Abstract: An air compressor is received in an accommodation box and contains a body, a cylinder, a motor, and a transmission mechanism. The body includes a first positioning orifice and a second positioning orifice. The cylinder is connected on the body and communicates with an air storage holder. The motor is fixed on the body, a small gear is received in the first positioning orifice, and a connection seat is accommodated in the first orifice. The transmission mechanism actuates a piston to move in the cylinder reciprocately so as to produce compressed airs. The motor includes at least one locking extension for engaging the motor with the body, hence the motor is fixed on the body securely without using any screws.

Abstract: A staining kit is provided, including a first pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, CD8, CD45, and CTLA4; a second pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, dendritic cell, and CD45; a third pattern including antibodies against T cell, B cell, NK cell, monocyte, CD8, CD45, CD45RA, CD62L, CD197, CX3CR1 and TCR??; and a fourth pattern including antibodies against B cell, CD23, CD38, CD40, CD45 and IgM, wherein the antibodies of each pattern are labeled with fluorescent dyes. A method of identifying characterized immune cell subsets of a disease and a method of predicting the likelihood of NPC in a subject in the need thereof using the staining kit are also provided.

Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: An air compressor is received in an accommodation box and contains a body, a cylinder, a motor, and a transmission mechanism. The body includes a first positioning orifice and a second positioning orifice. The cylinder is connected on the body and communicates with an air storage holder. The motor is fixed on the body, a small gear is received in the first positioning orifice, and a connection seat is accommodated in the first orifice. The transmission mechanism actuates a piston to move in the cylinder reciprocately so as to produce compressed air. The motor includes at least one locking extension for engaging the motor with the body. A first end of a respective one locking extension extends from the motor, and a second end of the respective one locking extension is engaged on the body, hence the motor is fixed on the body securely without using any screws.

Abstract: A fixing device of a motor of an air compressor contains: a body, a cylinder, a motor, a transmission mechanism, and at least one retainer. The body includes a first positioning orifice and a second positioning orifice. The cylinder is connected on the body. The motor is fixed on the body, a small gear is received in the first positioning orifice and is connected on the motor, and a connection seat of the motor is accommodated in the first orifice. The transmission mechanism actuates a piston to move in the cylinder reciprocately. The at least one retainer is configured to fix the body and the motor. A first end of at least one retainer is engaged on the body, and a second end of the at least one retainer is engaged on the motor so that the motor is fixed on the body without using any screws.

Abstract: A piston of an air compressor, the air compressor including the piston actuated by a motor to move upward and downward in a cylinder. The piston contains a head accommodating an air stop sheet which has a first bending section being a boundary line of an acting area and a positioning zone of the air stop sheet. The acting zone has a noncircular spacing groove configured to separate an external portion and a circular portion, a neck, and a second bending section, such that an axial line between the circular portion and the external portion is the second bending section at an obtuse angle less than 180 degrees, and the second bending section is defined between a bottom of the circular portion and a top of the external portion at an acute angle ?2.

Abstract: An air compressor is received in an accommodation box and contains a body, a cylinder, a motor, and a transmission mechanism. The body includes a first positioning orifice and a second positioning orifice. The cylinder is connected on the body and communicates with an air storage holder. The motor is fixed on the body, a small gear is received in the first positioning orifice, and a connection seat is accommodated in the first orifice. The transmission mechanism actuates a piston to move in the cylinder reciprocately so as to produce compressed air. The motor includes at least one locking extension for engaging the motor with the body. A first end of a respective one locking extension extends from the motor, and a second end of the respective one locking extension is engaged on the body, hence the motor is fixed on the body securely without using any screws.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric capping structure is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.

Abstract: Various embodiments of the present disclosure are directed towards a pixel sensor. The pixel sensor includes a substrate having a front-side opposite a back-side. An image sensor element comprises an active layer disposed within the substrate, where the active layer comprises germanium. An anti-reflective coating (ARC) structure overlies the back-side of the substrate. The ARC structure includes a first dielectric layer overlying the back-side of the substrate, a second dielectric layer overlying the first dielectric layer, and a third dielectric layer overlying the second dielectric layer. A first index of refraction of the first dielectric layer is less than a second index of refraction of the second dielectric layer, and a third index of refraction of the third dielectric layer is less than the first index of refraction.

Abstract: An air compressor contains a piston actuated by a motor to move in a cylinder. The piston includes an air stop sheet mounted on a top support plate thereof. The air stop sheet includes a bending section having a positioning zone and an acting zone located opposite to the positioning zone and configured to cover an air channel of the piston. The bending section is a boundary axis of the acting area and the positioning zone of the air stop sheet so that a top of the air stop sheet facing the cylinder forms an obtuse angle less than 180 degrees, and a back surface of the acting zone of the air stop sheet backing a top of the cylinder turns on relative to a plane of a top of the top support plate at an open angle ?, thus producing an air flowing space.

