Patents by Inventor Cheng-Hsien Chou

Cheng-Hsien Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Backlight module and display device
    Publication number: 20210389629
    Abstract: A backlight module includes a back plate, an optical element set, a wavelength conversion film, a light source, and an ink layer. The optical element set is disposed on the back plate and has a first surface, a second surface and at least one end surface. The first surface faces the back plate and is opposite to the second surface. The at least one end surface is connected to the first surface and the second surface. The wavelength conversion film is disposed on the back plate. The light source is adapted to provide light, and the light is transmitted to the wavelength conversion film and the optical element set. The ink layer is disposed on the at least one end surface of the optical element set. A display device is further provided. The backlight module and the display device may reduce the phenomenon of blue edge caused by light leakage.
    Type: Application
    Filed: May 31, 2021
    Publication date: December 16, 2021
    Inventors: TA-HSIANG CHIU, WEI-HSUAN CHENG, CHENG-HSIEN CHOU, CHEN-HUNG LIN
  • TECHNIQUES FOR WAFER STACK PROCESSING
    Publication number: 20210384078
    Abstract: The present disclosure, in some embodiments, relates to a multi-dimensional integrated chip structure. The multi-dimensional integrated chip structure includes a first substrate having a first upper surface and a second upper surface above the first upper surface. A first outermost perimeter of the first upper surface is larger than a second outermost perimeter of the second upper surface. A second substrate is over the first substrate. The second substrate has a third upper surface above the second upper surface. A third outermost perimeter of the third upper surface is smaller than the second outermost perimeter of the second upper surface.
    Type: Application
    Filed: August 19, 2021
    Publication date: December 9, 2021
    Inventors: Yung-Lung Lin, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Hau-Yi Hsiao
  • Connection structure for motor of air compressor
    Patent number: 11193475
    Abstract: A connection structure for a motor of an air compressor contains: a base, a cylinder, a motor, and a transmission mechanism. The base includes a first positioning orifice and a second positioning orifice. The cylinder includes an air storage seat. A small-diameter gear is inserted through the first positioning orifice to fit on the motor, a bearing housing is accommodated in the first positioning orifice, and the motor includes a magnetic coil. The transmission mechanism actuates a piston to move in the cylinder reciprocately so as to compress air. The magnetic coil includes a first segment and a second segment, and the base includes two symmetrical elongated plates which respectively have two hooks. The base further includes two symmetrical arcuate retainers.
    Type: Grant
    Filed: December 8, 2019
    Date of Patent: December 7, 2021
    Inventors: Wen-San Chou, Cheng-Hsien Chou
  • Semiconductor structure and manufacturing method thereof
    Patent number: 11189583
    Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure comprises a semiconductive substrate and an interconnect structure over the semiconductive substrate. The semiconductor structure also comprises a bond pad in the semiconductive substrate and coupled to the metal layer. The bond pad comprises two conductive layers.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: November 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Sheng-Chau Chen, Shih-Pei Chou, Ming-Che Lee, Kuo-Ming Wu, Cheng-Hsien Chou, Cheng-Yuan Tsai, Yeur-Luen Tu
  • METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
    Publication number: 20210358740
    Abstract: The present disclosure for wafer bonding, including forming an epitaxial layer on a top surface of a first wafer, forming a sacrificial layer over the epitaxial layer, trimming an edge of the first wafer, removing the sacrificial layer, forming an oxide layer over the top surface of the first wafer subsequent to removing the sacrificial layer, and bonding the top surface of the first wafer to a second wafer.
