivery device; and a second charging connection, for charging the source of power.

Abstract: Various embodiments provide a charging device for charging a smoking substitute device, the charging device comprising: a housing having a holder for receiving a smoking substitute device; a charging assembly comprising a first connection interface arranged for connection to the smoking substitute device when the smoking substitute device is received in the holder, and a second connection interface arranged for connection to an external device; wherein the charging assembly is configured to charge the smoking substitute device when the smoking substitute device is connected to the first connection interface, and to charge the external device when the external device is connected to the second connection interface.

Abstract: A package structure includes a leadframe, a semiconductor die and a plastic package material. The leadframe includes a die pad and a plurality of leads. The leads are disposed on four peripheral regions of the die pad, and each of the leads includes a main body, at least one extending portion and a plurality of plating surfaces. The extending portion is connected to the main body, and the main body and the extending portion are integrally formed. The plating surfaces are disposed on the main body and the extending portion. The semiconductor die is disposed on the die pad of the leadframe. The plastic package material is disposed on the leadframe. The main body and the extending portion of each of the leads protrude a peripheral region of the plastic package material.

Abstract: A reliability evaluation method for a multi-state distributed network system is provided. The network system includes a network topology of Internet of Things (IoT) devices, edge servers, cloud servers, transmission nodes and transmission arcs. The capacity of the transmission arc is regarded as a random multi-state. The data generated by the IoT devices are transmitted to the edge servers. After processing and compression by the edge servers, the data are transmitted to the cloud servers for calculation. System reliability is defined as the probability that a specific amount of data can be successfully transferred from the IoT devices to the cloud servers. Algorithms are used to calculate the transmission mechanism between the IoT devices, the edge servers, and the cloud servers, evaluate the quality and reliability of multi-state distributed network systems, and further serve as an indicator of system management. Sensitivity analysis is also used to improve quality.

Abstract: A reliability evaluation method for a multi-state distributed network system is provided. The network system includes a network topology of Internet of Things (IoT) devices, edge servers, cloud servers, transmission nodes and transmission arcs. The capacity of the transmission arc is regarded as a random multi-state. The data generated by the IoT devices are transmitted to the edge servers. After processing and compression by the edge servers, the data are transmitted to the cloud servers for calculation. System reliability is defined as the probability that a specific amount of data can be successfully transferred from the IoT devices to the cloud servers. Algorithms are used to calculate the transmission mechanism between the IoT devices, the edge servers, and the cloud servers, evaluate the quality and reliability of multi-state distributed network systems, and further serve as an indicator of system management. Sensitivity analysis is also used to improve quality.

Abstract: A resistive memory apparatus including a memory cell array, at least one dummy transistor and a control circuit is provided. The memory cell array includes a plurality of memory cells. Each of the memory cells includes a resistive switching element. The dummy transistor is electrically isolated from the resistive switching element. The control circuit is coupled to the memory cell array and the dummy transistor. The control circuit is configured to provide a first bit line voltage, a source line voltage and a word line voltage to the dummy transistor to drive the dummy transistor to output a saturation current. The control circuit is further configured to determine a value of a second bit line voltage for driving the memory cells according to the saturation current. In addition, an operating method and a memory cell array of the resistive memory apparatus are also provided.

Abstract: Disclosed are gaming systems, methods and machines for a gaming cabinet configuration. In particular, the gaming systems, methods and machines may incorporate gaming cabinets that include one or more curved or arcuate screens, one or more candles integrated into the gaming cabinet, and/or one or more diffuse lighting elements to provide lighting features or effects.

Abstract: A partial pressure tool for real-time measurement and adjustment of pressure and viscosity and a measurement method thereof. The partial pressure tool includes an outer cylinder and adjustable annular throttling grooves, and the adjustable annular throttling grooves are split-type grooves vertically and successively installed on an inner wall of the outer cylinder at equal intervals. Four single throttling grooves are adjacent to each other and arranged concentrically on a circumferential surface. A viscometer is installed on a surface of an arc-shaped inner plate in a tail-end adjustable annular throttling groove. The viscometer is connected to an induction board through a transmission line. The arc-shaped inner plate in the tail-end adjustable annular throttling groove is provided with a pressure sensor and a torque sensor, and the pressure sensor and the torque sensor both are connected to the induction board. The induction board is connected to a DSP control module.

Abstract: An electronic device is disclosed, which includes a first substrate structure, a flexible substrate and a first recess. The flexible substrate is disposed on the first substrate structure. The first recess is disposed on a first surface of the flexible substrate, and the first surface is close to the first substrate structure, wherein the first recess at least overlaps the first substrate structure.