Abstract: A vehicle-mounted air compressor includes an air compressor main body and a bottle cap assembly including bottle cap and sealing and flow guiding components. The bottle cap component is at the air compressor main body, has air inlet/outlet openings, and connected to the air compressor main body via the air inlet opening. The sealing and flow guiding component is at the bottle cap component and includes sealing and flow guiding portions, the former surrounding the latter, and the latter covering the air inlet opening and having at least one air inlet hole and an air outlet hole and connected to the air inlet opening via the air inlet hole and connected to the air outlet opening via the air outlet hole. An airflow from the air compressor main body passes through the air inlet opening, the air inlet hole, the air outlet hole, and the air outlet opening in sequence.

Abstract: The present disclosure, in some embodiments, relates to method. The method includes bonding a second wafer to a first wafer to form a multi-dimensional integrated chip structure. A first edge trimming cut is performed at a first lateral distance from a central region of the multi-dimensional integrated chip structure. A second edge trimming cut is performed at a second lateral distance from the central region of the multi-dimensional integrated chip structure. The second lateral distance is larger than the first lateral distance.

Abstract: A tire repairing device includes a box, an air supply source, and a glue applicator for inflating or applying glue to a tire. The glue applicator includes a tank having a receiving room for holding the glue, a cover having a circular pipe, an outlet pipe, and an air entrance pipe, and a middle pipe having a pair of sealing sections and a neck section therebetween. The outlet pipe and the air entrance pipe extend from the circular pipe respectively and communicate therewith. The air supply source is connected to the air entrance pipe and provides air thereto. The middle pipe is movably disposed in the circular pipe to be coaxially stacked therewith. An outer diameter of the neck section is less than the sealing section. The sealing section abuts against an inner wall of the circular pipe, and there is a gap therebetween for the air to pass.

Abstract: A tire repairing device includes a box, an air supply source, and a glue applicator for inflating or applying glue to a tire. The glue applicator includes a tank having a receiving room for holding the glue, a cover having a circular pipe, an outlet pipe, and an air entrance pipe, and a middle pipe having a pair of sealing sections and a neck section therebetween. The outlet pipe and the air entrance pipe extend from the circular pipe respectively and communicate therewith. The air supply source is connected to the air entrance pipe and provides air thereto. The middle pipe is movably disposed in the circular pipe to be coaxially stacked therewith. An outer diameter of the neck section is less than the sealing section. The sealing section abuts against an inner wall of the circular pipe, and there is a gap therebetween for the air to pass.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a first substrate having a first horizontally extending surface and a second horizontally extending surface above the first horizontally extending surface as viewed in a cross-sectional view. The first horizontally extending surface continuously wraps around an outermost perimeter of the second horizontally extending surface in a closed loop as viewed in a plan-view. A second substrate is disposed over the first substrate and includes a third horizontally extending surface above the second horizontally extending surface as viewed in the cross-sectional view. The second horizontally extending surface continuously wraps around an outermost perimeter of the third horizontally extending surface in a closed loop as viewed in the plan-view.

Abstract: A vehicle-mounted air compressor includes an air compressor main body and a bottle cap assembly. The bottle cap assembly includes a bottle cap component and at least one fastening component. The bottle cap component is installed on the air compressor main body and has an air inlet end and an air outlet end connected to each other, and the bottle cap component is inserted to the air compressor main body through the air inlet end along an inserting direction. An air flow from the air compressor main body is adapted to pass through the air inlet end and the air outlet end in sequence. The fastening component fastens the bottle cap component to the air compressor main body along a fastening direction. The fastening direction is the same as the inserting direction.

Abstract: A vehicle-mounted air compressor includes an air compressor main body and a bottle cap assembly including bottle cap and sealing and flow guiding components. The bottle cap component is at the air compressor main body, has air inlet/outlet openings, and connected to the air compressor main body via the air inlet opening. The sealing and flow guiding component is at the bottle cap component and includes sealing and flow guiding portions, the former surrounding the latter, and the latter covering the air inlet opening and having at least one air inlet hole and an air outlet hole and connected to the air inlet opening via the air inlet hole and connected to the air outlet opening via the air outlet hole. An airflow from the air compressor main body passes through the air inlet opening, the air inlet hole, the air outlet hole, and the air outlet opening in sequence.