    Type: Application
    Filed: July 30, 2021
    Publication date: November 18, 2021
    Inventors: YUNG-LUNG LIN, HAU-YI HSIAO, CHIH-HUI HUANG, KUO-HWA TZENG, CHENG-HSIEN CHOU
  • Check structure for connection of air nozzle of tire and connection hose of air compressor
    Patent number: 11149892
    Abstract: A check structure for a connection of an air nozzle of a tire and a connection hose of an air compressor, the air compressor contains: a box, a sealant supply can, and a connection hose. The box includes a body of the air compressor. The sealant supply can includes an open segment and a supply tube. The connection hose includes a first segment and a second segment. The second segment has a check connector which includes a fitting sleeve, and the fitting sleeve has a threaded orifice, a through orifice, and a projected shoulder. A cylindrical base includes a hollow room, a stepped coupling segment, a conduit, and a tilted fence. A valve bolt includes a post, a connecting disc, multiple peripheral channels, a neck, multiple spaced slots, and a seal ring. A first spring is received into the conduit from the stepped coupling segment of the cylindrical base.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: October 19, 2021
    Inventors: Wen-San Chou, Cheng-Hsien Chou
  • Trim wall protection method for multi-wafer stacking
    Patent number: 11152276
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip structure. The method may be performed by forming a plurality of interconnect layers within a first interconnect structure disposed over an upper surface of a first semiconductor substrate. An edge trimming process is performed to remove parts of the first interconnect structure and the first semiconductor substrate along a perimeter of the first semiconductor substrate. The edge trimming process results in the first semiconductor substrate having a recessed surface coupled to the upper surface by way of an interior sidewall disposed directly over the first semiconductor substrate. A dielectric protection layer is formed onto a sidewall of the first interconnect structure after performing the edge trimming process.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: October 19, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Chan Li, Cheng-Hsien Chou, Sheng-Chau Chen, Cheng-Yuan Tsai, Kuo-Ming Wu
  • Air compressor capable of inflating air and supplying sealant
    Patent number: 11148376
    Abstract: An air compressor contains: a box in which the air compressor and a sealant supply device are accommodated. The air compressor is configured to produce high-pressure airs, and the sealant supply device has an air inlet pipe and a supply pipe. An air outlet pipe of the air compressor is connected with the air inlet pipe, and the air compressor is detachable from the sealant supply device. The air inlet pipe is configured to receive the high-pressure airs from the air compressor, the supply pipe is configured to output chemical sealant from the sealant supply device, and a tube is configured to communicate the air inlet pipe with the supply pipe. A rotation element includes a driven portion and a central stem. The rotation element is fitted on the second sub-tube. The central stem of the rotation element abuts against a top of the tube.
    Type: Grant
    Filed: July 15, 2020
    Date of Patent: October 19, 2021
    Inventors: Wen-San Chou, Cheng-Hsien Chou
  • Check joint structure for connection of an air nozzle of a tire and a connector of a connection hose of an air compressor
    Patent number: 11143346
    Abstract: A check joint structure for a connection of an air nozzle of a tire and a connector of a connection hose of an air compressor, the air compressor contains: a box, a sealant supply can, and a connection hose. The box includes a body of the air compressor. The sealant supply can includes an open segment and a supply tube. The connection hose includes a first segment and a second segment. The second segment has a check connector which includes a fitting sleeve, and the fitting sleeve has a threaded orifice, a through orifice, and a projected shoulder. A cylindrical base includes a cylindrical room, a stepped coupling segment, a conduit, and a first stepped portion. A first spring is received into the cylindrical room to abut against the first stepped portion. A valve bolt includes a contacting element fitted thereon.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: October 12, 2021
    Inventors: Wen-San Chou, Cheng-Hsien Chou
  • Bonding support structure (and related process) for wafer stacking
    Patent number: 11139210
    Abstract: In some embodiments, a method for bonding semiconductor wafers is provided. The method includes forming a first integrated circuit (IC) over a central region of a first semiconductor wafer. A first ring-shaped bonding support structure is formed over a ring-shaped peripheral region of the first semiconductor wafer, where the ring-shaped peripheral region of the first semiconductor wafer encircles the central region of the first semiconductor wafer. A second semiconductor wafer is bonded to the first semiconductor wafer, such that a second IC arranged on the second semiconductor wafer is electrically coupled to the first IC.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: October 5, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai, Chih-Hui Huang, Kuo-Ming Wu