Abstract: A device and method for fabricating the same is disclosed. For example, the device includes a sensor having a front side and a back side, a metal interconnect layer formed on the front side of the sensor, an anti-reflective coating formed on the back side of the sensor, a composite etch stop mask layer formed on the anti-reflective coating. wherein the composite etch stop mask layer includes a silicon nitride layer and a stressed layer. A percentage of Si—H bonds in the silicon nitride layer is greater than a percentage of Si—H bonds in the stressed layer.

Abstract: A piston of an air compressor contains at least one fixing bolt configured to fix a plane of a top of a head of the piston to at least one air stop sheet. A respective one of the at least one air stop sheet includes at least one bending section and at least one acting zone surrounding the at least one bending section and configured to cover at least one air orifice. A back surface of the at least one acting zone of the respective one air stop sheet moves away from the plane of the top of the head at an open angle ?, thus producing an air flowing space. A pressure of a cylinder balances with atmosphere, and the piston is not stopped by a back-pressure resistance to move smoothly in upward and downward moving strokes after the air stop sheet moves again.

Abstract: A semiconductor structure includes: a semiconductor substrate arranged over a back end of line (BEOL) metallization stack, and including a scribe line opening; a conductive pad having an upper surface that is substantially flush with an upper surface of the semiconductor substrate, the conductive pad including an upper conductive region and a lower conductive region, the upper conductive region being confined to the scribe line opening substantially from the upper surface of the semiconductor substrate to a bottom of the scribe line opening, and the lower conductive region protruding downward from the upper conductive region, through the BEOL metallization stack; a passivation layer arranged over the semiconductor substrate; and an array of pixel sensors arranged in the semiconductor substrate adjacent to the conductive pad.

Abstract: The present disclosure, in some embodiments, relates to an integrated chip structure. The integrated chip structure includes a substrate and an interconnect structure on the substrate. The interconnect structure includes a plurality of interconnects disposed within a dielectric structure. A dielectric protection layer is along a sidewall of the interconnect structure and along a sidewall and a recessed surface of the substrate. A bottommost surface of the dielectric protection layer rests on the recessed surface of the substrate.

Abstract: An air compressor contains: a body, a cylinder, a motor, and a transmission mechanism. The body includes multiple positioning orifices which are a first positioning orifice and a second positioning orifice. The cylinder is connected on the body and communicates with an air storage holder. The motor is fixed on the body, a small gear is received in the first positioning orifice, and a connection seat of the motor is accommodated in the first orifice. The transmission mechanism actuates the piston to move in the cylinder reciprocately so as to produce compressed airs. The motor further includes multiple fixing portions extending from a head edge of the casing thereof and configured to engage with the body, thus fixing the motor on the body securely without using any screws.

Abstract: The present disclosure, in some embodiments, relates to an image sensor integrated chip. The image sensor integrated chip includes a substrate having a pixel region arranged between one or more trenches formed by sidewalls of the substrate. One or more dielectric materials are arranged along the sidewalls of the substrate forming the one or more trenches. A conductive material is disposed within the one or more trenches. The conductive material is electrically coupled to an interconnect disposed within a dielectric arranged on the substrate.

Abstract: A piston of an air compressor is actuated by a motor to move in a cylinder. The piston includes a head, an air stop sheet having a first bending section which is a boundary line of an acting area and a positioning zone of the air stop sheet, and a back surface of the acting zone backing the top of the cylinder bends relative to a plane of a top of the head at an open angle. The acting zone has a noncircular spacing groove, a neck, and a second bending section. The head includes a piston rod having a cavity, an air conduit, a column, and a spring. The air stop sheet is forced by the spring to locate in the acting zone backing the cylinder and a plane of a top of the head at an open angle.

Abstract: In some embodiments, the present disclosure relates to an image sensor. The image sensor comprises a substrate. A photodetector is in the substrate and includes a semiconductor guard ring extending into a first side of the substrate. A shallow trench isolation (STI) structure extends into the first side of the substrate. An outer isolation structure extends into a second side of the substrate, opposite the first side of the substrate, to the STI structure. The STI structure and the outer isolation structure laterally surround the photodetector. An inner isolation structure extends into the second side of the substrate and overlies the photodetector. The inner isolation structure is vertically separated from the photodetector by the substrate. Further, the outer isolation structure laterally surrounds the inner isolation structure.

Abstract: A device and method for fabricating the same is disclosed. For example, the device includes a sensor having a front side and a back side, a metal interconnect layer formed on the front side of the sensor, an anti-reflective coating formed on the back side of the sensor, a composite etch stop mask layer formed on the anti-reflective coating wherein the composite etch stop mask layer includes a hydrogen rich layer and a compressive high density layer, and a light filter formed on the composite etch stop mask layer.