Abstract: A thin-film deposition system includes a top plate positioned above a wafer and configured to generate a plasma during a thin-film deposition process. The system includes a gap sensor configured to generate sensor signals indicative of a gap between the wafer and the top plate. The system includes a control system configured to adjust the gap during the thin-film deposition process responsive to the sensor signals.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a substrate having an image sensor region arranged between sidewalls of the substrate that form one or more trenches. One or more dielectric materials are arranged along the sidewalls of the substrate that form the one or more trenches. A reflective region is disposed within the one or more trenches and laterally surrounded by the one or more dielectric materials. The reflective region includes a plurality of reflective portions that are arranged at different vertical positions within the reflective region and that have different reflective properties.

Abstract: A method for manufacturing a semiconductor structure is provided. The method includes the operations as follows. A first opening is formed at a surface of a semiconductor substrate to expose a portion of an isolation region embedded in the semiconductor substrate. A buffer layer is formed over the surface of the semiconductor substrate and lining the first opening. A second opening is formed at a bottom of the first opening. A barrier layer is formed over the surface of the semiconductor substrate. A conductive pad is formed in the first and the second openings. The barrier layer includes an upper portion in contact with the buffer layer in the first opening and a lower portion lining the second opening. The lower portion of the barrier layer is free from surrounded by the buffer layer. A method for manufacturing a BSI image sensor is also provided.

Abstract: The present disclosure for wafer bonding, including forming an epitaxial layer on a top surface of a first wafer, forming a sacrificial layer over the epitaxial layer, trimming an edge of the first wafer, removing the sacrificial layer, forming an oxide layer over the top surface of the first wafer subsequent to removing the sacrificial layer, and bonding the top surface of the first wafer to a second wafer.

Abstract: An air stop sheet of a piston of a cylinder, the piston is accommodated in an air compressor, and an air stop sheet is accommodated on a head of the piston. The air stop sheet includes a bending section having a positioning zone and an acting zone and configured to be a boundary line of the acting zone and the positioning zone. The acting zone backing the cylinder turns on relative to the plane of the head at an open angle ?, thus producing an air flowing space. A piston rod extends downward from the head and includes a cavity, an air conduit, a column, and a spring configured to abut against the acting zone of the air stop sheet. The air stop sheet is pushed by the spring to turn on at an open angle ?, and the air conduit and the air channel communicate with atmosphere.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a substrate having a pixel region arranged between one or more trenches formed by sidewalls of the substrate. One or more dielectric materials are arranged along the sidewalls of the substrate forming the one or more trenches. A conductive material is disposed within the one or more trenches. The conductive material is electrically coupled to an interconnect disposed within a dielectric arranged on the substrate.

Abstract: A semiconductor structure includes: a semiconductor substrate arranged over a back end of line (BEOL) metallization stack, and including a scribe line opening; a conductive pad having an upper surface that is substantially flush with an upper surface of the semiconductor substrate, the conductive pad including an upper conductive region and a lower conductive region, the upper conductive region being confined to the scribe line opening substantially from the upper surface of the semiconductor substrate to a bottom of the scribe line opening, and the lower conductive region protruding downward from the upper conductive region, through the BEOL metallization stack; a passivation layer arranged over the semiconductor substrate; and an array of pixel sensors arranged in the semiconductor substrate adjacent to the conductive pad.

Abstract: Various embodiments of the present disclosure are directed towards a pixel sensor. The pixel sensor includes a substrate having a front-side opposite a back-side. An image sensor element comprises an active layer disposed within the substrate, where the active layer comprises germanium. An anti-reflective coating (ARC) structure overlies the back-side of the substrate. The ARC structure includes a first dielectric layer overlying the back-side of the substrate, a second dielectric layer overlying the first dielectric layer, and a third dielectric layer overlying the second dielectric layer. A first index of refraction of the first dielectric layer is less than a second index of refraction of the second dielectric layer, and a third index of refraction of the third dielectric layer is less than the first index of refraction.

Abstract: A thin-film deposition system includes a top plate positioned above a wafer and configured to generate a plasma during a thin-film deposition process. The system includes a gap sensor configured to generate sensor signals indicative of a gap between the wafer and the top plate. The system includes a control system configured to adjust the gap during the thin-film deposition process responsive to the sensor signals.