  • Techniques for wafer stack processing
    Patent number: 11127635
    Abstract: The present disclosure relates to a method for forming a multi-dimensional integrated chip structure. In some embodiments, the method may be performed by bonding a second substrate to an upper surface of a first substrate. A first edge trimming cut is performed along a first loop and extends into a first peripheral portion of the second substrate. A second edge trimming cut is performed along a second loop and extends into a second peripheral portion of the second substrate and into the first substrate. A third edge trimming cut is performed along a third loop and extends into a third peripheral portion of the first substrate.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: September 21, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Lung Lin, Cheng-Hsien Chou, Cheng-Yuan Tsai, Kuo-Ming Wu, Hau-Yi Hsiao
  • ABSORPTION ENHANCEMENT STRUCTURE TO INCREASE QUANTUM EFFICIENCY OF IMAGE SENSOR
    Publication number: 20210272996
    Abstract: Various embodiments of the present disclosure are directed towards an image sensor having a photodetector disposed within a substrate. The substrate has a front-side surface and a back-side surface. An absorption enhancement structure is disposed along the back-side surface of the substrate and overlies the photodetector. The absorption enhancement structure includes a plurality of protrusions that extend outwardly from the back-side surface of the substrate. Each protrusion comprises opposing curved sidewalls.
    Type: Application
    Filed: April 15, 2020
    Publication date: September 2, 2021
    Inventors: Tsun-Kai Tsao, Cheng-Hsien Chou, Jiech-Fun Lu
  • Support device for tire sealant inflator
    Patent number: 11098841
    Abstract: A support device for a tire sealant inflator contains: a C-shaped rib on which two spaced plates are engaged when inflating and supplying sealant into a broken tire, and the tire sealant inflator and the support device are connected so as to exert the tire sealant inflator stably. The support device further contains a base, and the base includes a C-shaped holder formed thereon, an opening defined on a side of the C-shaped holder, and the C-shaped rib extending inward from a top of the C-shaped holder.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: August 24, 2021
    Inventors: Wen-San Chou, Cheng-Hsien Chou
  • Method for manufacturing semiconductor device and manufacturing method of the same
    Patent number: 11087971
    Abstract: The present disclosure provides a method for wafer bonding, including providing a wafer, forming a sacrificial layer on a top surface of the first wafer, trimming an edge of the first wafer to obtain a first wafer area, cleaning the top surface of the first wafer, removing the sacrificial layer, and bonding the top surface of the first wafer to a second wafer having a second wafer area greater than the first wafer area.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: August 10, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yung-Lung Lin, Hau-Yi Hsiao, Chih-Hui Huang, Kuo-Hwa Tzeng, Cheng-Hsien Chou
  • SEMICONDUCTOR STRUCTURE HAVING INTEGRATED INDUCTOR THEREIN
    Publication number: 20210242303
    Abstract: A semiconductor structure includes: a substrate; a first passivation layer over the substrate; a second passivation layer over the first passivation layer; and a magnetic core in the second passivation layer, wherein the magnetic core includes a first magnetic material layer and a second magnetic material layer over the first magnetic material layer, the first magnetic material layer and the second magnetic material layer are separated by a high resistance isolation layer, and the high resistance isolation layer has a resistivity greater than about 1.3 ohm-cm.
    Type: Application
    Filed: April 22, 2021
    Publication date: August 5, 2021
    Inventors: MING-CHE LEE, SHENG-CHAU CHEN, I-NAN CHEN, CHENG-HSIEN CHOU, CHENG-YUAN TSAI
  • SEMICONDUCTOR STRUCTURE, BACK-SIDE ILLUMINATED IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210242252
    Abstract: A semiconductor structure includes: a semiconductor substrate arranged over a back end of line (BEOL) metallization stack, and including a scribe line opening; a conductive pad having an upper surface that is substantially flush with an upper surface of the semiconductor substrate, the conductive pad including an upper conductive region and a lower conductive region, the upper conductive region being confined to the scribe line opening substantially from the upper surface of the semiconductor substrate to a bottom of the scribe line opening, and the lower conductive region protruding downward from the upper conductive region, through the BEOL metallization stack; a passivation layer arranged over the semiconductor substrate; and an array of pixel sensors arranged in the semiconductor substrate adjacent to the conductive pad.
    Type: Application
    Filed: April 21, 2021
    Publication date: August 5, 2021
    Inventors: SHENG-CHAU CHEN, CHENG-HSIEN CHOU, MIN-FENG KAO
  • IMAGE SENSOR SCHEME FOR OPTICAL AND ELECTRICAL IMPROVEMENT
    Publication number: 20210225919
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a photodetector arranged within a substrate. The substrate has surfaces defining one or more protrusions arranged along a first side of the substrate over the photodetector. One or more isolation structures are arranged within one or more trenches defined by sidewalls of the substrate arranged on opposing sides of the photodetector. The one or more trenches extend from the first side of the substrate to within the substrate. The one or more isolation structures respectively include a reflective medium configured to reflect electromagnetic radiation.
    Type: Application
    Filed: April 1, 2021
    Publication date: July 22, 2021
    Inventors: Sheng-Chan Li, Cheng-Hsien Chou, Cheng-Yuan Tsai, Keng-Yu Chou, Yeur-Luen Tu
  • Anti-spray joint structure of connection hose of vehicle air compressor
    Patent number: 11046129
    Abstract: An anti-spray joint structure for a connection of an air nozzle of a tire and a connection hose of an air compressor, the air compressor contains: a box, a sealant supply can, and a connection hose. The box includes a body of the air compressor. The sealant supply can includes an open segment and a supply tube. The connection hose includes a first segment and a second segment. The second segment has an anti-spray connector which includes a fitting sleeve, and the fitting sleeve has a threaded orifice, a through orifice, and a projected shoulder. The cylindrical base includes a cylindrical room, a stepped coupling segment, a conduit, and a first stepped portion. The valve bolt includes a post, a connecting disc, multiple spaced slots, and a first seal ring. A lock element includes at least one tangent plane, a stem, and a hollow cavity.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: June 29, 2021
    Inventors: Wen-San Chou, Cheng-Hsien Chou
  • Anti-spray structure for conention of air nozzle of tire of vehicle and conenction hose of air compressor
    Patent number: 11046128
    Abstract: An anti-spray structure for a connection of an air nozzle of a tire of a vehicle and a connection hose of an air compressor, and the air compressor contains: a box, a sealant supply can, and a connection hose. The box accommodates the air compressor. The sealant supply can includes an open segment and a supply tube. The connection hose includes a first segment and a second segment. The second segment has an anti-spray connector including a fitting sleeve. The fitting sleeve has a threaded orifice, a through orifice, and a projected shoulder. A cylindrical base includes a cylindrical room, a stepped coupling segment, a conduit, and a first stepped portion. A first spring is received into the cylindrical room. A valve bolt includes a post, a connecting disc, spaced slots, and a first seal ring. A lock element includes a hollow cavity, a hexagonal tab, and a tilted extension.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: June 29, 2021
    Inventors: Wen-San Chou, Cheng-Hsien Chou
  • DISPLAY STRUCTURE OF PRESSURE GAUGE OF AIR COMPRESSOR
    Publication number: 20210190623
    Abstract: A display structure of a pressure gauge of an air compressor, the air compressor is received in an accommodation box, and a scale portion of the pressure gauge is viewable via a displaying opening of the accommodation box, the pressure gauge includes a cylindrical body which is transparent and is formed in a pen shape, and the pressure gauge includes a colored O-ring configured to indicate a pressure value of the scale portion. The scale portion is not printed on the cylindrical body of the pressure gauge and includes a transparent panel on which the pressure value of the scale portion is marked on an internal face of the transparent panel, and the internal face faces the cylindrical body of the pressure gauge.
    Type: Application
    Filed: December 7, 2020
    Publication date: June 24, 2021
    Inventors: Wen-San CHOU, Cheng-Hsien CHOU